US20130153178A1 - Heat dissipation device with fan - Google Patents

Heat dissipation device with fan Download PDF

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Publication number
US20130153178A1
US20130153178A1 US13/459,095 US201213459095A US2013153178A1 US 20130153178 A1 US20130153178 A1 US 20130153178A1 US 201213459095 A US201213459095 A US 201213459095A US 2013153178 A1 US2013153178 A1 US 2013153178A1
Authority
US
United States
Prior art keywords
bracket
heat dissipation
dissipation device
fan
clasps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/459,095
Inventor
Shih-Yao Li
Jui-Wen Hung
Ching-Bai Hwang
Wei-Jen Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Technology Co Ltd filed Critical Foxconn Technology Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, WEI-JEN, HUNG, JUI-WEN, HWANG, CHING-BAI, LI, SHIH-YAO
Publication of US20130153178A1 publication Critical patent/US20130153178A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure relates to heat dissipation devices in electronics, and more particularly to a heat dissipation device with a centrifugal fan capable of being conveniently assembled to and disassembled from a bracket.
  • a heat sink is usually placed in thermal contact with a heat generating electronic device such as a central processing unit (CPU), and transfers heat through conduction away from the heat generating electronic device so as to prevent over-heating of the heat generating electronic device.
  • a heat generating electronic device such as a central processing unit (CPU)
  • a centrifugal fan is mounted on a side of a heat sink to improve heat dissipation efficiency of the heat sink.
  • the fan is locked onto the heat sink by screws interferentially engaged with fins of the heat sink.
  • the previously mentioned assembling method requires screws and a screwdriver to perform these procedures.
  • the conventional method wastes time and manpower.
  • FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with an embodiment of the disclosure.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
  • FIG. 3 is an enlarged view of a circle III of FIG. 2 .
  • FIG. 4 is an exploded view of a clasp from a bracket of the heat dissipation device of the circle III of FIG. 3 .
  • FIG. 5 is a side, partial view of the heat dissipation device of FIG. 1 .
  • the heat dissipation device 100 is used to thermally contact an electronic component (not shown) mounted on a printed circuit board (not shown) to dissipate heat generated by the electronic component.
  • the heat dissipation device 100 includes a bracket 10 , and a fan 20 and heat sink 30 mounted on the bracket 10 .
  • the bracket 10 includes a bottom plate 11 and two side plates 12 extending upwards from two opposite edges of the bottom plate 11 .
  • Each of the side plates 12 form an air guiding plate 13 extending inwards from inner sides thereof.
  • the bottom plate 11 defines a rectangular window 15 and a circular opening 14 respectively at two sides of the air guiding plate 13 .
  • the bottom plate 11 forms two steps 151 extending downwards from opposite sides of the window 15 .
  • a plurality of projections 152 extend from bottoms of the side plates 12 and at two ends of the steps 151 .
