BR112013004959A2 - método de união de metal à base de alumínio - Google Patents

método de união de metal à base de alumínio

Info

Publication number
BR112013004959A2
BR112013004959A2 BR112013004959A BR112013004959A BR112013004959A2 BR 112013004959 A2 BR112013004959 A2 BR 112013004959A2 BR 112013004959 A BR112013004959 A BR 112013004959A BR 112013004959 A BR112013004959 A BR 112013004959A BR 112013004959 A2 BR112013004959 A2 BR 112013004959A2
Authority
BR
Brazil
Prior art keywords
materials
aluminum
based metal
eutectic reaction
joining method
Prior art date
Application number
BR112013004959A
Other languages
English (en)
Other versions
BR112013004959B1 (pt
Inventor
Akio Hirose
Chika Yamamoto
Kenji Miyamoto
Masayuki Inoue
Toshikazu Nanbu
Yoshitaka Uehara
Original Assignee
Nissan Motor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor filed Critical Nissan Motor
Publication of BR112013004959A2 publication Critical patent/BR112013004959A2/pt
Publication of BR112013004959B1 publication Critical patent/BR112013004959B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2336—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer both layers being aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12729—Group IIA metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/1275—Next to Group VIII or IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/12764—Next to Al-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Die Bonding (AREA)
  • Cylinder Crankcases Of Internal Combustion Engines (AREA)

Abstract

método de união de metal à base de alumínio. a presente invenção refere-se a um método de ligação de baixo custo no qual é possível ligar materiais constituídos de um metal à base de alumínio uns aos outros em baixa temperatura e baixa pressão no ar e ao mesmo tempo inibir a deformação, dispensando o uso de um fluxo de ar e minimizar a influência sobre os materiais de base e áreas próximas. são ainda fornecidas várias partes ligadas obtidas pela aplicação do método de ligação. um material de inserto (2) compreendendo zn como elemento que passa por uma reação eutética com o al é intercalado entre os materiais (1,1) constituído por um metal à base de alumínio. os dois materiais (1,1) são aquecidos, enquanto comprimidos um contra o outro, até uma temperatura em que ocorra a reação eutética, gerando desta maneira, na interface de ligação entre os dois materiais (1,1), uma fusão decorrente da reação eutética com parte do al contido nos materiais de base e liberando filmes de óxido de al (1a) da interface de ligação com a fusão. dessa maneira, os materiais são ligados.
BR112013004959-6A 2010-08-31 2011-08-30 método de união de metal à base de alumínio e parte unida BR112013004959B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-193519 2010-08-31
JP2010193519 2010-08-31
PCT/JP2011/069617 WO2012029789A1 (ja) 2010-08-31 2011-08-30 アルミニウム系金属の接合方法

Publications (2)

Publication Number Publication Date
BR112013004959A2 true BR112013004959A2 (pt) 2016-08-16
BR112013004959B1 BR112013004959B1 (pt) 2018-11-06

Family

ID=45772871

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013004959-6A BR112013004959B1 (pt) 2010-08-31 2011-08-30 método de união de metal à base de alumínio e parte unida

Country Status (9)

