MX2009000593A - Procedimiento para depositar capas aislantes electricas. - Google Patents
Procedimiento para depositar capas aislantes electricas.Info
- Publication number
- MX2009000593A MX2009000593A MX2009000593A MX2009000593A MX2009000593A MX 2009000593 A MX2009000593 A MX 2009000593A MX 2009000593 A MX2009000593 A MX 2009000593A MX 2009000593 A MX2009000593 A MX 2009000593A MX 2009000593 A MX2009000593 A MX 2009000593A
- Authority
- MX
- Mexico
- Prior art keywords
- target
- insulating layers
- magnetic field
- cathode
- electrically insulating
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000000151 deposition Methods 0.000 title 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000010891 electric arc Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000001771 vacuum deposition Methods 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3447—Collimators, shutters, apertures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
Abstract
Procedimiento para la producción de capas malas conductoras, en especial aislantes sobre cuando menos una pieza de trabajo por medio de recubrimiento al vacío, en donde se realiza una descarga de arcos eléctricos entre cuando menos un ánodo y un cátodo de una fuente de arco en una atmosfera que contenga gas reactivo, y en la superficie de un objetivo conectado eléctricamente con el cátodo solo se produce un campo magnético externo pequeño esencialmente perpendicular a la superficie objetivo para apoyar el proceso de evaporación, de tal forma que el grado de re-recubrimiento de la superficie objetivo por medio de otras fuentes de recubrimiento pueden seleccionarse menores al 10%, o se produce un campo magnético con un sistema magnético, que cuando menos incluye una bobina polar axial con una geometría similar a la periferia del objetivo.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH11662006 | 2006-07-19 | ||
PCT/EP2007/057179 WO2008009619A1 (de) | 2006-07-19 | 2007-07-12 | Verfahren zum abscheiden elektrisch isolierender schichten |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2009000593A true MX2009000593A (es) | 2009-04-07 |
Family
ID=37174179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2009000593A MX2009000593A (es) | 2006-07-19 | 2007-07-12 | Procedimiento para depositar capas aislantes electricas. |
Country Status (20)
Country | Link |
---|---|
US (1) | US8197648B2 (es) |
EP (2) | EP2041331B1 (es) |
JP (1) | JP5306198B2 (es) |
KR (1) | KR101361234B1 (es) |
CN (1) | CN101490305B (es) |
AU (1) | AU2007276186B2 (es) |
BR (1) | BRPI0714437B1 (es) |
CA (1) | CA2657726C (es) |
ES (1) | ES2527877T3 (es) |
HK (1) | HK1129910A1 (es) |
IL (1) | IL196488A (es) |
MX (1) | MX2009000593A (es) |
MY (1) | MY167043A (es) |
NZ (1) | NZ573694A (es) |
PT (1) | PT2041331E (es) |
RU (1) | RU2461664C2 (es) |
TW (1) | TWI411696B (es) |
UA (1) | UA95809C2 (es) |
WO (1) | WO2008009619A1 (es) |
ZA (1) | ZA200900374B (es) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10323320B2 (en) | 2008-04-24 | 2019-06-18 | Oerlikon Surface Solutions Ag, Pfäffikon | Method for producing metal oxide layers of predetermined structure through arc vaporization |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009022982A1 (de) * | 2009-05-28 | 2010-12-02 | Oerlikon Trading Ag, Trübbach | Verfahren zum Aufbringen eines Hochtemperaturschmiermittels |
EP2456905B1 (en) | 2009-07-22 | 2017-12-27 | Oerlikon Trading AG, Trübbach | Method for producing coatings with a single composite target |
EP2369031B1 (de) | 2010-03-18 | 2016-05-04 | Oerlikon Trading AG, Trübbach | Beschichtung auf nial2o4 basis in spinellstruktur |
DE102010042828A1 (de) * | 2010-10-22 | 2012-04-26 | Walter Ag | Target für Lichtbogenverfahren |
HUE046095T2 (hu) * | 2011-09-30 | 2020-01-28 | Oerlikon Surface Solutions Ag Pfaeffikon | Alumínium-titán-nitrid-bevonat, a gépi mûveletek során fokozott kopásállósághoz módosított morfológiával, és ennek módszere |
MX369729B (es) * | 2013-04-30 | 2019-11-20 | Nippon Itf Inc | Fuente de evaporación por arco. |
EP3394320B1 (en) | 2015-12-22 | 2020-07-29 | Sandvik Intellectual Property AB | Method of producing a pvd layer and a coated cutting tool |
MY189225A (en) * | 2016-04-22 | 2022-01-31 | Oerlikon Surface Solutions Ag Pfaffikon | Ticn having reduced growth defects by means of hipims |
EP3556901B1 (en) * | 2018-04-20 | 2021-03-31 | Plansee Composite Materials Gmbh | Vacuum arc source |
DE102018112335A1 (de) * | 2018-05-23 | 2019-11-28 | Hartmetall-Werkzeugfabrik Paul Horn Gmbh | Magnetronsputtervorrichtung |
RU2761900C1 (ru) * | 2021-02-08 | 2021-12-13 | Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук | Магнетронное распылительное устройство |
CN114324369B (zh) * | 2022-03-11 | 2022-06-07 | 北京新研创能科技有限公司 | 双极板表面划痕检测系统及方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3625848A (en) * | 1968-12-26 | 1971-12-07 | Alvin A Snaper | Arc deposition process and apparatus |
JPS63501646A (ja) * | 1985-09-30 | 1988-06-23 | ユニオン カ−バイド コ−ポレ−シヨン | 真空室内でコ−テイングをア−ク蒸着する為の装置及び方法 |
EP0285745B1 (de) | 1987-03-06 | 1993-05-26 | Balzers Aktiengesellschaft | Verfahren und Vorrichtungen zum Vakuumbeschichten mittels einer elektrischen Bogenentladung |
JPH0699799B2 (ja) * | 1988-03-18 | 1994-12-07 | 株式会社神戸製鋼所 | 真空蒸着方法 |
JP2718731B2 (ja) * | 1988-12-21 | 1998-02-25 | 株式会社神戸製鋼所 | 真空アーク蒸着装置及び真空アーク蒸着方法 |
RU2176681C2 (ru) * | 1989-11-22 | 2001-12-10 | Волков Валерий Венедиктович | Способ получения покрытий в вакууме, устройство для получения покрытий в вакууме, способ изготовления устройства для получения покрытий в вакууме |
DE4223592C2 (de) * | 1992-06-24 | 2001-05-17 | Leybold Ag | Lichtbogen-Verdampfungsvorrichtung |
JP3243357B2 (ja) * | 1993-12-21 | 2002-01-07 | 株式会社神戸製鋼所 | 真空アーク蒸着装置 |
US5744017A (en) * | 1993-12-17 | 1998-04-28 | Kabushiki Kaisha Kobe Seiko Sho | Vacuum arc deposition apparatus |
CH688863A5 (de) * | 1994-06-24 | 1998-04-30 | Balzers Hochvakuum | Verfahren zum Beschichten mindestens eines Werkstueckes und Anlage hierfuer. |
JP3060876B2 (ja) * | 1995-02-15 | 2000-07-10 | 日新電機株式会社 | 金属イオン注入装置 |
JP2878997B2 (ja) * | 1995-09-26 | 1999-04-05 | 株式会社神戸製鋼所 | 真空蒸着装置 |
CA2256847A1 (en) * | 1998-12-22 | 2000-06-22 | Munther Kandah | Particle-free cathodic arc carbon ion source |
TWI242049B (en) | 1999-01-14 | 2005-10-21 | Kobe Steel Ltd | Vacuum arc evaporation source and vacuum arc vapor deposition apparatus |
JP3104701B1 (ja) * | 1999-08-18 | 2000-10-30 | 日新電機株式会社 | アーク式蒸発源 |
JP2002069664A (ja) * | 2000-08-28 | 2002-03-08 | Hiroshi Takigawa | プラズマ加工方法及びプラズマ加工装置 |
JP2002254207A (ja) * | 2001-02-23 | 2002-09-10 | Mmc Kobelco Tool Kk | 切粉に対する表面潤滑性にすぐれた表面被覆超硬合金製切削工具 |
ATE372586T1 (de) | 2002-12-19 | 2007-09-15 | Oc Oerlikon Balzers Ag | Vacuumarcquelle mit magnetfelderzeugungseinrichtung |
