MX2019009532A - Dispositivo semiconductor y metodo de fabricacion del mismo. - Google Patents
Dispositivo semiconductor y metodo de fabricacion del mismo.Info
- Publication number
- MX2019009532A MX2019009532A MX2019009532A MX2019009532A MX2019009532A MX 2019009532 A MX2019009532 A MX 2019009532A MX 2019009532 A MX2019009532 A MX 2019009532A MX 2019009532 A MX2019009532 A MX 2019009532A MX 2019009532 A MX2019009532 A MX 2019009532A
- Authority
- MX
- Mexico
- Prior art keywords
- region
- conduction type
- semiconductor device
- electric conduction
- drift region
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7809—Vertical DMOS transistors, i.e. VDMOS transistors having both source and drain contacts on the same surface, i.e. Up-Drain VDMOS transistors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
- H01L29/7825—Lateral DMOS transistors, i.e. LDMOS transistors with trench gate electrode
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
Abstract
Se incluyen una primera región (4) de deriva del primer tipo de conductividad formada en una primera superficie principal de un sustrato (1), y una segunda región (41) de deriva del primer tipo de conductividad formada en la primera superficie principal del sustrato (1), la segunda región de deriva formada para llegar a una posición más profunda del sustrato (1) que una posición de la primera región (4) de deriva. Se incluyen adicionalmente una región de pozo del segundo tipo de conductividad en contacto con la segunda región de deriva, una región de fuente del primer tipo de conductividad formada para extenderse en una dirección perpendicular a una superficie de la región de pozo, y una región de drenaje del primer tipo de conductividad separada de la región de pozo, la región de drenaje formada para extenderse en una dirección perpendicular a una superficie de la primera región de deriva. Debido a que una trayectoria de flujo de los electrones después de pasar a través de un canal puede ser ensanchada, una resistencia puede ser reducida.
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PCT/JP2017/005333 WO2018150467A1 (ja) | 2017-02-14 | 2017-02-14 | 半導体装置および半導体装置の製造方法 |
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MX2019009532A true MX2019009532A (es) | 2019-09-16 |
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US (1) | US20200020775A1 (es) |
EP (1) | EP3584824A4 (es) |
JP (1) | JP6725055B2 (es) |
KR (1) | KR102056037B1 (es) |
CN (1) | CN110291620B (es) |
BR (1) | BR112019016822A2 (es) |
CA (1) | CA3053635C (es) |
MX (1) | MX2019009532A (es) |
MY (1) | MY186880A (es) |
RU (1) | RU2719569C1 (es) |
WO (1) | WO2018150467A1 (es) |
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JP6962457B2 (ja) * | 2018-04-19 | 2021-11-05 | 日産自動車株式会社 | 半導体装置及び半導体装置の製造方法 |
JP7354029B2 (ja) * | 2020-03-13 | 2023-10-02 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、電源回路、及び、コンピュータ |
US11894457B2 (en) * | 2020-05-09 | 2024-02-06 | Joulwatt Technology Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN114078707A (zh) * | 2020-08-21 | 2022-02-22 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
JPWO2022118055A1 (es) | 2020-12-01 | 2022-06-09 | ||
