HK1129910A1 - Method for depositing electrically insulating layers - Google Patents

Method for depositing electrically insulating layers

Info

Publication number
HK1129910A1
HK1129910A1 HK09107663A HK09107663A HK1129910A1 HK 1129910 A1 HK1129910 A1 HK 1129910A1 HK 09107663 A HK09107663 A HK 09107663A HK 09107663 A HK09107663 A HK 09107663A HK 1129910 A1 HK1129910 A1 HK 1129910A1
Authority
HK
Hong Kong
Prior art keywords
electrically insulating
insulating layers
depositing electrically
depositing
layers
Prior art date
Application number
HK09107663A
Other languages
English (en)
Chinese (zh)
Inventor
Juergen Ramm
Beno Widrig
Christian Wohlrab
Original Assignee
Oerlikon Trading Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading Ag filed Critical Oerlikon Trading Ag
Publication of HK1129910A1 publication Critical patent/HK1129910A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/081—Oxides of aluminium, magnesium or beryllium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
HK09107663A 2006-07-19 2009-08-20 Method for depositing electrically insulating layers HK1129910A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH11662006 2006-07-19
PCT/EP2007/057179 WO2008009619A1 (de) 2006-07-19 2007-07-12 Verfahren zum abscheiden elektrisch isolierender schichten

Publications (1)

Publication Number Publication Date
HK1129910A1 true HK1129910A1 (en) 2009-12-11

Family

ID=37174179

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09107663A HK1129910A1 (en) 2006-07-19 2009-08-20 Method for depositing electrically insulating layers

Country Status (20)

Country Link
US (1) US8197648B2 (xx)
EP (2) EP2041331B1 (xx)
JP (1) JP5306198B2 (xx)
KR (1) KR101361234B1 (xx)
CN (1) CN101490305B (xx)
AU (1) AU2007276186B2 (xx)
BR (1) BRPI0714437B1 (xx)
CA (1) CA2657726C (xx)
ES (1) ES2527877T3 (xx)
HK (1) HK1129910A1 (xx)
IL (1) IL196488A (xx)
MX (1) MX2009000593A (xx)
MY (1) MY167043A (xx)
NZ (1) NZ573694A (xx)
PT (1) PT2041331E (xx)
RU (1) RU2461664C2 (xx)
TW (1) TWI411696B (xx)
UA (1) UA95809C2 (xx)
WO (1) WO2008009619A1 (xx)
ZA (1) ZA200900374B (xx)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2377225T3 (es) * 2008-09-19 2012-03-23 OERLIKON TRADING AG, TRÜBBACH Método para producir capas de óxido metálico mediante vaporización por arco
DE102009022982A1 (de) * 2009-05-28 2010-12-02 Oerlikon Trading Ag, Trübbach Verfahren zum Aufbringen eines Hochtemperaturschmiermittels
EP2456905B1 (en) 2009-07-22 2017-12-27 Oerlikon Trading AG, Trübbach Method for producing coatings with a single composite target
EP2369031B1 (de) 2010-03-18 2016-05-04 Oerlikon Trading AG, Trübbach Beschichtung auf nial2o4 basis in spinellstruktur
DE102010042828A1 (de) * 2010-10-22 2012-04-26 Walter Ag Target für Lichtbogenverfahren
HUE046095T2 (hu) * 2011-09-30 2020-01-28 Oerlikon Surface Solutions Ag Pfaeffikon Alumínium-titán-nitrid-bevonat, a gépi mûveletek során fokozott kopásállósághoz módosított morfológiával, és ennek módszere
MX369729B (es) * 2013-04-30 2019-11-20 Nippon Itf Inc Fuente de evaporación por arco.
EP3394320B1 (en) 2015-12-22 2020-07-29 Sandvik Intellectual Property AB Method of producing a pvd layer and a coated cutting tool
MY189225A (en) * 2016-04-22 2022-01-31 Oerlikon Surface Solutions Ag Pfaffikon Ticn having reduced growth defects by means of hipims
EP3556901B1 (en) * 2018-04-20 2021-03-31 Plansee Composite Materials Gmbh Vacuum arc source
DE102018112335A1 (de) * 2018-05-23 2019-11-28 Hartmetall-Werkzeugfabrik Paul Horn Gmbh Magnetronsputtervorrichtung
RU2761900C1 (ru) * 2021-02-08 2021-12-13 Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук Магнетронное распылительное устройство
CN114324369B (zh) * 2022-03-11 2022-06-07 北京新研创能科技有限公司 双极板表面划痕检测系统及方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3625848A (en) * 1968-12-26 1971-12-07 Alvin A Snaper Arc deposition process and apparatus
JPS63501646A (ja) * 1985-09-30 1988-06-23 ユニオン　カ−バイド　コ−ポレ−シヨン 真空室内でコ−テイングをア−ク蒸着する為の装置及び方法
EP0285745B1 (de) 1987-03-06 1993-05-26 Balzers Aktiengesellschaft Verfahren und Vorrichtungen zum Vakuumbeschichten mittels einer elektrischen Bogenentladung
JPH0699799B2 (ja) * 1988-03-18 1994-12-07 株式会社神戸製鋼所 真空蒸着方法
JP2718731B2 (ja) * 1988-12-21 1998-02-25 株式会社神戸製鋼所 真空アーク蒸着装置及び真空アーク蒸着方法
RU2176681C2 (ru) * 1989-11-22 2001-12-10 Волков Валерий Венедиктович Способ получения покрытий в вакууме, устройство для получения покрытий в вакууме, способ изготовления устройства для получения покрытий в вакууме
DE4223592C2 (de) * 1992-06-24 2001-05-17 Leybold Ag Lichtbogen-Verdampfungsvorrichtung
JP3243357B2 (ja) * 1993-12-21 2002-01-07 株式会社神戸製鋼所 真空アーク蒸着装置
US5744017A (en) * 1993-12-17 1998-04-28 Kabushiki Kaisha Kobe Seiko Sho Vacuum arc deposition apparatus
CH688863A5 (de) * 1994-06-24 1998-04-30 Balzers Hochvakuum Verfahren zum Beschichten mindestens eines Werkstueckes und Anlage hierfuer.
JP3060876B2 (ja) * 1995-02-15 2000-07-10 日新電機株式会社 金属イオン注入装置
JP2878997B2 (ja) * 1995-09-26 1999-04-05 株式会社神戸製鋼所 真空蒸着装置
CA2256847A1 (en) * 1998-12-22 2000-06-22 Munther Kandah Particle-free cathodic arc carbon ion source
TWI242049B (en) 1999-01-14 2005-10-21 Kobe Steel Ltd Vacuum arc evaporation source and vacuum arc vapor deposition apparatus
JP3104701B1 (ja) * 1999-08-18 2000-10-30 日新電機株式会社 アーク式蒸発源
JP2002069664A (ja) * 2000-08-28 2002-03-08 Hiroshi Takigawa プラズマ加工方法及びプラズマ加工装置
JP2002254207A (ja) * 2001-02-23 2002-09-10 Mmc Kobelco Tool Kk 切粉に対する表面潤滑性にすぐれた表面被覆超硬合金製切削工具
ATE372586T1 (de) 2002-12-19 2007-09-15 Oc Oerlikon Balzers Ag Vacuumarcquelle mit magnetfelderzeugungseinrichtung
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US7857948B2 (en) * 2006-07-19 2010-12-28 Oerlikon Trading Ag, Trubbach Method for manufacturing poorly conductive layers

Also Published As

Publication number Publication date
UA95809C2 (ru) 2011-09-12
EP2041331B1 (de) 2014-10-22
WO2008009619A1 (de) 2008-01-24
CA2657726C (en) 2015-05-26
KR20090031904A (ko) 2009-03-30
AU2007276186A1 (en) 2008-01-24
TWI411696B (zh) 2013-10-11
EP2041331A1 (de) 2009-04-01
EP2599891A3 (de) 2013-08-07
JP2009543951A (ja) 2009-12-10
RU2009105668A (ru) 2010-08-27
AU2007276186B2 (en) 2012-03-01
CN101490305B (zh) 2014-02-12
BRPI0714437A2 (pt) 2013-03-12
US8197648B2 (en) 2012-06-12
MY167043A (en) 2018-08-02
IL196488A0 (en) 2009-09-22
JP5306198B2 (ja) 2013-10-02
RU2461664C2 (ru) 2012-09-20
ZA200900374B (en) 2010-04-28
MX2009000593A (es) 2009-04-07
WO2008009619A9 (de) 2009-04-16
IL196488A (en) 2014-11-30
NZ573694A (en) 2012-02-24
ES2527877T3 (es) 2015-02-02
CA2657726A1 (en) 2008-01-24
BRPI0714437B1 (pt) 2018-06-05
US20090166188A1 (en) 2009-07-02
PT2041331E (pt) 2015-01-14
KR101361234B1 (ko) 2014-02-11
TW200806803A (en) 2008-02-01
EP2599891A2 (de) 2013-06-05
CN101490305A (zh) 2009-07-22

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180712