  • the fan 20 is mounted on the bottom plate 11 and covers the circular opening 14 .
  • the fan 20 is a centrifugal fan with an air outlet 22 facing the heat sink 30 and two air inlets 23 vertical to the air outlet 22 .
  • the fan 20 forms two ears 21 at a periphery thereof. Each of the ears 21 defines a through hole 211 .
  • the heat sink 30 includes a heat absorbing plate 31 and a fin set 32 mounted on the heat absorbing plate 31 .
  • the heat absorbing plate 31 can be a vapor chamber.
  • the heat absorbing plate 31 is received in the window 15 , supported by the steps 15 and blocked by the projections 152 .
  • the heat absorbing plate 31 is used to thermally contact the electronic component to absorb heat generated by the electronic component.
  • the fin set 32 defines a plurality of channels (not labeled) communicating the air outlet 22 of the fan 20 .
  • the fin set 32 dissipates the heat transferred from the heat absorbing plate 31 into the channels, the heat then is brought by airflow generated by the fan 20 .
  • the heat dissipation device 100 includes two clasps 16 and two orientating members 17 mounted around the circular opening 14 .
  • the clasps 16 are made of elastic metal.
  • Each of the clasps 16 includes a mounting portion 161 , an arm 162 upwards extending from the mounting portion 161 , and a hook portion 163 extending from a top end of the arm 162 .
  • the hook portion 163 is bent towards the mounting portion 161 .
  • the mounting portion 161 defines a rivet hole 164 .
  • the bottom plate 11 forms a rivet 18 relative to the rivet hole 164 of the each clasp 16 and a position block 19 near and spaced to the rivet 18 .
  • each of the rivets 16 is triangular, and each of the rivets 18 has a corresponding triangular shape.
  • each of the rivets 18 extends through the rivet hole 164 of the corresponding mounting portion 161 , and each of the position blocks 19 abuts against a back surface of the arm 162 .
  • Top ends of the rivets 18 are then punched to be larger to lock the clasps 16 on the bottom plate 11 .
  • Each of the orientating members 17 includes a circular base 171 and a pin 172 extending from a top end of the circular base 171 .
  • the bracket 10 , the rivets 18 , the position blocks 19 and the orientating members 17 are integrally made of metal having good thermal conductivity.
  • the bracket 10 can be made of plastic material, and the rivets 18 , the position blocks 19 and the orientating members 17 are integrally made of metal with bottoms embedded in the bracket 10 .
  • the ears 21 of the fan 20 are pressed toward the clasps 16 .
  • the hook portions 163 of the clasps 16 are subjected to an external force, which makes the hook portion 163 run outwardly.
  • the fan 20 is pressed towards the bottom plate 11 until the ears 21 contacts the circular base 171 and the pins 172 extend in the through holes 211 of the ears 21 .
  • the external force of the hook portions 163 is released; a resilience of the hook portions 163 impels the arms 162 to move towards the ears 21 .
  • the hook portions 163 of the clasps 16 press the top surfaces of the ears 21 . Therefore, the fan 20 is clasped on the bottom plate 11 .

