CN101232795A - 风扇架及采用该风扇架的散热装置 - Google Patents
风扇架及采用该风扇架的散热装置 Download PDFInfo
- Publication number
- CN101232795A CN101232795A CN200710073107.9A CN200710073107A CN101232795A CN 101232795 A CN101232795 A CN 101232795A CN 200710073107 A CN200710073107 A CN 200710073107A CN 101232795 A CN101232795 A CN 101232795A
- Authority
- CN
- China
- Prior art keywords
- radiator
- button
- fan
- fan board
- framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000010354 integration Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/601—Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/66—Combating cavitation, whirls, noise, vibration or the like; Balancing
- F04D29/661—Combating cavitation, whirls, noise, vibration or the like; Balancing especially adapted for elastic fluid pumps
- F04D29/668—Combating cavitation, whirls, noise, vibration or the like; Balancing especially adapted for elastic fluid pumps damping or preventing mechanical vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710073107.9A CN100584177C (zh) | 2007-01-24 | 2007-01-24 | 风扇架及采用该风扇架的散热装置 |
US11/695,456 US7495921B2 (en) | 2007-01-24 | 2007-04-02 | Fan bracket and heat dissipation apparatus incorporating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710073107.9A CN100584177C (zh) | 2007-01-24 | 2007-01-24 | 风扇架及采用该风扇架的散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101232795A true CN101232795A (zh) | 2008-07-30 |
CN100584177C CN100584177C (zh) | 2010-01-20 |
Family
ID=39640983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710073107.9A Expired - Fee Related CN100584177C (zh) | 2007-01-24 | 2007-01-24 | 风扇架及采用该风扇架的散热装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7495921B2 (zh) |
CN (1) | CN100584177C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101907118A (zh) * | 2009-06-02 | 2010-12-08 | 扎尔曼技术株式会社 | 用于紧固计算机零件的部件 |
CN101965117A (zh) * | 2009-07-22 | 2011-02-02 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4946534B2 (ja) * | 2007-03-12 | 2012-06-06 | 日本電産株式会社 | 冷却装置 |
TWM337780U (en) * | 2007-11-20 | 2008-08-01 | Asia Vital Components Co Ltd | Heat dissipation module capable of changing position |
US8365811B2 (en) * | 2007-12-07 | 2013-02-05 | Nidec Corporation | Heat sink fan |
TWM339033U (en) * | 2008-04-16 | 2008-08-21 | Asia Vital Components Co Ltd | Heat sink |
US20100027219A1 (en) * | 2008-07-31 | 2010-02-04 | Asia Vital Components Co., Ltd. | Fan frame assembly for a heat sink |
CN102056453A (zh) * | 2009-10-27 | 2011-05-11 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN102056463A (zh) * | 2009-11-09 | 2011-05-11 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN102098899A (zh) * | 2009-12-09 | 2011-06-15 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN102105034A (zh) * | 2009-12-18 | 2011-06-22 | 富准精密工业(深圳)有限公司 | 固定架以及使用该固定架的散热装置 |
TW201228543A (en) * | 2010-12-31 | 2012-07-01 | Hon Hai Prec Ind Co Ltd | Mounting apparatus for fan |
CN102954013A (zh) * | 2011-08-24 | 2013-03-06 | 鸿富锦精密工业(深圳)有限公司 | 具有转速调节功能的风扇 |
US20140048677A1 (en) * | 2012-08-20 | 2014-02-20 | Chiu-Mao Huang | Bearing cup base and fan frame assembly using same |
US10161417B2 (en) * | 2015-05-08 | 2018-12-25 | Technologies Holdings Corp. | Fan and mounting bracket for an air mover |
CN110045803B (zh) * | 2019-03-29 | 2021-05-18 | 华为技术有限公司 | 一种散热装置及服务器 |
TWI785947B (zh) * | 2021-12-27 | 2022-12-01 | 元山科技工業股份有限公司 | 可減震的風扇殼座 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2918810B2 (ja) * | 1994-07-12 | 1999-07-12 | 山洋電気株式会社 | 電子部品冷却装置 |
US5495392A (en) * | 1995-03-06 | 1996-02-27 | Shen; Tsan-Jung | CPU heat dissipating apparatus |
US6401807B1 (en) * | 1997-04-03 | 2002-06-11 | Silent Systems, Inc. | Folded fin heat sink and fan attachment |
US5943209A (en) * | 1997-10-06 | 1999-08-24 | Liu; Yen-Wen | Modularized electronic component cooling apparatus |
JP3996338B2 (ja) * | 2000-10-19 | 2007-10-24 | 日本電産株式会社 | ファン冷却装置 |
CN2455044Y (zh) * | 2000-10-23 | 2001-10-17 | 富准精密工业(深圳)有限公司 | 散热装置组合 |
JP3686005B2 (ja) * | 2001-03-30 | 2005-08-24 | 山洋電気株式会社 | ヒートシンクを備えた冷却装置 |
JP4786069B2 (ja) * | 2001-06-29 | 2011-10-05 | 山洋電気株式会社 | 電子部品冷却装置 |
FR2833723B1 (fr) * | 2001-12-19 | 2004-02-13 | Siemens Vdo Automotive | Pedale a retour d'effort immediat |
JP2004063686A (ja) * | 2002-07-26 | 2004-02-26 | Fujikura Ltd | ファン付きヒートシンク |
JP3910117B2 (ja) * | 2002-08-05 | 2007-04-25 | 日本電産株式会社 | ファン冷却装置 |
US7120746B2 (en) * | 2002-09-09 | 2006-10-10 | International Business Machines Corporation | Technique for data transfer |
US6927979B2 (en) * | 2002-09-12 | 2005-08-09 | Sanyo Denki Co., Ltd. | Heat-emitting element cooling apparatus |
US6860323B2 (en) * | 2003-03-05 | 2005-03-01 | Asia Vital Components Co., Ltd. | Radiator fan |
USD501450S1 (en) * | 2003-06-10 | 2005-02-01 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
US6934155B2 (en) * | 2003-06-11 | 2005-08-23 | Intel Corporation | Apparatus and method for a cooling solution fastening assembly |
USD509485S1 (en) * | 2003-12-09 | 2005-09-13 | Fujikura Ltd. | Heat sink |
JP2005197303A (ja) * | 2003-12-26 | 2005-07-21 | Nippon Densan Corp | ヒートシンクファン |
JP2005303015A (ja) * | 2004-04-12 | 2005-10-27 | Nippon Densan Corp | ヒートシンクファン |
TW200809472A (en) * | 2006-08-02 | 2008-02-16 | Delta Electronics Inc | Heat dissipating module and it's fan and cover |
USD561120S1 (en) * | 2006-09-28 | 2008-02-05 | Delta Electronics, Inc. | Heat dissipating module |
JP2008166465A (ja) * | 2006-12-28 | 2008-07-17 | Nippon Densan Corp | ヒートシンクファン |
USD564460S1 (en) * | 2007-01-25 | 2008-03-18 | Nidec Corporation | Heat sink fan |
USD561123S1 (en) * | 2007-01-30 | 2008-02-05 | Fujikura Ltd. | Heat sink |
USD561122S1 (en) * | 2007-01-30 | 2008-02-05 | Fujikura Ltd. | Heat sink |
USD561121S1 (en) * | 2007-01-30 | 2008-02-05 | Fujikura Ltd. | Heat sink |
-
2007
- 2007-01-24 CN CN200710073107.9A patent/CN100584177C/zh not_active Expired - Fee Related
- 2007-04-02 US US11/695,456 patent/US7495921B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101907118A (zh) * | 2009-06-02 | 2010-12-08 | 扎尔曼技术株式会社 | 用于紧固计算机零件的部件 |
CN101965117A (zh) * | 2009-07-22 | 2011-02-02 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
Also Published As
Publication number | Publication date |
---|---|
CN100584177C (zh) | 2010-01-20 |
US7495921B2 (en) | 2009-02-24 |
US20080174967A1 (en) | 2008-07-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170421 Address after: Guangdong City, Chancheng City West Industrial Zone, 35 West Road, No. Patentee after: CHAMP TECH OPTICAL (FOSHAN) Corp. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: Foxconn Technology Co.,Ltd. Patentee before: Fuzhun Precision Industry (Shenzhen) Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100120 |