JPS57140875A - Continuous sputtering method - Google Patents
Continuous sputtering methodInfo
- Publication number
- JPS57140875A JPS57140875A JP2635981A JP2635981A JPS57140875A JP S57140875 A JPS57140875 A JP S57140875A JP 2635981 A JP2635981 A JP 2635981A JP 2635981 A JP2635981 A JP 2635981A JP S57140875 A JPS57140875 A JP S57140875A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- sputtering
- target
- hard
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Abstract
PURPOSE:To perform continuous sputtering with good productivity in the stage of forming a hard film on the surface of a metallic material by a sputtering method by passing a material to be treated successively through a pretreatment chamber, a sputtering chamber and a post-treatment chamber. CONSTITUTION:A material 9 to be treated such as cylinder, roll or the like is placed on a carriage 10, and is put into a posttreatment chamber 19. After gaseous Ar is introduced therein, the inside of the chamber is evacuated to a high degree of vacuum. With the material 9 as cathode, high frequency voltage is applied between said material and stainless steel anode 20, then the residual Ar in the atmosphere charges positive, and collides against the material 9 which is the cathode, thereby etching the surface shallow and roughening the surface. Next, the material is shifted into a sputtering chamber 22, where the material 9 is placed near a hard target 23 of Cr, TiN, TiC, etc., and with the target 23 as negative and the material 9 as positive, the material is subjected to a sputtering treatment, whereby the hard material of the target is stuck on the surface of the material 9. Next, the material is put into a post-treatment chamber 24, where the pressure is raised to the atmospheric pressure, after which the material is removed to the outside. If necessary, the surface may be buffed with a polisher 26.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2635981A JPS57140875A (en) | 1981-02-25 | 1981-02-25 | Continuous sputtering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2635981A JPS57140875A (en) | 1981-02-25 | 1981-02-25 | Continuous sputtering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57140875A true JPS57140875A (en) | 1982-08-31 |
Family
ID=12191283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2635981A Pending JPS57140875A (en) | 1981-02-25 | 1981-02-25 | Continuous sputtering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57140875A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6253849A (en) * | 1985-09-03 | 1987-03-09 | Tdk Corp | Manufacture of electrode of thermal head |
| JPS637365A (en) * | 1986-06-28 | 1988-01-13 | Pentel Kk | External part for ornamentation and production thereof |
| JPH01264910A (en) * | 1987-12-25 | 1989-10-23 | Sumitomo Electric Ind Ltd | Device for forming thin composite oxide superconducting film |
| JPH02303086A (en) * | 1989-05-17 | 1990-12-17 | Hitachi Ltd | Manufacture of printed wiring board, and sputter deposition equipment and copper-clad laminate therefor |
| FR2719603A1 (en) * | 1994-05-04 | 1995-11-10 | Combustible Nucleaire | Continuous magnetron sputtering machine. |
| JP2015518521A (en) * | 2012-04-12 | 2015-07-02 | カーベーアー−ノタシ ソシエテ アノニム | Intaglio printing plate coating equipment |
-
1981
- 1981-02-25 JP JP2635981A patent/JPS57140875A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6253849A (en) * | 1985-09-03 | 1987-03-09 | Tdk Corp | Manufacture of electrode of thermal head |
| JPS637365A (en) * | 1986-06-28 | 1988-01-13 | Pentel Kk | External part for ornamentation and production thereof |
| JPH01264910A (en) * | 1987-12-25 | 1989-10-23 | Sumitomo Electric Ind Ltd | Device for forming thin composite oxide superconducting film |
| JPH02303086A (en) * | 1989-05-17 | 1990-12-17 | Hitachi Ltd | Manufacture of printed wiring board, and sputter deposition equipment and copper-clad laminate therefor |
| FR2719603A1 (en) * | 1994-05-04 | 1995-11-10 | Combustible Nucleaire | Continuous magnetron sputtering machine. |
| WO1995030780A1 (en) * | 1994-05-04 | 1995-11-16 | Societe Industrielle De Combustible Nucleaire | Continuous magnetron sputtering machine |
| JP2015518521A (en) * | 2012-04-12 | 2015-07-02 | カーベーアー−ノタシ ソシエテ アノニム | Intaglio printing plate coating equipment |
| JP2018058374A (en) * | 2012-04-12 | 2018-04-12 | カーベーアー−ノタシ ソシエテ アノニム | Intaglio printing plate coating device |
| US9970096B2 (en) | 2012-04-12 | 2018-05-15 | Kba-Notasys Sa | Intaglio printing plate coating apparatus |
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