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a bracket, a fan with an air inlet and an air outlet, and a heat sink mounted on the bracket. The bracket includes a plurality of rivets and clasps. Each of the clasps includes a mounting portion, an arm extending upwards from the mounting portion, and a hook portion extending from a top end of the arm and towards the mounting portion. The mounting portion is riveted on the bracket by a corresponding rivet. The fan includes a plurality of ears corresponding to the clasps. The hook portions of the clasps abut on top surfaces of the ears to fix the fan on the bracket. The fan defines a plurality of channels communicating the outlet of the fan.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure relates to heat dissipation devices in electronics, and more particularly to a heat dissipation device with a centrifugal fan capable of being conveniently assembled to and disassembled from a bracket.
  • 2. Description of Related Art
  • A heat sink is usually placed in thermal contact with a heat generating electronic device such as a central processing unit (CPU), and transfers heat through conduction away from the heat generating electronic device so as to prevent over-heating of the heat generating electronic device.
  • Typically, a centrifugal fan is mounted on a side of a heat sink to improve heat dissipation efficiency of the heat sink. In a conventional assembling method, the fan is locked onto the heat sink by screws interferentially engaged with fins of the heat sink. However, the previously mentioned assembling method requires screws and a screwdriver to perform these procedures. As known by those skilled persons, the conventional method wastes time and manpower.
  • What is needed, therefore, is a heat dissipation device which can overcome the limitations described.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with an embodiment of the disclosure.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.
  • FIG. 3 is an enlarged view of a circle III of FIG. 2.
  • FIG. 4 is an exploded view of a clasp from a bracket of the heat dissipation device of the circle III of FIG. 3.
  • FIG. 5 is a side, partial view of the heat dissipation device of FIG. 1.
    •  DETAILED DESCRIPTION
  • Referring to FIG. 1, a heat dissipation device 100 in accordance with an embodiment of the disclosure is shown. The heat dissipation device 100 is used to thermally contact an electronic component (not shown) mounted on a printed circuit board (not shown) to dissipate heat generated by the electronic component. The heat dissipation device 100 includes a bracket 10, and a fan 20 and heat sink 30 mounted on the bracket 10.
  • Referring to FIG. 2, the bracket 10 includes a bottom plate 11 and two side plates 12 extending upwards from two opposite edges of the bottom plate 11. Each of the side plates 12 form an air guiding plate 13 extending inwards from inner sides thereof. The bottom plate 11 defines a rectangular window 15 and a circular opening 14 respectively at two sides of the air guiding plate 13. The bottom plate 11 forms two steps 151 extending downwards from opposite sides of the window 15. A plurality of projections 152 extend from bottoms of the side plates 12 and at two ends of the steps 151.
  • The fan 20 is mounted on the bottom plate 11 and covers the circular opening 14. The fan 20 is a centrifugal fan with an air outlet 22 facing the heat sink 30 and two air inlets 23 vertical to the air outlet 22. The fan 20 forms two ears 21 at a periphery thereof. Each of the ears 21 defines a through hole 211.
  • The heat sink 30 includes a heat absorbing plate 31 and a fin set 32 mounted on the heat absorbing plate 31. The heat absorbing plate 31 can be a vapor chamber. The heat absorbing plate 31 is received in the window 15, supported by the steps 15 and blocked by the projections 152. The heat absorbing plate 31 is used to thermally contact the electronic component to absorb heat generated by the electronic component. The fin set 32 defines a plurality of channels (not labeled) communicating the air outlet 22 of the fan 20. The fin set 32 dissipates the heat transferred from the heat absorbing plate 31 into the channels, the heat then is brought by airflow generated by the fan 20.
  • Referring to FIGS. 3-4, the heat dissipation device 100 includes two clasps 16 and two orientating members 17 mounted around the circular opening 14. The clasps 16 are made of elastic metal. Each of the clasps 16 includes a mounting portion 161, an arm 162 upwards extending from the mounting portion 161, and a hook portion 163 extending from a top end of the arm 162. The hook portion 163 is bent towards the mounting portion 161. The mounting portion 161 defines a rivet hole 164. The bottom plate 11 forms a rivet 18 relative to the rivet hole 164 of the each clasp 16 and a position block 19 near and spaced to the rivet 18. The rivet hole 164 of each of the clasps 16 is triangular, and each of the rivets 18 has a corresponding triangular shape. When the clasps 16 are mounted on the bottom plate 11, each of the rivets 18 extends through the rivet hole 164 of the corresponding mounting portion 161, and each of the position blocks 19 abuts against a back surface of the arm 162. Top ends of the rivets 18 are then punched to be larger to lock the clasps 16 on the bottom plate 11. Each of the orientating members 17 includes a circular base 171 and a pin 172 extending from a top end of the circular base 171. In this embodiment, the bracket 10, the rivets 18, the position blocks 19 and the orientating members 17 are integrally made of metal having good thermal conductivity. In another embodiment, the bracket 10 can be made of plastic material, and the rivets 18, the position blocks 19 and the orientating members 17 are integrally made of metal with bottoms embedded in the bracket 10.
  • Referring to FIG. 5 also, when the fan 20 is mounted on the bottom plate 11, the ears 21 of the fan 20 are pressed toward the clasps 16. The hook portions 163 of the clasps 16 are subjected to an external force, which makes the hook portion 163 run outwardly. Thereafter, the fan 20 is pressed towards the bottom plate 11 until the ears 21 contacts the circular base 171 and the pins 172 extend in the through holes 211 of the ears 21. Then, the external force of the hook portions 163 is released; a resilience of the hook portions 163 impels the arms 162 to move towards the ears 21. As a result, the hook portions 163 of the clasps 16 press the top surfaces of the ears 21. Therefore, the fan 20 is clasped on the bottom plate 11.
  • It is to be understood, however, that even though numerous characteristics and advantages of certain embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (13)

