MX357608B - Método de unión de metales a base de aluminio. - Google Patents

Método de unión de metales a base de aluminio.

Info

Publication number
MX357608B
MX357608B MX2013001974A MX2013001974A MX357608B MX 357608 B MX357608 B MX 357608B MX 2013001974 A MX2013001974 A MX 2013001974A MX 2013001974 A MX2013001974 A MX 2013001974A MX 357608 B MX357608 B MX 357608B
Authority
MX
Mexico
Prior art keywords
materials
eutectic reaction
aluminum
constituted
based metal
Prior art date
Application number
MX2013001974A
Other languages
English (en)
Other versions
MX2013001974A (es
Inventor
Inoue Masayuki
Nanbu Toshikazu
Miyamoto Kenji
Yamamoto Chika
Uehara Yoshitaka
Hirose Akio
Original Assignee
Nissan Motor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor filed Critical Nissan Motor
Publication of MX2013001974A publication Critical patent/MX2013001974A/es
Publication of MX357608B publication Critical patent/MX357608B/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2336—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer both layers being aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12729—Group IIA metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/1275—Next to Group VIII or IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/12764—Next to Al-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cylinder Crankcases Of Internal Combustion Engines (AREA)
  • Die Bonding (AREA)

Abstract

Se proporciona un método de unión barato con el cual es posible unir materiales constituidos de un metal a base de aluminio a cada otro en una temperatura baja y una presión baja en el aire mientras que inhibe la deformación y no requiere el uso de un flujo y minimiza la influencia en los materiales base y en la periferia. También se proporcionan varias partes unidas obtenidas aplicando el método de unión. Se interpone material (2) de inserción que comprende Zn como un elemento que se somete a una reacción eutéctica con Al entre dos materiales (1, 1) constituido de un metal a base de aluminio. Se calientan los dos materiales (1, 1), mientras que se presionan uno contra otro, a una temperatura en la cual toma lugar la reacción eutéctica, así generando, en la interfaz de unión entre los dos materiales (1, 1), una masa fundida debido a la reacción eutéctica con algo del Al contenido en los materiales base y descargando las películas (1a) de óxido de Al desde la interfaz de unión junto con la masa fundida. Por tanto, se unen los dos materiales.
MX2013001974A 2010-08-31 2011-08-30 Método de unión de metales a base de aluminio. MX357608B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010193519 2010-08-31
PCT/JP2011/069617 WO2012029789A1 (ja) 2010-08-31 2011-08-30 アルミニウム系金属の接合方法

Publications (2)

Publication Number Publication Date
MX2013001974A MX2013001974A (es) 2013-04-03
MX357608B true MX357608B (es) 2018-07-17

Family

ID=45772871

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013001974A MX357608B (es) 2010-08-31 2011-08-30 Método de unión de metales a base de aluminio.

Country Status (9)

Country Link
US (1) US10556292B2 (es)
EP (1) EP2612722B1 (es)
JP (1) JP5527635B2 (es)
CN (1) CN103079744B (es)
BR (1) BR112013004959B1 (es)
MX (1) MX357608B (es)
MY (1) MY160929A (es)
RU (1) RU2549783C2 (es)
WO (1) WO2012029789A1 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9624137B2 (en) * 2011-11-30 2017-04-18 Component Re-Engineering Company, Inc. Low temperature method for hermetically joining non-diffusing ceramic materials
US10022816B2 (en) 2013-08-01 2018-07-17 Nippon Steel & Sumitomo Metal Corporation Friction welding method
JP6260941B2 (ja) * 2013-08-09 2018-01-24 日産自動車株式会社 半導体装置の製造方法
CN107107259B (zh) 2014-12-26 2022-04-01 国立大学法人群马大学 金属构件的接合方法
JP6719176B2 (ja) * 2015-03-30 2020-07-08 株式会社村田製作所 アルミニウム部材の接合方法
JP6472323B2 (ja) * 2015-05-18 2019-02-20 タツタ電線株式会社 成膜方法
JP6454262B2 (ja) 2015-12-24 2019-01-16 タツタ電線株式会社 半田接続構造、および成膜方法
JP6681543B2 (ja) * 2016-07-21 2020-04-15 パナソニックＩｐマネジメント株式会社 溶接金属部材とその溶接金属部材を有する電池
JP6294537B1 (ja) * 2017-01-20 2018-03-14 三菱アルミニウム株式会社 ろう付け用混合組成物塗料
JP2018184852A (ja) * 2017-04-25 2018-11-22 日立オートモティブシステムズ株式会社 ピストン
US20190105731A1 (en) * 2017-10-06 2019-04-11 GM Global Technology Operations LLC Hot formed bonding in sheet metal panels
CN107742606B (zh) * 2017-10-30 2024-04-02 桂林电子科技大学 一种键合晶圆的结构及其制备方法
CN112739485B (zh) * 2018-09-25 2022-07-08 三菱电机株式会社 金属接合体和金属接合体的制造方法以及半导体装置和波导路
US20230054798A1 (en) * 2020-03-27 2023-02-23 Mitsubishi Electric Corporation Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined
CN111482686A (zh) * 2020-04-23 2020-08-04 西安工业大学 一种金属焊接方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3121785A (en) * 1961-11-14 1964-02-18 Aluminum Co Of America Fusion-pressure joining of aluminum alloy members
US3811177A (en) * 1969-12-15 1974-05-21 Vaw Ver Aluminium Werke Ag Process for brazing workpieces of aluminum containing material
US4905887A (en) * 1969-12-15 1990-03-06 Heinz Schoer Process for soldering aluminum containing workpieces
GB1532628A (en) * 1974-11-15 1978-11-15 Ass Eng Ltd Metal bonding method
JPS54133450A (en) * 1978-04-10 1979-10-17 Hitachi Ltd Diffusion bonding method for different kind metal
JPS5557388A (en) * 1978-10-20 1980-04-28 Hitachi Ltd Pressure welding method of aluminum member
US4615952A (en) * 1982-10-29 1986-10-07 Norsk Hydro A.S. Aluminum shapes coated with brazing material and process of coating
JPS6024286A (ja) 1983-07-20 1985-02-06 Mitsubishi Heavy Ind Ltd アルミニウム拡散接合方法
JPS6277932A (ja) * 1985-10-02 1987-04-10 三菱重工業株式会社 アルミニウム製伝熱面
US4979664A (en) * 1989-11-15 1990-12-25 At&T Bell Laboratories Method for manufacturing a soldered article
US5464146A (en) * 1994-09-29 1995-11-07 Ford Motor Company Thin film brazing of aluminum shapes
US5802716A (en) * 1994-09-30 1998-09-08 Toyota Jidosha Kabushiki Kaisha Method for bonding a valve seat with a cylinder head
JPH09250391A (ja) 1996-03-14 1997-09-22 Yamaha Motor Co Ltd 中空部を有する金属製品の成形方法
JPH11172354A (ja) 1997-12-04 1999-06-29 Sumitomo Metal Mining Co Ltd 高温はんだ付用Ｚｎ合金
JP3835582B2 (ja) * 1998-01-26 2006-10-18 住友金属鉱山株式会社 高温はんだ付用Ｚｎ合金
GB9811860D0 (en) * 1998-06-02 1998-07-29 Univ Cambridge Tech Bonding
JP2000301355A (ja) * 1999-04-14 2000-10-31 Shinei Sangyo Kk 同種金属部材の共晶圧接方法及び共晶圧接用装置
AUPR622001A0 (en) * 2001-07-06 2001-08-02 Crampton, John Leonard Improved method and apparatus for spreading of aggregate and road building materials
US6815086B2 (en) * 2001-11-21 2004-11-09 Dana Canada Corporation Methods for fluxless brazing
US7451906B2 (en) * 2001-11-21 2008-11-18 Dana Canada Corporation Products for use in low temperature fluxless brazing
RU2262153C2 (ru) 2002-03-01 2005-10-10 ЭйДжиЭнДжи, ЛЛСи. Бесфлюсовая сборка полупроводниковых изделий размером с кристалл
WO2003075337A1 (en) 2002-03-01 2003-09-12 Agng, Llc Fluxless assembly of chip size semiconductor packages
JP3928488B2 (ja) * 2002-06-04 2007-06-13 富士電機デバイステクノロジー株式会社 半導体装置およびその製造方法
US7722922B2 (en) * 2003-10-20 2010-05-25 Furukawa-Sky Aluminum Corp. Coating apparatus for an aluminum alloy heat exchanger member, method of producing a heat exchanger member, and aluminum alloy heat exchanger member
US7565996B2 (en) * 2004-10-04 2009-07-28 United Technologies Corp. Transient liquid phase bonding using sandwich interlayers
US7850059B2 (en) * 2004-12-24 2010-12-14 Nissan Motor Co., Ltd. Dissimilar metal joining method
JP4531591B2 (ja) 2005-03-03 2010-08-25 本田技研工業株式会社 アルミニウム系部材の接合方法
US7498543B2 (en) * 2006-03-22 2009-03-03 Gm Global Technology Operations, Inc. Method for joining or repairing metal surface parts
JP4961532B2 (ja) * 2006-07-25 2012-06-27 日産自動車株式会社 異種金属の接合方法及び装置
JP5186796B2 (ja) 2007-04-19 2013-04-24 日産自動車株式会社 異種金属の接合方法及び接合構造
JP5151270B2 (ja) 2007-06-26 2013-02-27 日産自動車株式会社 燃料電池構成部材
CN101530947B (zh) * 2009-04-08 2012-07-04 西安交通大学 一种搅拌摩擦钎焊制备双金属复合板的方法
JP5557388B2 (ja) * 2010-10-15 2014-07-23 株式会社クレハ 網目状構造を有するポリグリコール酸系樹脂多孔質体及びその製造方法

Also Published As

Publication number Publication date
RU2549783C2 (ru) 2015-04-27
WO2012029789A1 (ja) 2012-03-08
CN103079744A (zh) 2013-05-01
EP2612722A4 (en) 2017-03-08
MY160929A (en) 2017-03-31
JP5527635B2 (ja) 2014-06-18
CN103079744B (zh) 2016-11-09
US20140030634A1 (en) 2014-01-30
BR112013004959A2 (pt) 2016-08-16
JPWO2012029789A1 (ja) 2013-10-28
EP2612722B1 (en) 2020-03-11
RU2013110495A (ru) 2014-10-10
MX2013001974A (es) 2013-04-03
EP2612722A1 (en) 2013-07-10
US10556292B2 (en) 2020-02-11
BR112013004959B1 (pt) 2018-11-06

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