Country Link
US (1) US10556292B2 (pt)
EP (1) EP2612722B1 (pt)
JP (1) JP5527635B2 (pt)
CN (1) CN103079744B (pt)
BR (1) BR112013004959B1 (pt)
MX (1) MX357608B (pt)
MY (1) MY160929A (pt)
RU (1) RU2549783C2 (pt)
WO (1) WO2012029789A1 (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9624137B2 (en) * 2011-11-30 2017-04-18 Component Re-Engineering Company, Inc. Low temperature method for hermetically joining non-diffusing ceramic materials
US10022816B2 (en) 2013-08-01 2018-07-17 Nippon Steel & Sumitomo Metal Corporation Friction welding method
JP6260941B2 (ja) * 2013-08-09 2018-01-24 日産自動車株式会社 半導体装置の製造方法
WO2016104399A1 (ja) 2014-12-26 2016-06-30 国立大学法人群馬大学 金属部材の接合方法
JP6719176B2 (ja) * 2015-03-30 2020-07-08 株式会社村田製作所 アルミニウム部材の接合方法
JP6472323B2 (ja) * 2015-05-18 2019-02-20 タツタ電線株式会社 成膜方法
JP6454262B2 (ja) 2015-12-24 2019-01-16 タツタ電線株式会社 半田接続構造、および成膜方法
JP6681543B2 (ja) * 2016-07-21 2020-04-15 パナソニックＩｐマネジメント株式会社 溶接金属部材とその溶接金属部材を有する電池
JP6294537B1 (ja) * 2017-01-20 2018-03-14 三菱アルミニウム株式会社 ろう付け用混合組成物塗料
JP2018184852A (ja) * 2017-04-25 2018-11-22 日立オートモティブシステムズ株式会社 ピストン
US20190105731A1 (en) * 2017-10-06 2019-04-11 GM Global Technology Operations LLC Hot formed bonding in sheet metal panels
CN107742606B (zh) * 2017-10-30 2024-04-02 桂林电子科技大学 一种键合晶圆的结构及其制备方法
JP6516949B1 (ja) * 2018-09-25 2019-05-22 三菱電機株式会社 金属接合体および金属接合体の製造方法、並びに半導体装置および導波路
CN115297986B (zh) * 2020-03-27 2023-09-29 三菱电机株式会社 金属接合体、半导体装置、波导管及被接合构件的接合方法
CN111482686A (zh) * 2020-04-23 2020-08-04 西安工业大学 一种金属焊接方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3121785A (en) * 1961-11-14 1964-02-18 Aluminum Co Of America Fusion-pressure joining of aluminum alloy members
US4905887A (en) * 1969-12-15 1990-03-06 Heinz Schoer Process for soldering aluminum containing workpieces
US3811177A (en) * 1969-12-15 1974-05-21 Vaw Ver Aluminium Werke Ag Process for brazing workpieces of aluminum containing material
GB1532628A (en) * 1974-11-15 1978-11-15 Ass Eng Ltd Metal bonding method
JPS54133450A (en) * 1978-04-10 1979-10-17 Hitachi Ltd Diffusion bonding method for different kind metal
JPS5557388A (en) * 1978-10-20 1980-04-28 Hitachi Ltd Pressure welding method of aluminum member
US4615952A (en) * 1982-10-29 1986-10-07 Norsk Hydro A.S. Aluminum shapes coated with brazing material and process of coating
JPS6024286A (ja) * 1983-07-20 1985-02-06 Mitsubishi Heavy Ind Ltd アルミニウム拡散接合方法
JPS6277932A (ja) * 1985-10-02 1987-04-10 三菱重工業株式会社 アルミニウム製伝熱面
US4979664A (en) * 1989-11-15 1990-12-25 At&T Bell Laboratories Method for manufacturing a soldered article
US5464146A (en) * 1994-09-29 1995-11-07 Ford Motor Company Thin film brazing of aluminum shapes
US5802716A (en) * 1994-09-30 1998-09-08 Toyota Jidosha Kabushiki Kaisha Method for bonding a valve seat with a cylinder head
JPH09250391A (ja) * 1996-03-14 1997-09-22 Yamaha Motor Co Ltd 中空部を有する金属製品の成形方法
JPH11172354A (ja) 1997-12-04 1999-06-29 Sumitomo Metal Mining Co Ltd 高温はんだ付用Ｚｎ合金
JP3835582B2 (ja) * 1998-01-26 2006-10-18 住友金属鉱山株式会社 高温はんだ付用Ｚｎ合金
GB9811860D0 (en) * 1998-06-02 1998-07-29 Univ Cambridge Tech Bonding
JP2000301355A (ja) * 1999-04-14 2000-10-31 Shinei Sangyo Kk 同種金属部材の共晶圧接方法及び共晶圧接用装置
AUPR622001A0 (en) * 2001-07-06 2001-08-02 Crampton, John Leonard Improved method and apparatus for spreading of aggregate and road building materials
US6815086B2 (en) * 2001-11-21 2004-11-09 Dana Canada Corporation Methods for fluxless brazing
US7451906B2 (en) * 2001-11-21 2008-11-18 Dana Canada Corporation Products for use in low temperature fluxless brazing
RU2262153C2 (ru) 2002-03-01 2005-10-10 ЭйДжиЭнДжи, ЛЛСи. Бесфлюсовая сборка полупроводниковых изделий размером с кристалл
WO2003075337A1 (en) 2002-03-01 2003-09-12 Agng, Llc Fluxless assembly of chip size semiconductor packages
JP3928488B2 (ja) * 2002-06-04 2007-06-13 富士電機デバイステクノロジー株式会社 半導体装置およびその製造方法
US7722922B2 (en) * 2003-10-20 2010-05-25 Furukawa-Sky Aluminum Corp. Coating apparatus for an aluminum alloy heat exchanger member, method of producing a heat exchanger member, and aluminum alloy heat exchanger member
US7565996B2 (en) * 2004-10-04 2009-07-28 United Technologies Corp. Transient liquid phase bonding using sandwich interlayers
US7850059B2 (en) * 2004-12-24 2010-12-14 Nissan Motor Co., Ltd. Dissimilar metal joining method
JP4531591B2 (ja) * 2005-03-03 2010-08-25 本田技研工業株式会社 アルミニウム系部材の接合方法
US7498543B2 (en) * 2006-03-22 2009-03-03 Gm Global Technology Operations, Inc. Method for joining or repairing metal surface parts
JP4961532B2 (ja) * 2006-07-25 2012-06-27 日産自動車株式会社 異種金属の接合方法及び装置
JP5186796B2 (ja) * 2007-04-19 2013-04-24 日産自動車株式会社 異種金属の接合方法及び接合構造
JP5151270B2 (ja) * 2007-06-26 2013-02-27 日産自動車株式会社 燃料電池構成部材
CN101530947B (zh) * 2009-04-08 2012-07-04 西安交通大学 一种搅拌摩擦钎焊制备双金属复合板的方法
JP5557388B2 (ja) * 2010-10-15 2014-07-23 株式会社クレハ 網目状構造を有するポリグリコール酸系樹脂多孔質体及びその製造方法

