MX165458B - Procedimiento electroforetico de deposito - Google Patents
Procedimiento electroforetico de depositoInfo
- Publication number
- MX165458B MX165458B MX000032A MX3285A MX165458B MX 165458 B MX165458 B MX 165458B MX 000032 A MX000032 A MX 000032A MX 3285 A MX3285 A MX 3285A MX 165458 B MX165458 B MX 165458B
- Authority
- MX
- Mexico
- Prior art keywords
- film
- polymer
- aqueous solution
- image
- deposit procedure
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/138—Corona discharge process
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Polymerisation Methods In General (AREA)
- Paints Or Removers (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
La presente invención se refiere a un procedimiento para formar una imagen de polímero negativa sobre una superficie conductiva, que comprende: a) depositar electroforéticamente una película uniforme sobre la superficie, desde una composición fotosensitiva de polímero que comprende una solución o emulsión acuosa de al menos un polímero libre de insaturación etilénica y que tiene grupos portadores cargados, un fotoiniciador y un monómero de entrecruzamiento: b) exponer porciones de la película a una fuente de radiación actínica y c) revelar la película sin exponer, usando una solución acuosa para formar una imagen negativa de polímero entrelazado sobre la superficie, está imagen siendo resistente a las soluciones de grabado químico o de chapeado.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/654,821 US4592816A (en) | 1984-09-26 | 1984-09-26 | Electrophoretic deposition process |
CN198686100150A CN86100150A (zh) | 1984-09-26 | 1986-01-11 | 感光聚合物组合物及其电泳沉积工艺过程 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX165458B true MX165458B (es) | 1992-11-11 |
Family
ID=67809744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX000032A MX165458B (es) | 1984-09-26 | 1985-10-01 | Procedimiento electroforetico de deposito |
Country Status (19)
Country | Link |
---|---|
US (1) | US4592816A (es) |
EP (1) | EP0176356B1 (es) |
JP (1) | JPH081519B2 (es) |
KR (1) | KR920005775B1 (es) |
CN (2) | CN1058431A (es) |
AU (1) | AU586189B2 (es) |
BR (1) | BR8504640A (es) |
CA (1) | CA1257803A (es) |
DE (1) | DE3566047D1 (es) |
DK (1) | DK168802B1 (es) |
FI (1) | FI80350C (es) |
HK (1) | HK58289A (es) |
IE (1) | IE58622B1 (es) |
IL (1) | IL76491A (es) |
MX (1) | MX165458B (es) |
NO (1) | NO168857C (es) |
PH (1) | PH22139A (es) |
SG (1) | SG8489G (es) |
ZA (1) | ZA857435B (es) |
Families Citing this family (87)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8430377D0 (en) * | 1984-12-01 | 1985-01-09 | Ciba Geigy Ag | Modified phenolic resins |
DE3517796A1 (de) * | 1985-05-17 | 1986-11-20 | Hoechst Ag, 6230 Frankfurt | Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten |
JPH0644150B2 (ja) * | 1986-05-09 | 1994-06-08 | 関西ペイント株式会社 | プリント配線フオトレジスト用電着塗料組成物 |
JPS6317592A (ja) * | 1986-07-09 | 1988-01-25 | 三菱電機株式会社 | プリント配線板の製造方法 |
US4762747A (en) * | 1986-07-29 | 1988-08-09 | Industrial Technology Research Institute | Single component aqueous acrylic adhesive compositions for flexible printed circuits and laminates made therefrom |
US4751172A (en) * | 1986-08-01 | 1988-06-14 | Shipley Company Inc. | Process for forming metal images |
GB8620001D0 (en) * | 1986-08-16 | 1986-09-24 | Ciba Geigy Ag | Production of images |
EP0662636A3 (en) * | 1986-10-23 | 1995-11-22 | Ciba Geigy Ag | Imaging processes. |
JPS63182888A (ja) * | 1987-01-26 | 1988-07-28 | 関西ペイント株式会社 | プリント配線板の製造方法 |
JPS63246890A (ja) * | 1987-04-02 | 1988-10-13 | 関西ペイント株式会社 | プリント回路の形成方法 |
JPS6420694A (en) * | 1987-07-15 | 1989-01-24 | Kansai Paint Co Ltd | Manufacture of printed wiring board |
DE3880920T2 (de) * | 1987-08-05 | 1993-10-07 | Ciba Geigy | Verbindungen. |
DE3850533T2 (de) * | 1987-08-05 | 1994-10-27 | Ciba Geigy Ag | Bilderzeugungsverfahren. |
US5196098A (en) * | 1988-01-04 | 1993-03-23 | Shipley Company Inc. | Apparatus and process for electrophoretic deposition |
JPH0795577B2 (ja) * | 1988-04-12 | 1995-10-11 | 富士プラント工業株式会社 | リードフレームへの部分メッキ方法 |
CA1334897C (en) * | 1988-08-02 | 1995-03-28 | Mamoru Seio | Electrodeposition coating composition and image-forming method using the same |
JP2585070B2 (ja) * | 1988-08-02 | 1997-02-26 | 日本ペイント株式会社 | 画像形成方法 |