WO2004059030A2 (de) * | 2003-04-28 | 2004-07-15 | Unaxis Balzers Ag | Werkstück mit alcr-haltiger hartstoffschicht und verfahren zur herstellung |
US7857948B2 (en) * | 2006-07-19 | 2010-12-28 | Oerlikon Trading Ag, Trubbach | Method for manufacturing poorly conductive layers |
-
2007
- 2007-07-11 TW TW096125180A patent/TWI411696B/zh not_active IP Right Cessation
- 2007-07-12 EP EP07787450.1A patent/EP2041331B1/de active Active
- 2007-07-12 MY MYPI20090219A patent/MY167043A/en unknown
- 2007-07-12 MX MX2009000593A patent/MX2009000593A/es active IP Right Grant
- 2007-07-12 ZA ZA200900374A patent/ZA200900374B/xx unknown
- 2007-07-12 BR BRPI0714437-7A patent/BRPI0714437B1/pt not_active IP Right Cessation
- 2007-07-12 CA CA2657726A patent/CA2657726C/en not_active Expired - Fee Related
- 2007-07-12 PT PT77874501T patent/PT2041331E/pt unknown
- 2007-07-12 EP EP13156872.7A patent/EP2599891A3/de not_active Withdrawn
- 2007-07-12 CN CN200780027414.1A patent/CN101490305B/zh active Active
- 2007-07-12 UA UAA200901382A patent/UA95809C2/ru unknown
- 2007-07-12 JP JP2009519945A patent/JP5306198B2/ja not_active Expired - Fee Related
- 2007-07-12 AU AU2007276186A patent/AU2007276186B2/en not_active Ceased
- 2007-07-12 US US12/374,319 patent/US8197648B2/en active Active
- 2007-07-12 ES ES07787450.1T patent/ES2527877T3/es active Active
- 2007-07-12 RU RU2009105668/02A patent/RU2461664C2/ru not_active IP Right Cessation
- 2007-07-12 KR KR1020097000856A patent/KR101361234B1/ko active IP Right Grant
- 2007-07-12 NZ NZ573694A patent/NZ573694A/en not_active IP Right Cessation
- 2007-07-12 WO PCT/EP2007/057179 patent/WO2008009619A1/de active Application Filing
-
2009
- 2009-01-13 IL IL196488A patent/IL196488A/en active IP Right Grant
- 2009-08-20 HK HK09107663A patent/HK1129910A1/xx not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10323320B2 (en) | 2008-04-24 | 2019-06-18 | Oerlikon Surface Solutions Ag, Pfäffikon | Method for producing metal oxide layers of predetermined structure through arc vaporization |
Also Published As
Publication number | Publication date |
---|---|
UA95809C2 (ru) | 2011-09-12 |
EP2041331B1 (de) | 2014-10-22 |
WO2008009619A1 (de) | 2008-01-24 |
CA2657726C (en) | 2015-05-26 |
KR20090031904A (ko) | 2009-03-30 |
AU2007276186A1 (en) | 2008-01-24 |
TWI411696B (zh) | 2013-10-11 |
EP2041331A1 (de) | 2009-04-01 |
EP2599891A3 (de) | 2013-08-07 |
JP2009543951A (ja) | 2009-12-10 |
RU2009105668A (ru) | 2010-08-27 |
AU2007276186B2 (en) | 2012-03-01 |
CN101490305B (zh) | 2014-02-12 |
BRPI0714437A2 (pt) | 2013-03-12 |
US8197648B2 (en) | 2012-06-12 |
MY167043A (en) | 2018-08-02 |
IL196488A0 (en) | 2009-09-22 |
JP5306198B2 (ja) | 2013-10-02 |
RU2461664C2 (ru) | 2012-09-20 |
ZA200900374B (en) | 2010-04-28 |
WO2008009619A9 (de) | 2009-04-16 |
IL196488A (en) | 2014-11-30 |
NZ573694A (en) | 2012-02-24 |
HK1129910A1 (en) | 2009-12-11 |
ES2527877T3 (es) | 2015-02-02 |
CA2657726A1 (en) | 2008-01-24 |
BRPI0714437B1 (pt) | 2018-06-05 |
US20090166188A1 (en) | 2009-07-02 |
PT2041331E (pt) | 2015-01-14 |
KR101361234B1 (ko) | 2014-02-11 |
TW200806803A (en) | 2008-02-01 |
EP2599891A2 (de) | 2013-06-05 |
CN101490305A (zh) | 2009-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
HH | Correction or change in general | ||
FG | Grant or registration |