MX369729B - Fuente de evaporación por arco. - Google Patents
Fuente de evaporación por arco.Info
- Publication number
- MX369729B MX369729B MX2015015002A MX2015015002A MX369729B MX 369729 B MX369729 B MX 369729B MX 2015015002 A MX2015015002 A MX 2015015002A MX 2015015002 A MX2015015002 A MX 2015015002A MX 369729 B MX369729 B MX 369729B
- Authority
- MX
- Mexico
- Prior art keywords
- cathode
- evaporation source
- respect
- magnetic field
- arc evaporation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32614—Consumable cathodes for arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/327—Arrangements for generating the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Se proporciona una fuente de evaporación por arco para fusión y evaporación de un material de cátodo por descarga por arco en vacío para la formación de una película en una superficie de un substrato. La fuente de evaporación por arco incluye un cátodo, formado substancialmente en forma de disco, y un aparato generador de campo magnético, dispuesto en una parte posterior del cátodo, donde un aparato generador de campo magnético genera un campo magnético que forma líneas magnéticas que forman un ángulo agudo respecto de la dirección del substrato en una superficie circunferencial externa del cátodo, las líneas magnéticas sustancialmente perpendiculares a la superficie de descarga en una parte de la circunferencia exterior de la superficie de descarga del cátodo y las líneas magnéticas forman un ángulo agudo respecto de la dirección de un centro del cátodo en una región hacia la superficie circunferencial externa de la superficie de descarga del cátodo, por al menos un imán permanente dispuesto en la parte posterior del cátodo en donde los polos magnéticos se orientan en una dirección que es de 20° a 50° con respecto a una superficie de descarga del cátodo. La fuente de evaporación por arco permite que el cátodo utilice completamente la circunferencia exterior del mismo y es capaz de aumentar significativamente la eficiencia de utilización de material de cátodo.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2013/062560 WO2014178100A1 (ja) | 2013-04-30 | 2013-04-30 | アーク蒸発源 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2015015002A MX2015015002A (es) | 2016-02-05 |
| MX369729B true MX369729B (es) | 2019-11-20 |
Family
ID=51843253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2015015002A MX369729B (es) | 2013-04-30 | 2013-04-30 | Fuente de evaporación por arco. |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9953808B2 (es) |
| JP (1) | JP6074573B2 (es) |
| CN (1) | CN105164305B (es) |
| MX (1) | MX369729B (es) |
| WO (1) | WO2014178100A1 (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6528050B2 (ja) * | 2015-12-01 | 2019-06-12 | 日本アイ・ティ・エフ株式会社 | アーク式成膜装置および成膜方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3924833B2 (ja) | 1997-02-19 | 2007-06-06 | 日新電機株式会社 | 真空アーク蒸着装置 |
| JP2000212729A (ja) * | 1999-01-22 | 2000-08-02 | Kobe Steel Ltd | 真空ア―ク蒸着装置 |
| DE10127013A1 (de) * | 2001-06-05 | 2002-12-12 | Gabriel Herbert M | Lichtbogen-Verdampfungsvorrichtung |
| JP4548666B2 (ja) * | 2005-08-26 | 2010-09-22 | 株式会社不二越 | アーク式イオンプレーティング装置用蒸発源 |
| TWI411696B (zh) | 2006-07-19 | 2013-10-11 | Oerlikon Trading Ag | 沉積電絕緣層之方法 |
| WO2010072850A1 (es) * | 2008-12-26 | 2010-07-01 | Fundacion Tekniker | Evaporador de arco y método para operar el evaporador |
| WO2010076862A1 (ja) * | 2008-12-29 | 2010-07-08 | キヤノンアネルバ株式会社 | 均一膜厚分布のためのスパッタ装置の磁界制御 |
| DE102009008161A1 (de) * | 2009-02-09 | 2010-08-12 | Oerlikon Trading Ag, Trübbach | Modifizierbare Magnetkonfiguration für Arc-Verdampfungsquellen |
| JP5730888B2 (ja) * | 2009-10-26 | 2015-06-10 | ジェネラル・プラズマ・インコーポレーテッド | ロータリーマグネトロンマグネットバー、およびこれを含む高いターゲット利用のための装置 |
| JP5652348B2 (ja) * | 2011-07-22 | 2015-01-14 | 三菱マテリアル株式会社 | アークイオンプレーティング装置 |
-
2013
- 2013-04-30 WO PCT/JP2013/062560 patent/WO2014178100A1/ja active Application Filing
- 2013-04-30 CN CN201380076080.2A patent/CN105164305B/zh active Active
- 2013-04-30 MX MX2015015002A patent/MX369729B/es active IP Right Grant
- 2013-04-30 US US14/787,272 patent/US9953808B2/en active Active
- 2013-04-30 JP JP2015514703A patent/JP6074573B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9953808B2 (en) | 2018-04-24 |
| WO2014178100A1 (ja) | 2014-11-06 |
| CN105164305B (zh) | 2017-05-17 |
| JP6074573B2 (ja) | 2017-02-08 |
| CN105164305A (zh) | 2015-12-16 |
| US20160086770A1 (en) | 2016-03-24 |
| MX2015015002A (es) | 2016-02-05 |
| JPWO2014178100A1 (ja) | 2017-02-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |