MX337390B - Aparato de recubrimiento de placa de calcografia. - Google Patents

Aparato de recubrimiento de placa de calcografia.

Info

Publication number
MX337390B
MX337390B MX2014012228A MX2014012228A MX337390B MX 337390 B MX337390 B MX 337390B MX 2014012228 A MX2014012228 A MX 2014012228A MX 2014012228 A MX2014012228 A MX 2014012228A MX 337390 B MX337390 B MX 337390B
Authority
MX
Mexico
Prior art keywords
printing plate
intaglio printing
vacuum chamber
coating material
inner space
Prior art date
Application number
MX2014012228A
Other languages
English (en)
Spanish (es)
Other versions
MX2014012228A (es
Inventor
Laurent Claude
Francois Gremion
Original Assignee
Kba Notasys Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=48536956&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX337390(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kba Notasys Sa filed Critical Kba Notasys Sa
Publication of MX2014012228A publication Critical patent/MX2014012228A/es
Publication of MX337390B publication Critical patent/MX337390B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F9/00—Rotary intaglio printing presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N3/00—Preparing for use and conserving printing surfaces
    • B41N3/003—Preparing for use and conserving printing surfaces of intaglio formes, e.g. application of a wear-resistant coating, such as chrome, on the already-engraved plate or cylinder; Preparing for reuse, e.g. removing of the Ballard shell; Correction of the engraving
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/46—Sputtering by ion beam produced by an external ion source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C3/00—Reproduction or duplicating of printing formes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
MX2014012228A 2012-04-12 2013-04-12 Aparato de recubrimiento de placa de calcografia. MX337390B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12163838.1A EP2650135A1 (en) 2012-04-12 2012-04-12 Intaglio printing plate coating apparatus
PCT/IB2013/052923 WO2013153536A2 (en) 2012-04-12 2013-04-12 Intaglio printing plate coating apparatus

Publications (2)

Publication Number Publication Date
MX2014012228A MX2014012228A (es) 2014-12-05
MX337390B true MX337390B (es) 2016-03-02

Family

ID=48536956

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014012228A MX337390B (es) 2012-04-12 2013-04-12 Aparato de recubrimiento de placa de calcografia.

Country Status (18)

Country Link
US (2) US9646809B2 (ru)
EP (3) EP2650135A1 (ru)
JP (2) JP6254578B2 (ru)
KR (1) KR20150003298A (ru)
CN (1) CN104321200B (ru)
AU (1) AU2013248150B2 (ru)
CA (1) CA2870101C (ru)
ES (2) ES2593843T3 (ru)
HU (1) HUE036525T2 (ru)
IN (1) IN2014DN08411A (ru)
MX (1) MX337390B (ru)
MY (1) MY168047A (ru)
PH (1) PH12014502149A1 (ru)
PL (1) PL2836370T3 (ru)
RU (1) RU2618683C2 (ru)
UA (1) UA116343C2 (ru)
WO (1) WO2013153536A2 (ru)
ZA (1) ZA201408189B (ru)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2650135A1 (en) * 2012-04-12 2013-10-16 KBA-NotaSys SA Intaglio printing plate coating apparatus
ITUB20155663A1 (it) * 2015-11-17 2017-05-17 Protec Surface Tech Srl Processo di realizzazione di una lastra calcografica
CN105568234B (zh) * 2016-01-28 2018-01-19 信利（惠州）智能显示有限公司 一种连续式镀膜装置
CN113812017A (zh) 2019-09-24 2021-12-17 株式会社Lg新能源 具有图案的锂硫二次电池用正极、其制造方法以及包含所述正极的锂硫二次电池
EP3878659B1 (en) 2020-03-09 2023-07-19 Emea Inor Eood Coated intaglio printing plate
DE102021002867A1 (de) 2021-06-02 2022-12-08 Giesecke+Devrient Currency Technology Gmbh Stichtiefdruckplatte mit verlängerter Haltbarkeitsdauer und Verfahren zu deren Herstellung