Also Published As

Publication number Publication date
BR112013004959B1 (pt) 2018-11-06
RU2013110495A (ru) 2014-10-10
EP2612722A4 (en) 2017-03-08
WO2012029789A1 (ja) 2012-03-08
US10556292B2 (en) 2020-02-11
EP2612722A1 (en) 2013-07-10
MY160929A (en) 2017-03-31
RU2549783C2 (ru) 2015-04-27
EP2612722B1 (en) 2020-03-11
CN103079744B (zh) 2016-11-09
JPWO2012029789A1 (ja) 2013-10-28
MX357608B (es) 2018-07-17
JP5527635B2 (ja) 2014-06-18
US20140030634A1 (en) 2014-01-30
CN103079744A (zh) 2013-05-01
MX2013001974A (es) 2013-04-03

Similar Documents

Publication Publication Date Title
BR112013004959A2 (pt) método de união de metal à base de alumínio
BR112016011647A2 (pt) Adesivo, membro com face adesiva, e método para conexão entre membros
BRPI1014238A2 (pt) Estrutura de assento e método para sua formação, usando um adesivo aquecido a laser
BR112016029780A2 (pt) composições adesivas de epóxi de cura rápida
BRPI0805512A8 (pt) Aperfeiçoamento introduzido em laminado de embalagem por película à vácuo, a embalagem e o processo para a utilização dos mesmos
BR112014008953A2 (pt) adesivos de contato a frio
CO2017002335A2 (es) Una composición de adhesivo termofusible elástico y un material compuesto elástico elaborado con esta
MX2018014214A (es) Sistema de adhesivo curable de cianoacrilato en dos partes.
BR112018010315A2 (pt) adesivo estrutural com modo de falha aprimorado
BRPI0916310A2 (pt) Método para aplicar tiras de borda em superfícies estreitas, em particular de peças em elaboração conformadas em placa e peças em elaboração obtidas em dita maneira
BR112015024217A2 (pt) aparelho para dispensa de etiquetas adesivas sensíveis à pressão sobre um substrato
PH12014502119A1 (en) Method for joining metal parts
BR112015017902A2 (pt) dispositivo de air bag e método de cobertura para corpo de air bag
BRPI0700100A (pt) composição curável em uma parte, adesivo, espuma, selante, elastÈmero, revestimento, e, métodos para preparar uma composição em uma parte, e para ligar pelo menos dois substratos
BR112015022652A2 (pt) método de formação de ligações adesivas
AR108329A1 (es) Composiciones adhesivas sin solvente de dos componentes que comprenden un poliol iniciado con amina
WO2016127056A8 (en) Label assemblies for adverse environments
BR112012019017A2 (pt) aparelho de vedação
BR112015028073A2 (pt) ferramental para anexar reforço de metal no bordo de ataque de uma pá de motor de turbina e método que utiliza tal ferramental
BR112014009854A2 (pt) método de produção de embalagem de fita adesiva sensível à pressão
EP3415582A4 (en) ADHESIVE RESIN COMPOSITION, METHOD FOR JOINING SUPPLEMENTS AND ADHESIVE SHEET
BR112014026753A2 (pt) dispositivo para a medida de parâmetro ultrassono ou biomecânico de meio viscoelástico
BR112018003478A2 (pt) composição adesiva aperfeiçoada para reforçar junções em construção de painel de gesso
BR112014012722A2 (pt) conexão de um primeiro componente metálico com um segundo componente metálico coberto
BR112015014699A2 (pt) película de silicone

Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 30/08/2011, OBSERVADAS AS CONDICOES LEGAIS.