BR112013004959A2 - método de união de metal à base de alumínio - Google Patents
método de união de metal à base de alumínioInfo
- Publication number
- BR112013004959A2 BR112013004959A2 BR112013004959A BR112013004959A BR112013004959A2 BR 112013004959 A2 BR112013004959 A2 BR 112013004959A2 BR 112013004959 A BR112013004959 A BR 112013004959A BR 112013004959 A BR112013004959 A BR 112013004959A BR 112013004959 A2 BR112013004959 A2 BR 112013004959A2
- Authority
- BR
- Brazil
- Prior art keywords
- materials
- aluminum
- based metal
- eutectic reaction
- joining method
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2336—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer both layers being aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12729—Group IIA metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
- Y10T428/1275—Next to Group VIII or IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
- Y10T428/12764—Next to Al-base component
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Die Bonding (AREA)
- Cylinder Crankcases Of Internal Combustion Engines (AREA)
Abstract
método de união de metal à base de alumínio. a presente invenção refere-se a um método de ligação de baixo custo no qual é possível ligar materiais constituídos de um metal à base de alumínio uns aos outros em baixa temperatura e baixa pressão no ar e ao mesmo tempo inibir a deformação, dispensando o uso de um fluxo de ar e minimizar a influência sobre os materiais de base e áreas próximas. são ainda fornecidas várias partes ligadas obtidas pela aplicação do método de ligação. um material de inserto (2) compreendendo zn como elemento que passa por uma reação eutética com o al é intercalado entre os materiais (1,1) constituído por um metal à base de alumínio. os dois materiais (1,1) são aquecidos, enquanto comprimidos um contra o outro, até uma temperatura em que ocorra a reação eutética, gerando desta maneira, na interface de ligação entre os dois materiais (1,1), uma fusão decorrente da reação eutética com parte do al contido nos materiais de base e liberando filmes de óxido de al (1a) da interface de ligação com a fusão. dessa maneira, os materiais são ligados.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-193519 | 2010-08-31 | ||
JP2010193519 | 2010-08-31 | ||
PCT/JP2011/069617 WO2012029789A1 (ja) | 2010-08-31 | 2011-08-30 | アルミニウム系金属の接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112013004959A2 true BR112013004959A2 (pt) | 2016-08-16 |
BR112013004959B1 BR112013004959B1 (pt) | 2018-11-06 |
Family
ID=45772871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112013004959-6A BR112013004959B1 (pt) | 2010-08-31 | 2011-08-30 | método de união de metal à base de alumínio e parte unida |
Country Status (9)
Country | Link |
---|---|
US (1) | US10556292B2 (pt) |
EP (1) | EP2612722B1 (pt) |
JP (1) | JP5527635B2 (pt) |
CN (1) | CN103079744B (pt) |
BR (1) | BR112013004959B1 (pt) |
MX (1) | MX357608B (pt) |
MY (1) | MY160929A (pt) |
RU (1) | RU2549783C2 (pt) |
WO (1) | WO2012029789A1 (pt) |
Families Citing this family (15)
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US9624137B2 (en) * | 2011-11-30 | 2017-04-18 | Component Re-Engineering Company, Inc. | Low temperature method for hermetically joining non-diffusing ceramic materials |
US10022816B2 (en) | 2013-08-01 | 2018-07-17 | Nippon Steel & Sumitomo Metal Corporation | Friction welding method |
JP6260941B2 (ja) * | 2013-08-09 | 2018-01-24 | 日産自動車株式会社 | 半導体装置の製造方法 |
WO2016104399A1 (ja) | 2014-12-26 | 2016-06-30 | 国立大学法人群馬大学 | 金属部材の接合方法 |
