TW201611939A - Method for sealing package, and sealing paste - Google Patents

Method for sealing package, and sealing paste

Info

Publication number
TW201611939A
TW201611939A TW104119078A TW104119078A TW201611939A TW 201611939 A TW201611939 A TW 201611939A TW 104119078 A TW104119078 A TW 104119078A TW 104119078 A TW104119078 A TW 104119078A TW 201611939 A TW201611939 A TW 201611939A
Authority
TW
Taiwan
Prior art keywords
package
lid
sealing
brazing
melting
Prior art date
Application number
TW104119078A
Other languages
Chinese (zh)
Other versions
TWI645930B (en
Inventor
Masayuki Ishikawa
Yoshifumi Yamamoto
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of TW201611939A publication Critical patent/TW201611939A/en
Application granted granted Critical
Publication of TWI645930B publication Critical patent/TWI645930B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/164—Material
    • H01L2924/165—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

A method for sealing a package by putting a lid on the package and bonding the lid to the package with a brazing alloy, the method comprising: a paste application step in which a sealing paste containing a low-melting-point metal powder having a melting point less than 300 DEG C and a high-melting-point metal powder, as another powder, that has a melting point of 300 DEG C or higher is applied to a surface of the lid; a preliminary heat treatment step in which the low-melting-point metal powder in the sealing paste applied to the lid is melted to form a brazing-material precursor; and an alloying step in which the brazing-material precursor is heated and kept molten until the lid is bonded to the package or the brazing-material precursor is heated and melted when the lid is bonded to the package, thereby alloying the brazing-material precursor.
TW104119078A 2014-06-13 2015-06-12 Package sealing method and sealing paste TWI645930B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-122383 2014-06-13
JP2014122383 2014-06-13
JP2015116243A JP6488896B2 (en) 2014-06-13 2015-06-09 Package sealing method and sealing paste
JP2015-116243 2015-06-09

Publications (2)

Publication Number Publication Date
TW201611939A true TW201611939A (en) 2016-04-01
TWI645930B TWI645930B (en) 2019-01-01

Family

ID=54833591

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104119078A TWI645930B (en) 2014-06-13 2015-06-12 Package sealing method and sealing paste

Country Status (4)

Country Link
JP (1) JP6488896B2 (en)
KR (1) KR102229041B1 (en)
TW (1) TWI645930B (en)
WO (1) WO2015190501A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6575301B2 (en) * 2014-10-31 2019-09-18 三菱マテリアル株式会社 Sealing paste, brazing joint material and method for producing the same, sealing lid material and method for producing the same, and package sealing method
TWI655717B (en) * 2014-10-31 2019-04-01 日商三菱綜合材料股份有限公司 Sealing paste, hard soldering material, manufacturing method thereof, sealing cover material, manufacturing method thereof, and package sealing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146627B2 (en) * 1972-01-24 1976-12-10
JP2520334B2 (en) * 1991-07-22 1996-07-31 日本碍子株式会社 Active metal brazing material and method for joining metal member and ceramic member using active metal brazing material
JP2002160090A (en) * 2000-11-27 2002-06-04 Tanaka Kikinzoku Kogyo Kk Ag-Cu-In-BASED BRAZING FILLER MATERIAL AND METHOD FOR PRODUCING THE SAME
JP2003163299A (en) * 2001-11-29 2003-06-06 Nippon Filcon Co Ltd Sealing cap for electronic element package and its manufacturing method as well as method for sealing using the cap
JP2006049595A (en) 2004-08-05 2006-02-16 Tanaka Kikinzoku Kogyo Kk Silver solder cladding material, and lid and ring for package sealing
JP2007059746A (en) * 2005-08-26 2007-03-08 Kyocera Corp Electronic component storage package and electronic apparatus
JP5065718B2 (en) 2006-06-20 2012-11-07 田中貴金属工業株式会社 Hermetic sealing method of piezoelectric element and manufacturing method of piezoelectric device
JP5119866B2 (en) * 2007-03-22 2013-01-16 セイコーエプソン株式会社 Quartz device and sealing method thereof
JP2009183008A (en) * 2009-05-21 2009-08-13 Murata Mfg Co Ltd Method of manufacturing piezoelectric component
JP2011222663A (en) * 2010-04-07 2011-11-04 Mitsubishi Electric Corp Ceramic package and manufacturing method of the same, as well as ceramic module
JP5146627B2 (en) * 2011-02-15 2013-02-20 株式会社村田製作所 Multilayer wiring board and manufacturing method thereof

Also Published As

Publication number Publication date
WO2015190501A1 (en) 2015-12-17
KR102229041B1 (en) 2021-03-16
JP6488896B2 (en) 2019-03-27
KR20170018300A (en) 2017-02-17
TWI645930B (en) 2019-01-01
JP2016015483A (en) 2016-01-28

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