CN113394291A (zh) * | 2021-04-29 | 2021-09-14 | 电子科技大学 | 横向功率半导体器件 |
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JPH0418762A (ja) * | 1990-05-14 | 1992-01-22 | Hitachi Ltd | 絶縁ゲート形電界効果トランジスタ |
KR100553650B1 (ko) | 1997-06-23 | 2006-02-24 | 제임스 알버트 주니어 쿠퍼 | 폭이 넓은 밴드갭 반도체 내의 전력 소자 |
JP3405681B2 (ja) * | 1997-07-31 | 2003-05-12 | 株式会社東芝 | 半導体装置 |
JP4653704B2 (ja) | 1999-05-21 | 2011-03-16 | 関西電力株式会社 | 半導体装置 |
KR100445904B1 (ko) * | 2001-12-12 | 2004-08-25 | 한국전자통신연구원 | 소스 필드 플레이트를 갖는 드레인 확장형 모스 전계 효과트랜지스터 및그 제조방법 |
JP4677166B2 (ja) * | 2002-06-27 | 2011-04-27 | 三洋電機株式会社 | 半導体装置及びその製造方法 |
JP3941641B2 (ja) * | 2002-09-18 | 2007-07-04 | 日産自動車株式会社 | 炭化珪素半導体装置の製造方法とその製造方法によって製造される炭化珪素半導体装置 |
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JP4225177B2 (ja) * | 2002-12-18 | 2009-02-18 | 株式会社デンソー | 半導体装置およびその製造方法 |
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US7888734B2 (en) * | 2008-12-04 | 2011-02-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | High-voltage MOS devices having gates extending into recesses of substrates |
WO2011135995A1 (ja) * | 2010-04-26 | 2011-11-03 | 三菱電機株式会社 | 半導体装置 |
WO2012144271A1 (ja) * | 2011-04-19 | 2012-10-26 | 日産自動車株式会社 | 半導体装置およびその製造方法 |
KR101279256B1 (ko) * | 2011-08-31 | 2013-06-26 | 주식회사 케이이씨 | 전력 반도체 소자 |
KR101867953B1 (ko) * | 2011-12-22 | 2018-06-18 | 삼성전자주식회사 | 반도체 소자 및 반도체 소자의 형성 방법 |
US9136158B2 (en) * | 2012-03-09 | 2015-09-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lateral MOSFET with dielectric isolation trench |
KR101872942B1 (ko) * | 2012-03-29 | 2018-06-29 | 삼성전자주식회사 | 반도체 장치 |
KR101671651B1 (ko) * | 2012-10-16 | 2016-11-16 | 아사히 가세이 일렉트로닉스 가부시끼가이샤 | 전계 효과 트랜지스터 및 반도체 장치 |
US9142668B2 (en) * | 2013-03-13 | 2015-09-22 | Cree, Inc. | Field effect transistor devices with buried well protection regions |
US10861938B2 (en) * | 2013-07-19 | 2020-12-08 | Nissan Motor Co., Ltd. | Semiconductor device and method of manufacturing the same |
CN104518027B (zh) * | 2014-06-13 | 2019-06-11 | 上海华虹宏力半导体制造有限公司 | Ldmos器件及其制造方法 |
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2017
- 2017-02-14 CA CA3053635A patent/CA3053635C/en active Active
- 2017-02-14 CN CN201780086361.4A patent/CN110291620B/zh active Active
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- 2017-02-14 MY MYPI2019004603A patent/MY186880A/en unknown
- 2017-02-14 BR BR112019016822A patent/BR112019016822A2/pt not_active Application Discontinuation
- 2017-02-14 US US16/485,496 patent/US20200020775A1/en not_active Abandoned
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- 2017-02-14 RU RU2019128853A patent/RU2719569C1/ru active
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BR112019016822A2 (pt) | 2020-04-07 |
MY186880A (en) | 2021-08-26 |
KR102056037B1 (ko) | 2019-12-13 |
JP6725055B2 (ja) | 2020-07-15 |
KR20190112798A (ko) | 2019-10-07 |
CN110291620A (zh) | 2019-09-27 |
RU2719569C1 (ru) | 2020-04-21 |
WO2018150467A1 (ja) | 2018-08-23 |
JPWO2018150467A1 (ja) | 2019-12-12 |
EP3584824A1 (en) | 2019-12-25 |
CA3053635A1 (en) | 2018-08-23 |
CA3053635C (en) | 2020-08-18 |
EP3584824A4 (en) | 2020-08-05 |
CN110291620B (zh) | 2020-07-14 |
US20200020775A1 (en) | 2020-01-16 |
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