JP6719176B2 (ja) * | 2015-03-30 | 2020-07-08 | 株式会社村田製作所 | アルミニウム部材の接合方法 |
JP6472323B2 (ja) * | 2015-05-18 | 2019-02-20 | タツタ電線株式会社 | 成膜方法 |
JP6454262B2 (ja) | 2015-12-24 | 2019-01-16 | タツタ電線株式会社 | 半田接続構造、および成膜方法 |
JP6681543B2 (ja) * | 2016-07-21 | 2020-04-15 | パナソニックIpマネジメント株式会社 | 溶接金属部材とその溶接金属部材を有する電池 |
JP6294537B1 (ja) * | 2017-01-20 | 2018-03-14 | 三菱アルミニウム株式会社 | ろう付け用混合組成物塗料 |
JP2018184852A (ja) * | 2017-04-25 | 2018-11-22 | 日立オートモティブシステムズ株式会社 | ピストン |
US20190105731A1 (en) * | 2017-10-06 | 2019-04-11 | GM Global Technology Operations LLC | Hot formed bonding in sheet metal panels |
CN107742606B (zh) * | 2017-10-30 | 2024-04-02 | 桂林电子科技大学 | 一种键合晶圆的结构及其制备方法 |
JP6516949B1 (ja) * | 2018-09-25 | 2019-05-22 | 三菱電機株式会社 | 金属接合体および金属接合体の製造方法、並びに半導体装置および導波路 |
CN115297986B (zh) * | 2020-03-27 | 2023-09-29 | 三菱电机株式会社 | 金属接合体、半导体装置、波导管及被接合构件的接合方法 |
CN111482686A (zh) * | 2020-04-23 | 2020-08-04 | 西安工业大学 | 一种金属焊接方法 |
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US4905887A (en) * | 1969-12-15 | 1990-03-06 | Heinz Schoer | Process for soldering aluminum containing workpieces |
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JPS6024286A (ja) * | 1983-07-20 | 1985-02-06 | Mitsubishi Heavy Ind Ltd | アルミニウム拡散接合方法 |
JPS6277932A (ja) * | 1985-10-02 | 1987-04-10 | 三菱重工業株式会社 | アルミニウム製伝熱面 |
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US5464146A (en) * | 1994-09-29 | 1995-11-07 | Ford Motor Company | Thin film brazing of aluminum shapes |
US5802716A (en) * | 1994-09-30 | 1998-09-08 | Toyota Jidosha Kabushiki Kaisha | Method for bonding a valve seat with a cylinder head |
JPH09250391A (ja) * | 1996-03-14 | 1997-09-22 | Yamaha Motor Co Ltd | 中空部を有する金属製品の成形方法 |
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GB9811860D0 (en) * | 1998-06-02 | 1998-07-29 | Univ Cambridge Tech | Bonding |
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RU2262153C2 (ru) | 2002-03-01 | 2005-10-10 | ЭйДжиЭнДжи, ЛЛСи. | Бесфлюсовая сборка полупроводниковых изделий размером с кристалл |
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CN101530947B (zh) * | 2009-04-08 | 2012-07-04 | 西安交通大学 | 一种搅拌摩擦钎焊制备双金属复合板的方法 |
JP5557388B2 (ja) * | 2010-10-15 | 2014-07-23 | 株式会社クレハ | 網目状構造を有するポリグリコール酸系樹脂多孔質体及びその製造方法 |
-
2011
- 2011-08-30 MY MYPI2013000625A patent/MY160929A/en unknown
- 2011-08-30 US US13/819,390 patent/US10556292B2/en active Active
- 2011-08-30 EP EP11821804.9A patent/EP2612722B1/en active Active
- 2011-08-30 RU RU2013110495/02A patent/RU2549783C2/ru active
- 2011-08-30 MX MX2013001974A patent/MX357608B/es active IP Right Grant
- 2011-08-30 CN CN201180042092.4A patent/CN103079744B/zh active Active
- 2011-08-30 WO PCT/JP2011/069617 patent/WO2012029789A1/ja active Application Filing
- 2011-08-30 BR BR112013004959-6A patent/BR112013004959B1/pt active IP Right Grant
- 2011-08-30 JP JP2012531894A patent/JP5527635B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
BR112013004959B1 (pt) | 2018-11-06 |
RU2013110495A (ru) | 2014-10-10 |
EP2612722A4 (en) | 2017-03-08 |
WO2012029789A1 (ja) | 2012-03-08 |
US10556292B2 (en) | 2020-02-11 |
EP2612722A1 (en) | 2013-07-10 |
MY160929A (en) | 2017-03-31 |
RU2549783C2 (ru) | 2015-04-27 |
EP2612722B1 (en) | 2020-03-11 |
CN103079744B (zh) | 2016-11-09 |
JPWO2012029789A1 (ja) | 2013-10-28 |
MX357608B (es) | 2018-07-17 |
JP5527635B2 (ja) | 2014-06-18 |
US20140030634A1 (en) | 2014-01-30 |
CN103079744A (zh) | 2013-05-01 |
MX2013001974A (es) | 2013-04-03 |
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