What is claimed is:
1. A heat dissipation device comprising:
a bracket comprising a plurality of rivets and clasps, each of the clasps comprising a mounting portion, an arm extending upwards from the mounting portion, and a hook portion extending from a top end of the arm and towards the mounting portion, the mounting portion being riveted on the bracket by the corresponding rivet;
a fan having an air inlet and an air outlet, the fan comprising a plurality of ears corresponding to the clasps, the hook portions of the clasps abutting on top surfaces of the ears to fix the fan on the bracket; and
a heat sink mounted on the bracket and having a plurality of channels communicating the air outlet of the fan.
2. The heat dissipation device of claim 1, wherein each of the ears defines a through hole, the bracket comprising a plurality of orientating members each extending in the through hole of a corresponding ear.
3. The heat dissipation device of claim 2, wherein each of the orientating members comprising a circular base contacting a bottom of the corresponding ear and a pin extending from a top end of the circular base and in a corresponding through hole of the corresponding ear.
4. The heat dissipation device of claim 2, wherein the bracket comprises a plurality of position blocks, each of the position blocks being spaced from the corresponding rivet and abutting against the arm of the corresponding clasp.
5. The heat dissipation device of claim 4, wherein the bracket, the rivets, the position blocks and the orientating members are integrally made of metal.
6. The heat dissipation device of claim 4, wherein the bracket is made of plastic material, and the rivets, the position blocks and the orientating members are integrally made of metal with bottoms embedded in the bracket.
7. The heat dissipation device of claim 1, wherein the bracket comprises a bottom plate and two side plates extending upwards from opposite edges of the bottom plate, two air guiding plates inwards extending from inner sides of the side plates from the fan to the heat sink.
8. The heat dissipation device of claim 7, wherein the bottom plate defines an opening communicating the air inlet of the fan and a window receiving the heat sink, the opening and the window being defined at two sides of the air guiding plates.
9. A heat dissipation device comprising:
a bracket comprising a plurality of rivets, clasps, and orientating members, each of orientating member being spaced from and adjoined to one corresponding rivet, each of the clasps being riveted on the bracket by the corresponding rivet; and
a centrifugal fan having an air inlet and an air outlet, the fan comprising a plurality of ears corresponding to the clasps, the clasps abutting on top surfaces of the ears to fix the fan on the bracket.
10. The heat dissipation device of claim 9, wherein each of the orientating members comprising a circular base contacting a bottom of a corresponding ear and a pin extending from a top end of the circular base and in a corresponding through hole of the corresponding ear.
11. The heat dissipation device of claim 9, wherein the bracket comprises a plurality of position blocks, each of the position blocks being spaced from the corresponding rivet and abutting against a corresponding clasp.
12. The heat dissipation device of claim 11, wherein the bracket, the rivets, the position blocks and the orientating members are integrally made of metal.
13. The heat dissipation device of claim 11, wherein the bracket is made of plastic material, and the rivets, the position blocks and the orientating members are integrally made of metal with bottoms embedded in the bracket.
US13/459,095 2011-12-14 2012-04-28 Heat dissipation device with fan Abandoned US20130153178A1 (en)

Applications Claiming Priority (2)

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TW100146150 2011-12-14
TW100146150A TWI530663B (en) 2011-12-14 2011-12-14 Thermal module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160147134A1 (en) * 2014-11-25 2016-05-26 Hon Hai Precision Industry Co., Ltd. Enclosure assembly

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160147134A1 (en) * 2014-11-25 2016-05-26 Hon Hai Precision Industry Co., Ltd. Enclosure assembly
US9829774B2 (en) * 2014-11-25 2017-11-28 Hon Hai Precision Industry Co., Ltd. Enclosure assembly

Also Published As

Publication number Publication date
TWI530663B (en) 2016-04-21
TW201323820A (en) 2013-06-16

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Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LI, SHIH-YAO;HUNG, JUI-WEN;HWANG, CHING-BAI;AND OTHERS;REEL/FRAME:028123/0823

Effective date: 20120418

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION