595307 玖::、麵辭厕 【發明内容】 因此，本發明之目的，是在提供一種可將溫度迅速傳 輪的中心式導流散熱裝置。 於是，本發明之中心式導流散熱裝置，是裝設在一發 溫源上，該中心式導流散熱裝置包含一裝設在該發溫源上 的散熱機構，及一裝設在該散熱機構上的風扇機構。該散 熱機構包括一可貼設在該發溫源上的轉熱傳導組合體、數 間隔環設在該超熱傳導組合體的^片，及一環設在該等翼 片之外周側的外殼體’該外殼體具有至少一環設且貫穿在 其底部周側的入風口，該等入風口供導引外部空氣進入該 外设體内。該風扇機搆是可軸向脫離地裝設在該散熱機構 之外设體的頂部，藉由該超熱傳導組合體將該發溫源之主 要熱源迅速往上傳導散熱手段，並用該風扇機構吸引外部 冷空氣由入風口呈由下往上並經可快速流竄的路徑構造， 集中吹向該超熱傳導組合體的主要散熱手段，以及透過多 數翼片之偌大散熱表面積的輔助疏散餘熱手段，終可獲致 最佳散熱效果者。 【實施方式】 本發明之前述以及其他技術内容、特點與優點，在以 下配合參考圖式之一（數）較佳實施例的詳細說明中，將可 清楚的明白。 在提出詳細說明之前，要注意的是，在以下的敘述中 ，類似之元件，是以相同標號來表示。 參閱第一 ’五圖，本發明之中心式導流散熱裝置2的 595307 玖^發明議It®」 第一較佳實施例，是裝設在一發溫源3上，該發溫源3可 為一如中央處理器（CPU)、積體電路晶片（Ic)、電路模 組…等及其他之發溫源；在本例中該發溫源3為一中央處 理器；該中心式導流散熱裝置2包含一裝設在該發手源3 上的散熱機構4、至少一裝設在該散熱機構4内的^溫體 包> 一裝設在該散熱機構4之頂端上方的抽風式風扇機構 6,及塗覆該等導溫體5之導熱膏7。： 參閱第三、四、五圖，該散熱機構4包括一可貼設在 該發溫源3上的超熱傳導組合體40，及數間隔環設在該 超熱傳導組合體40的翼片400。該超熱傳導組合體4〇, 包括一可貼設在該發溫源3上的圓形底盤8 (亦可為方形 或其他幾何形狀）、一垂設在該底盤8之一頂面82上的排 熱單元9，及一供套合於該底盤8之周環的底開口 ι〇ι與 一頂開口 102的中空外殼體1〇〇。 該底盤8，包括可貼設在該發溫源3上的底面81、一 相反於該底面81且朝一中心線向上漸縮彎弧形成的頂面 82，及至少一自其頂面82凹陷形成的底孔83，在本例中 係形成四個底孔83。 該排熱單兀9,具有一垂設在該底盤8之頂面82且 可供上述之翼片400間隔環設在其外周側的散熱柱91， 且上述每兩相互鄰接之翼片4〇〇包覆界定出一通道4〇〇,。 气底盤8之底孔83的散熱孔 該散熱柱91具有至少一對應 911，每一翼片 的導溫部401 ^ 400具有一可抵接於該底盤8之頂面82上 忒等導溫部401搭配界定之凹弧狀底部空 7 595307 玖、種鲅麵嚷r v 間402恰與該底盤8之凸弧狀頂面82相搭接。 該外殼體100,具有至少一環設且貫穿在其底部周側 的入風口 103，本例為環設多數入風口 1〇3，及至少二環 設且貫穿在其頂部周側的卡孔1〇4，該等入風口 1〇3供導 引外部冷空氣進入該外殼體1〇〇内，並呈由下往上流竄經 該排熱單元9之通道400,（如第七圖之箭頭所示）；該入 風口 1 03兼可做為將外殼體1 〇〇以扣具（圖未示）予以扣 固定位之卡扣孔。 該導溫體5，是裝設在該底盤8之底孔83與該散熱 柱91之散熱孔911包覆界定出之容置空間11〇内。該導 ’里體5可為一超導棒或一熱管，在本例中係採用四根導溫 體5 ;尤當使用超導棒時，更可使該發溫源3之熱能迅速 往上傳導而獲致絕佳的傳熱效果。 該風扇機構6’是可軸向脫離地裝設在該散熱機構4 之外殼體100的頂開口 102，並包括一風扇61、一環設在 該風扇61周側的圓環板62，及三自該圓環板62之底端 緣向下等距凸伸形成的卡栓63，該等卡栓63可脫離地卡 扣在該散熱機構4之外殼體1〇〇的卡孔1〇4内。 另外，該底盤8之底孔83與該散熱柱91之散熱孔 911包覆界定出一容置空間11〇，該容置空間11〇内之導 溫模式手段依材料組構特性概分下列四種：其一，採用常 壓傳導方式，即其内灌滿由多種吸熱或發熱材料元素燒結 研磨混合構成的化合物；其二，為喷塗傳導方式，可在前 述之化合物中混合加入防止氧化元素後，對容置空間1 1 〇 8 595307 玖、麵麵(5) 其三’是傳統熱導方式，係在該 内壁施予表面喷塗而成 一或混合材料：純水、 容置空間11 〇内抽真空充填下列單 甲醇、丙_、氨、氮、納、鐘·....等或其他等效材料；其 四，係超熱傳導方式，是選自氫、鋰、鈉、鉀、鎂、鈣、 釔鋇等等，採多種元素燒結研磨混合而成，將容置 空間110抽真空後再充填前述組成物而得。 、值得一提的是，該等翼片400之導溫模式亦可運用前 述之喷塗傳導方式’其係將多種吸熱或發熱材料元素燒結 研磨混合構成的化合物，混合加人防止氧化元素後，對該 等翼片4GG之周環表面積施予表面噴塗而成。 又，參閱第六圖，本發明更包含一熱電式發電機12〇 ’在本例中為—致冷晶片，該熱電式發電機120之位置使 其高溫表面121與該散熱機構4之散熱柱91頂端上表面 成熱接觸（接觸面加導熱膏），㈣電式發電機…之低 溫相對表面122職—散熱片130之絲面132成熱接觸 (接觸面加導熱膏），且熱電式發電機12〇經由一對導線 140連接該散熱片13G上方之風扇機構6的風扇；當散熱 柱9i之溫度上升時，位在散熱柱91肖該散熱片13〇間之 熱電式發電機120的兩相對表面121、122會產生一溫差 :該溫差會使該熱電式發電機12〇產生一直流電壓，例如 田溫度達到-5G°CS值時，該熱電式發電冑12()所產生 之電壓及電流將使風扇動作，風扇之轉料冷氣流吹向散 熱片13G使其降溫，致使更多的熱能自散熱柱μ被取出 從而降低發溫源3的溫度；以及必要時可將二個或以上之 9 595307595307 玖 :: Noodles toilet [Summary of the invention] Therefore, the object of the present invention is to provide a central diversion and heat dissipation device that can quickly transfer the temperature of the wheel. Therefore, the central diversion heat dissipation device of the present invention is installed on a hair temperature source, and the central diversion heat radiation device includes a heat dissipation mechanism installed on the hair temperature source, and a heat dissipation device installed on the heat radiation source. Fan mechanism on the mechanism. The heat-dissipating mechanism includes a heat-transferring assembly capable of being attached to the heating source, a plurality of spacers provided on the super-heat-conducting assembly, and an outer shell provided on the outer peripheral side of the fins. The outer casing has at least one air inlet which is arranged around the bottom peripheral side of the outer casing, and the air inlets are used to guide external air into the peripheral body. The fan mechanism is axially detachably installed on the top of the external body of the heat dissipation mechanism, and the main heat source of the heating source is quickly conducted by the superheat conduction combination to dissipate heat, and the fan mechanism is used to attract the outside The cold air from the air inlet is constructed from the bottom to the top and can flow quickly. The main heat dissipation means focused on the super heat conduction assembly and the auxiliary evacuation waste heat means through the large heat dissipation surface area of most fins can finally be obtained. The best thermal effect. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will be clearly understood in the following detailed description of one or more preferred embodiments with reference to the accompanying drawings. Before proposing a detailed description, it should be noted that in the following description, similar elements are denoted by the same reference numerals. Referring to the first five drawings, the central diversion heat dissipation device 2 of the present invention is 595307 的 ^ vention proposal It® "The first preferred embodiment is installed on a hair temperature source 3, which can be It is a central processing unit (CPU), integrated circuit chip (Ic), circuit modules, etc. and other sources of temperature; in this example, the source 3 is a central processing unit; the central diversion The heat radiating device 2 includes a heat radiating mechanism 4 installed on the hair source 3, at least one ^ warm body bag installed in the heat radiating mechanism 4> and a ventilation type installed above the top of the heat radiating mechanism 4. A fan mechanism 6, and a thermally conductive paste 7 coated with the temperature conducting bodies 5. : Referring to the third, fourth, and fifth figures, the heat dissipation mechanism 4 includes a superheat conductive combination 40 that can be attached to the heating source 3, and a plurality of fins 400 provided on the superheat conductive combination 40 in spaced-apart rings. The super-heat-conducting assembly 40 includes a circular chassis 8 (which can also be a square or other geometric shape) that can be attached to the hair temperature source 3, and a vertical chassis 82 that is suspended on a top surface 82 of the chassis 8. The heat exhausting unit 9 and a hollow outer casing 100 which fits into the bottom opening ιo and the top opening 102 of the peripheral ring of the chassis 8. The chassis 8 includes a bottom surface 81 that can be attached to the hair temperature source 3, a top surface 82 that is opposite to the bottom surface 81 and is formed by a tapered curved upward toward a center line, and at least one recess formed from the top surface 82. In this example, four bottom holes 83 are formed. The heat-removing unit 9 has a heat-dissipating column 91 which is perpendicularly arranged on the top surface 82 of the chassis 8 and can be provided with the above-mentioned wing 400 spacer ring on its outer peripheral side, and each of the two adjacent fins 4 above. 〇Covering defines a channel 400 ,. The heat dissipation hole of the bottom hole 83 of the air chassis 8 The heat dissipation column 91 has at least one corresponding to 911, and the temperature-conducting portion 401 ^ 400 of each fin has a temperature-conducting portion 401 that can abut on the top surface 82 of the chassis 8 With a defined concave arc-shaped bottom space 7 595307 玖, the seed surface 嚷 rv 402 just overlaps with the convex arc-shaped top surface 82 of the chassis 8. The outer casing 100 has at least one air inlet 103 that is looped and penetrates the bottom peripheral side thereof. In this example, most of the air inlets 103 are looped and the at least two card holes 1 are looped and passed through the top peripheral side. 4. The air inlets 103 are used to guide external cold air into the outer casing 100, and flow through the channel 400 of the heat exhaust unit 9 from bottom to top (as shown by the arrow in the seventh figure ); The air inlet 103 can also be used as a fastening hole for fixing the outer casing 100 with a fastener (not shown). The temperature-conducting body 5 is installed in the accommodation space 110 defined by the bottom hole 83 of the chassis 8 and the heat radiation hole 911 of the heat radiation column 91. The guide body 5 can be a superconducting rod or a heat pipe. In this example, four temperature-conducting bodies 5 are used; especially when a superconducting rod is used, the heat energy of the hair temperature source 3 can be uploaded quickly. The result is excellent heat transfer. The fan mechanism 6 ′ is axially detachably mounted on the top opening 102 of the casing 100 outside the heat dissipation mechanism 4, and includes a fan 61, a ring plate 62 ringed on the peripheral side of the fan 61, and The bottom end edge of the annular plate 62 projects downwardly and equidistantly from each other, and the latches 63 are detachably latched in the latching holes 104 of the housing 100 outside the heat dissipation mechanism 4. In addition, the bottom hole 83 of the chassis 8 and the heat dissipation hole 911 of the heat dissipation column 91 cover and define an accommodating space 110. The temperature guiding mode means in the accommodating space 11 can be divided into the following four according to the material composition characteristics: Species: First, the atmospheric pressure conduction method is used, which is filled with a compound composed of a variety of endothermic or heating material elements sintered and ground. Second, the spray conduction method can be mixed with the aforementioned compounds to prevent oxidation. Then, the storage space 1 1 008 595307 玖, the surface (5) and the third one is the traditional thermal conductivity method, which is sprayed on the inner wall to form one or mixed materials: pure water, storage space 11 〇 Fill the following mono-methanol, propylene, ammonia, nitrogen, sodium, bell, etc. or other equivalent materials; the fourth is the super thermal conduction method, which is selected from hydrogen, lithium, sodium, potassium, magnesium , Calcium, yttrium, barium, etc., are obtained by sintering and grinding a variety of elements, and evacuating the accommodating space 110, and then filling the foregoing composition. It is worth mentioning that the thermal conduction mode of these fins 400 can also use the aforementioned spraying conduction method. It is a compound formed by sintering and grinding a variety of endothermic or heating material elements, and mixing them with anti-oxidation elements. The surface area of the perimeters of the fins 4GG is spray-coated. Also, referring to the sixth figure, the present invention further includes a thermoelectric generator 120 ′, which in this example is a cooling chip. The thermoelectric generator 120 is positioned such that its high-temperature surface 121 and the heat dissipation column of the heat dissipation mechanism 4 91 The top surface of the top is in thermal contact (contact surface plus thermal paste), the low-temperature opposite surface of the electric generator ... The wire surface of the heat sink 130 is in thermal contact (contact surface plus thermal paste), and the thermoelectric type The motor 120 is connected to the fan of the fan mechanism 6 above the heat sink 13G through a pair of wires 140. When the temperature of the heat sink 9i rises, two of the thermoelectric generator 120 located between the heat sink 91 and the heat sink 13 The opposite surfaces 121 and 122 will generate a temperature difference: the temperature difference will cause the thermoelectric generator 12 to generate a DC voltage, for example, when the field temperature reaches -5G ° CS value, the voltage generated by the thermoelectric generator 胄 12 () and The current will cause the fan to move, and the cold air flow from the fan will blow to the heat sink 13G to reduce the temperature, causing more heat energy to be taken out from the heat dissipation column μ to reduce the temperature of the heat source 3; and if necessary, two or more Of 9 595307
玖、發明機萌(6) …、電式么電機120串接一起以增加電壓輸出；故熱電式發 電機120職生電能不但具有上料溫冷卻功用，且可降 低電腦糸統的功率消耗者。 請參閱第二、四、五圖，當發溫源3之溫度上升時（ 吕如中央處理器工作時），藉由位於該底& 8與該排熱單 元9内的導溫體5 (本例中係採用超導棒），使該發溫源3 產生之主要熱源經由巾心、散熱柱％㉛速往上傳導與藉其 周％夕數翼片400之诺大表面積辅助散溫；並用該風扇機 構9吸引外部冷空氣經由人風口 1()3呈由下往上流經所設 Ή弧上揚且可供冷氣流快速流竄的路徑構造，匯集地吹 向該溫度最高的巾心、散脉91與該等翼片的主要散 熱手段，且透過多數翼片彻之保大散熱表面積的辅助疏 政餘熱手I又，故藉該風扇機構6之迅速抽離自入風口 ^〇3 進入而竄經外殼體1〇〇内之熱氣流，而獲致最佳散熱效果 ,值得一提的是，該等翼片400亦可設計為渦輪形狀（圖 未示），亦可提供氣流一快速流竄的通路。 參閱第七圖，本發明的第二較佳實施例，不同於第一 較佳實施例的地方在於：該底盤8,具有一自該頂面82，凹 陷形成的底槽821，，該排熱單元9,之散熱柱91，具有一對 應該底槽82Γ的排熱槽912，，該底槽821，與該排熱槽 912’相互界定出一超熱傳導腔體15〇，該超熱傳導腔體 150内採用與前述相同之四種溫度傳導模式手段；此外， 參閱第八圖所示，該底盤8 ’與該排熱單元9 ’更可採精密 鑄造一體成型5 10 595307 玖、發明_明_ 參閱第九圖’本發明之中心式導流散熱裝置2,的第 三較佳實施例，其與前例之不同處在於：該底盤8,與該排 熱槽9之散熱柱91，採用精密缚造模具一體成型内設超熱 傳導腔體150者，參閱第十、十一圖，本發明之第四較佳 實施例，該底盤8，、該排熱單元9,之散熱柱91，與該等翼 片彻係用精密鑄造一體成型，並且具有一由該底盤8，、、 該散熱柱91，與該等翼片彻三者内部相互連通所界定出 的中空腔體160’該中空腔冑16〇内採用與前述相同之四 種溫度傳導模式手段。 炫將本發明『中心式導流散熱裝置』2、2，的優點分 述如後： 本發明可使發溫源3之溫度上升時迅速擴散到該底盤 8、8’與該排熱單元9、9,上，並用該風扇機構9吸引外部 冷空氣經由入風口 1〇3使氣流呈由下往上快速流竄的手段 ，集中吹向該溫度最高之散熱柱91與周環翼片4〇〇的主 要散熱手段，加上透過多數翼片400所構成之偌大散熱表 面積的輔助疏散餘熱手段，終可藉該風扇機構6迅速抽離 /’IL竄經该外殼體1 〇 〇内之熱氣流而獲致最佳散熱效果者， 不同於傳統散溫裝置會發生該發溫源12表面溫度仍恆高 於5亥散溫片13溫度之不一致情形，相對本發明「中心式 導流散熱裝置」具有迅速達成全面性降溫的使用特性，且 不會影響該發溫源（如CPU )的工作穩定度。 惟’以上所揭露之圖示說明，僅為本案之四實施例而 已，舉凡熟悉本案該項技藝之人仕，其所依據本案精神範 11 595307 玖、:驗明麵爾， 鹫所做之等效修飾或變化，皆應涵蓋在以下本案所述之申 請專利範圍内。 【圖式簡單說明】 第一圖疋一傳統散溫裝置的一平面設置圖； 第二圖是本發明之中心式導流散熱裝置的第_較佳實 施例的一立體外觀圖； 弟一圖疋忒苐一較佳實施例的一立體分解圖； 第四圖是該第一較佳實施例的另一立體分解圖； 第五圖是該第-較佳實施例之一未完整的組合剖視圖 第六圖是該第一較佳實施例的一使用示意圖，說明該 政熱機構之散熱柱頂端可依序裝設一熱電式發電機與一散 熱片’及熱電式發電機經由—對導線連接該風扇機構之風 扇； 第七圖是本發明之第二較佳實施例之一未完整的組合 剖視圖，說明該底盤之一底槽與該排熱單元之一排熱槽相 互界定出一超熱傳導腔體； 第八圖是該第二較佳實施例之一未完整的組合剖視圖 ，忒明該底盤與該排熱單元更可採精密鑄造一體成型； 第九圖疋本發明之第三較佳實施例之一未完整的分解 圖，說明該外殼體可軸向脫離於由該底盤與該排熱單元一 體成型製成的結構體； 第十圖是本發明之第四較佳實施例之一未完整的組合 剖視圖’說明該散熱柱、該等翼片與底盤係一體成型製成 12 595307 玖、發萌說賴9) 的結構體，並具有一由該散熱柱、該等翼片與底盤内部連 通界定出的中空腔體；及 第十一圖是該第四較佳實施例之一未完整的橫向剖視 圖。 13 595307 玖、發明說明(10) 【圖式之主要元件代表符號簡單說明】 習用部分： 11 基板 12 發溫源 13 散溫片 14 散熱風扇 15 道、、w P 守/皿/Ϊ 本發明部分： 2 中心式導流散熱裝置 2’中心式導流散熱裝置 3 發溫源 4 散熱機構 40 超熱傳導組合體 5 導溫體 500 中空腔體 6 風扇機構 61 風扇 62 圓環體 63 卡栓 7 導熱膏 8 底盤 8， 底盤 81 底面 82 頂面 821’底槽 83 底孔 9 排熱單元 9， 排熱單元 91 散熱柱 91， 散熱柱 911 散熱孔 912’排熱槽 400 翼片 401 導溫部 402 底部空間 400’通道 100 外殼體 101 底開口 102 頂開口 103 入風口 104 卡孔 110 容置空間 120 熱電式發電機 121 表面 122 表面 130 散熱片 132 底表面 140 導線 150 超熱傳導腔體 160 中空腔體 14发明, Invented machine Meng (6)…, the electric motors 120 are connected in series to increase the voltage output; therefore, the thermoelectric generator 120 vocational student electrical energy not only has the feeding temperature cooling function, but also reduces the power consumption of the computer system. . Please refer to the second, fourth, and fifth diagrams. When the temperature of the heating source 3 rises (when the central processing unit is in operation), the heat conducting body 5 in the bottom & 8 and the heat exhausting unit 9 ( In this example, a superconducting rod is used, so that the main heat source generated by the hair temperature source 3 is transmitted upward through the towel core and the heat dissipation column, and the large surface area of the wing 400 is used to assist the scattered temperature; The fan mechanism 9 is used to attract external cold air through the air outlet 1 () 3 to form a path structure that flows from the bottom to the top and rises upwards and allows the cold air flow to flow quickly, and collectively blows to the center of the towel with the highest temperature. Pulse 91 and the main heat dissipation means of these fins, and through the majority of the fins to ensure a large heat dissipation surface to assist the waste heat recovery I, so by the fan mechanism 6 quickly withdraw from the air inlet ^ 〇3 and enter Passing through the hot air flow in the outer casing 100, and obtaining the best heat dissipation effect, it is worth mentioning that the fins 400 can also be designed in the shape of a turbine (not shown), and can also provide a fast flow of air path. Referring to the seventh figure, the second preferred embodiment of the present invention is different from the first preferred embodiment in that the chassis 8 has a bottom groove 821 formed from the top surface 82 and recessed. The heat dissipation column 91 of the unit 9 has a pair of heat exhausting grooves 912 corresponding to the bottom groove 82Γ. The bottom groove 821 and the heat exhausting groove 912 'define a superheat conductive cavity 15 to each other. The superheat conductive cavity In 150, the same four temperature conduction mode means are used as described above; in addition, referring to the eighth figure, the chassis 8 'and the heat exhaust unit 9' can be integrally formed by precision casting 5 10 595307 发明, invention _ 明 _ Referring to the ninth figure, the third preferred embodiment of the central diversion heat dissipation device 2 according to the present invention is different from the previous example in that the chassis 8 and the heat dissipation column 91 of the heat exhaust groove 9 are precision-bonded. If the mold is integrally formed with a superheat conduction cavity 150, refer to the tenth and eleventh figures, the fourth preferred embodiment of the present invention, the chassis 8, the heat dissipation unit 9, the heat dissipation column 91, and the like. The fins are integrally formed by precision casting, and have a base plate 8, Plume 91, the inside thoroughly with three flap communication with each other such that the cavity defining the body 160 'in the same temperature of the aforementioned four kinds of conductive patterns within the cavity means 16〇 helmet. The advantages of the "central diversion and heat dissipation device" 2 and 2 of the present invention are described in the following: The present invention can quickly spread to the chassis 8, 8 'and the heat exhaust unit 9 when the temperature of the heating source 3 rises. , 9, and up, and use the fan mechanism 9 to attract external cold air through the air inlet 103 to make the air flow quickly from bottom to top, and focus on the highest temperature of the heat dissipation column 91 and the peripheral ring fins 4.0. The main heat dissipation means, coupled with the auxiliary heat dissipation means through the large heat dissipation surface area formed by the majority of the fins 400, can be quickly removed by the fan mechanism 6 / 'IL channeling through the thermal air flow within the outer casing 1000 The person who obtains the best heat dissipation effect is different from the conventional dispersing device in which the inconsistency of the surface temperature of the heating source 12 is still higher than the temperature of the dispersing plate 13 of the 5H, which has a rapid speed compared with the "central flow-conducting dissipating device" of the present invention. Achieve the comprehensive cooling performance characteristics without affecting the working stability of the hair temperature source (such as CPU). However, the illustrations disclosed above are only the fourth embodiment of this case. For those who are familiar with the skill of this case, they are based on the spirit of this case. 11 595307 Modifications or changes shall be covered by the scope of patent application described in this case. [Brief description of the drawings] The first figure is a plan view of a conventional heat dissipating device; the second figure is a three-dimensional appearance view of the first preferred embodiment of the central diversion heat dissipation device of the present invention; A three-dimensional exploded view of the first preferred embodiment; the fourth figure is another three-dimensional exploded view of the first preferred embodiment; the fifth figure is an incomplete combined sectional view of the first preferred embodiment The sixth figure is a schematic diagram of the use of the first preferred embodiment, illustrating that a thermoelectric generator and a heat sink can be sequentially installed on the top of the heat dissipation column of the thermal management mechanism, and the thermoelectric generator is connected through a pair of wires. The fan of the fan mechanism; The seventh figure is an incomplete combined sectional view of one of the second preferred embodiments of the present invention, illustrating that a bottom groove of the chassis and a heat exhaust groove of the heat exhaust unit define a super heat conduction with each other Cavity; Figure 8 is an incomplete sectional view of one of the second preferred embodiments, and it is clear that the chassis and the heat removal unit can be integrally formed by precision casting; Figure 9 is the third preferred embodiment of the present invention Incomplete decomposition of one of the examples The figure illustrates that the outer casing can be axially detached from the structure formed by integrally forming the chassis and the heat exhaust unit; and the tenth figure is an incomplete combined sectional view of one of the fourth preferred embodiments of the present invention. The cooling column, the fins and the chassis are integrally formed into a structure of 12 595307 玖, which is 9), and has a hollow cavity defined by the cooling column, the fins and the interior of the chassis. And FIG. 11 is an incomplete transverse sectional view of one of the fourth preferred embodiments. 13 595307 发明 Description of the invention (10) [Simplified explanation of the main symbols of the drawings] Conventional parts: 11 base plate 12 heating temperature source 13 diffuser 14 cooling fan 15, w P guard / dish / Ϊ ： 2 Central Diversion Cooling Device 2 'Central Diversion Cooling Device 3 Heating Source 4 Radiating Mechanism 40 Super Thermal Conduction Combination 5 Thermal Conductor 500 Hollow Cavity 6 Fan Mechanism 61 Fan 62 Circular Body 63 Clamp 7 Thermal Conduction Paste 8 Chassis 8, Chassis 81 Bottom surface 82 Top surface 821 'Bottom groove 83 Bottom hole 9 Heat exhaust unit 9, Heat exhaust unit 91 Radiator column 91, Radiator column 911 Radiator hole 912' Exhaust groove 400 Wing 401 Temperature guide 402 Bottom space 400 'channel 100 outer casing 101 bottom opening 102 top opening 103 air inlet 104 card hole 110 accommodation space 120 thermoelectric generator 121 surface 122 surface 130 heat sink 132 bottom surface 140 wire 150 super thermal conduction cavity 160 hollow cavity 14