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3839037A (en) * 1971-08-12 1974-10-01 Fromson H A Light-sensitive structure
JPS51117933A (en) * 1975-04-10 1976-10-16 Tokuda Seisakusho Spattering apparatus
US4274936A (en) * 1979-04-30 1981-06-23 Advanced Coating Technology, Inc. Vacuum deposition system and method
JPS57140875A (en) * 1981-02-25 1982-08-31 Toppan Printing Co Ltd Continuous sputtering method
JPS6283467A (ja) * 1985-10-09 1987-04-16 Sharp Corp パレツト移動型スパツタリング装置
JPS62257845A (ja) * 1986-05-02 1987-11-10 Musashino Kikai Sekkei Jimusho:Kk 彫刻ロ−ルの表面硬化方法
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
US4851095A (en) * 1988-02-08 1989-07-25 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
US5135629A (en) * 1989-06-12 1992-08-04 Nippon Mining Co., Ltd. Thin film deposition system
US5252360A (en) 1990-03-15 1993-10-12 Huettl Wolfgang Process for the protection of an engraved roll or plate by coating an engraved surface with an interlayer and thereafter applying a wear-resistant layer to the interlayer by PVD
DE4008254A1 (de) 1990-03-15 1991-09-19 Huettl & Vester Gmbh Verfahren zum herstellen von gravierten walzen oder platten
EP0577766B1 (en) 1991-04-04 1999-12-29 Seagate Technology, Inc. Apparatus and method for high throughput sputtering
JPH06200372A (ja) * 1992-12-30 1994-07-19 Sony Corp スパッタ装置
US5744011A (en) * 1993-03-18 1998-04-28 Kabushiki Kaisha Toshiba Sputtering apparatus and sputtering method
DE19516883A1 (de) * 1994-05-13 1995-11-16 Merck Patent Gmbh Tiefdruckform
DE4428136A1 (de) * 1994-08-09 1996-02-15 Leybold Ag Vakuum-Beschichtungsanlage
JP3732250B2 (ja) 1995-03-30 2006-01-05 キヤノンアネルバ株式会社 インライン式成膜装置
US5979225A (en) 1997-08-26 1999-11-09 Applied Materials, Inc. Diagnosis process of vacuum failure in a vacuum chamber
DE19740793C2 (de) * 1997-09-17 2003-03-20 Bosch Gmbh Robert Verfahren zur Beschichtung von Oberflächen mittels einer Anlage mit Sputterelektroden und Verwendung des Verfahrens
JP4034860B2 (ja) * 1997-10-31 2008-01-16 キヤノンアネルバ株式会社 トレイ搬送式成膜装置及び補助チャンバー
JP3544907B2 (ja) * 1999-10-15 2004-07-21 株式会社不二越 マグネトロンスパッタ装置
US20020046945A1 (en) * 1999-10-28 2002-04-25 Applied Materials, Inc. High performance magnetron for DC sputtering systems
JP4856308B2 (ja) * 2000-12-27 2012-01-18 キヤノンアネルバ株式会社 基板処理装置及び経由チャンバー
JP2002309372A (ja) * 2001-04-13 2002-10-23 Canon Inc インライン式成膜装置、成膜方法及び液晶素子
JP4088822B2 (ja) * 2002-05-15 2008-05-21 株式会社アルバック 縦型スパッタリングカソード開閉装置
EP1369230A1 (en) 2002-06-05 2003-12-10 Kba-Giori S.A. Method of manufacturing an engraved plate
JP4142370B2 (ja) * 2002-08-09 2008-09-03 株式会社神戸製鋼所 α型結晶構造主体のアルミナ膜の製造方法
DE10341244A1 (de) 2003-09-03 2005-05-12 Creavac Creative Vakuumbeschic Einrichtung zur Vakuumbeschichtung wenigstens einer Aufzeichnungsschicht auf mindestens ein optisches Aufzeichnungsmedium
DE10352144B8 (de) 2003-11-04 2008-11-13 Von Ardenne Anlagentechnik Gmbh Vakuumbeschichtungsanlage zum Beschichten von längserstreckten Substraten
US7678198B2 (en) * 2004-08-12 2010-03-16 Cardinal Cg Company Vertical-offset coater
DK1630260T3 (da) * 2004-08-20 2011-10-31 Jds Uniphase Inc Magnetisk holdemekanisme til et dampudfældningssystem
JP2008524035A (ja) * 2004-12-22 2008-07-10 ペーター アルサー ベーマー、 再使用可能なオフセット印刷シートおよびそのような印刷シートを製造する方法
JP4612516B2 (ja) * 2005-09-29 2011-01-12 大日本印刷株式会社 スパッタ装置およびスパッタ装置用キャリア
EP1844929A1 (fr) 2006-04-13 2007-10-17 Kba-Giori S.A. Procédé de génération de motifs représentant une image en demi-teintes
JP2008121034A (ja) * 2006-11-08 2008-05-29 Kochi Prefecture Sangyo Shinko Center 酸化亜鉛薄膜の成膜方法及び成膜装置
JP5081516B2 (ja) * 2007-07-12 2012-11-28 株式会社ジャパンディスプレイイースト 蒸着方法および蒸着装置
EP2119527A1 (en) 2008-05-16 2009-11-18 Kba-Giori S.A. Method and system for manufacturing intaglio printing plates for the production of security papers
KR20110056392A (ko) * 2008-08-25 2011-05-27 어플라이드 머티어리얼스, 인코포레이티드 이동식 쉴드를 구비한 코팅 챔버
US8043487B2 (en) * 2008-12-12 2011-10-25 Fujifilm Corporation Chamber shield for vacuum physical vapor deposition
ITMI20090933A1 (it) 2009-05-27 2010-11-28 Protec Surface Technologies S R L Apparato per la deposizione di film di rivestimento
US8303779B2 (en) * 2009-12-16 2012-11-06 Primestar Solar, Inc. Methods for forming a transparent conductive oxide layer on a substrate
JP5731838B2 (ja) * 2010-02-10 2015-06-10 キヤノンアネルバ株式会社 トレイ式基板搬送システム、成膜方法及び電子装置の製造方法
JP5743266B2 (ja) * 2010-08-06 2015-07-01 キヤノンアネルバ株式会社 成膜装置及びキャリブレーション方法
CN102002668B (zh) * 2010-09-28 2012-11-28 大连理工大学 多晶硅薄膜低温物理气相沉积装置及其方法
EP2650135A1 (en) * 2012-04-12 2013-10-16 KBA-NotaSys SA Intaglio printing plate coating apparatus

Also Published As

Publication number Publication date
US20170241011A1 (en) 2017-08-24
JP6254578B2 (ja) 2017-12-27
MX2014012228A (es) 2014-12-05
ES2661922T3 (es) 2018-04-04
CN104321200B (zh) 2016-08-24
PH12014502149B1 (en) 2014-12-01
ZA201408189B (en) 2016-08-31
ES2593843T3 (es) 2016-12-13
US20150075979A1 (en) 2015-03-19
KR20150003298A (ko) 2015-01-08
RU2618683C2 (ru) 2017-05-10
CA2870101A1 (en) 2013-10-17
AU2013248150B2 (en) 2016-09-08
JP2018058374A (ja) 2018-04-12
US9970096B2 (en) 2018-05-15
PH12014502149A1 (en) 2014-12-01
HUE036525T2 (hu) 2018-07-30
JP6438558B2 (ja) 2018-12-12
WO2013153536A2 (en) 2013-10-17
PL2836370T3 (pl) 2016-12-30
JP2015518521A (ja) 2015-07-02
UA116343C2 (uk) 2018-03-12
CN104321200A (zh) 2015-01-28
EP2836370B1 (en) 2016-07-27
RU2014142802A (ru) 2016-06-10
IN2014DN08411A (ru) 2015-05-08
CA2870101C (en) 2019-11-05
US9646809B2 (en) 2017-05-09
EP2836370A2 (en) 2015-02-18
WO2013153536A3 (en) 2014-11-06
AU2013248150A1 (en) 2014-11-27
MY168047A (en) 2018-10-11
EP3103650A1 (en) 2016-12-14
EP3103650B1 (en) 2018-01-17
EP2650135A1 (en) 2013-10-16

Similar Documents

Publication Publication Date Title
PH12014502149B1 (en) Intaglio printing plate coating apparatus
SG165295A1 (en) Electron beam vapor deposition apparatus for depositing multi-layer coating
WO2017056124A8 (en) Method and apparatus for photo-curing with self-lubricating substratum for the formation of three-dimensional objects
WO2012096466A3 (ko) 박막 증착 장치 및 이를 포함한 기판 처리 시스템
WO2017116668A3 (en) Method and apparatus for applying a material onto articles using a continuous transfer component
MY171465A (en) Method to produce highly transparent hydrogenated carbon protective coating for transparent substrates
MX343812B (es) Tambor giratorio para su uso en un criodesecador al vacío.
WO2010065473A3 (en) Gas distribution blocker apparatus
MX2017010590A (es) Pelicula laminada para decorar un producto moldeado tridimensional por medio de la formacion por vacio, metodo de produccion de la misma, y metodo para decorar un producto moldeado tridimensional.
WO2008106545A3 (en) Pecvd process chamber backing plate reinforcement
TW201613028A (en) Supporting glass substrate and laminate using same
TW200940734A (en) Sputtering apparatus and film deposition method
WO2008136337A1 (ja) スパッタリング装置及びスパッタリング方法
MX2010000646A (es) Aparato para la deposicion de plasma.
MX2016016573A (es) Blanco de pulverizacion.
WO2012091390A3 (en) Dry coating apparatus
WO2018150173A3 (en) Apparatus and methods for depositing variable interference filters
SG165297A1 (en) Electron beam vapor deposition apparatus and method of coating
UA116262C2 (uk) Сталевий лист з цинковим покриттям
WO2018148243A3 (en) Substrate supports for a sputtering device
IN2015DN01861A (ru)
WO2016055166A3 (de) Verfahren zum beschichten eines substrats
MX337833B (es) Articulo depilatorio con sustrato.
MY185232A (en) Controlled radical assisted polymerization
WO2011094060A3 (en) Pump baffle design for integrated pump and sputter source

Legal Events

Date Code Title Description
FG Grant or registration