US5102775A (en) * | 1988-09-30 | 1992-04-07 | Kansai Paint Co., Ltd. | Visible light sensitive electrodeposition coating composition and image-forming method using the same |
GB8827847D0 (en) * | 1988-11-29 | 1988-12-29 | Ciba Geigy Ag | Method |
CA2009274A1 (en) * | 1989-02-22 | 1990-08-22 | Manuel Buentello Iii | Method for making electronic components using a masking material and a masking material therefor |
GB8909561D0 (en) * | 1989-04-26 | 1989-06-14 | Kodak Ltd | Radiation-sensitive composition and use thereof in the preparation of electrochemical ion sensors |
JPH02302092A (ja) * | 1989-05-16 | 1990-12-14 | Kansai Paint Co Ltd | プリント配線板の製造方法 |
US5004672A (en) * | 1989-07-10 | 1991-04-02 | Shipley Company Inc. | Electrophoretic method for applying photoresist to three dimensional circuit board substrate |
US5236810A (en) * | 1989-10-03 | 1993-08-17 | Kansai Paint Co., Ltd. | Process for preparing printed-circuit board |
US5047128A (en) * | 1990-01-02 | 1991-09-10 | Shipley Company Inc. | Electrodialysis cell for removal of excess electrolytes formed during electrodeposition of photoresists coatings |
DE4009563A1 (de) * | 1990-03-24 | 1991-09-26 | Basf Lacke & Farben | Waessrig entwickelbares, negativ wirkendes, elektrophoretisch abscheidbares und photohaertbares beschichtungsmittel sowie seine verwendung zur herstellung von leiterbahnen |
US5055164A (en) * | 1990-03-26 | 1991-10-08 | Shipley Company Inc. | Electrodepositable photoresists for manufacture of hybrid circuit boards |
EP0449022A3 (en) * | 1990-03-26 | 1992-03-11 | Shipley Company Inc. | Method of controlling photoresist film thickness and stability of an electrodeposition bath |
WO1992000552A1 (en) * | 1990-06-27 | 1992-01-09 | Coates Brothers Plc | Image-forming process |
JPH0465184A (ja) * | 1990-07-05 | 1992-03-02 | Kansai Paint Co Ltd | 電着前処理方法 |
US5268256A (en) * | 1990-08-02 | 1993-12-07 | Ppg Industries, Inc. | Photoimageable electrodepositable photoresist composition for producing non-tacky films |
DE69130691T2 (de) * | 1990-08-02 | 1999-07-22 | Ppg Industries Inc | Lichtempfindliche, elektroabscheidbare Photoresistzusammensetzung |
US5066374A (en) * | 1990-09-20 | 1991-11-19 | Rohm And Haas Company | Elimination of film defects due to hydrogen evolution during cathodic electrodeposition |
EP0490118A1 (en) * | 1990-12-10 | 1992-06-17 | Shipley Company Inc. | Photoimagable solder mask and photosensitive composition |
EP0493317B2 (de) * | 1990-12-18 | 2001-01-10 | Ciba SC Holding AG | Strahlungsempfindliche Zusammensetzung auf Basis von Wasser als Lösungsmittel |
US5202222A (en) * | 1991-03-01 | 1993-04-13 | Shipley Company Inc. | Selective and precise etching and plating of conductive substrates |
US5607818A (en) * | 1991-06-04 | 1997-03-04 | Micron Technology, Inc. | Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition |
US5160579A (en) * | 1991-06-05 | 1992-11-03 | Macdermid, Incorporated | Process for manufacturing printed circuit employing selective provision of solderable coating |
US5288377A (en) * | 1991-06-05 | 1994-02-22 | Macdermid, Incorporated | Process for the manufacture of printed circuits using electrophoretically deposited organic resists |
CA2067921A1 (en) * | 1991-06-12 | 1992-12-13 | Alan Frederick Becknell | Method of making electrical circuit traces |
US5314789A (en) * | 1991-10-01 | 1994-05-24 | Shipley Company Inc. | Method of forming a relief image comprising amphoteric compositions |
US5384229A (en) * | 1992-05-07 | 1995-01-24 | Shipley Company Inc. | Photoimageable compositions for electrodeposition |
CZ170395A3 (en) * | 1993-01-11 | 1995-12-13 | Macdermid | Phosphatizing mixture and phosphatization process, particularly for the production of printed circuits |
JPH07249766A (ja) * | 1994-03-10 | 1995-09-26 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US5590460A (en) | 1994-07-19 | 1997-01-07 | Tessera, Inc. | Method of making multilayer circuit |
US5531872A (en) * | 1994-08-11 | 1996-07-02 | Xerox Corporation | Processes for preparing photoconductive members by electrophoresis |
US5721088A (en) * | 1995-12-20 | 1998-02-24 | Ppg Industries, Inc. | Electrodepositable photoimageable compositions with improved edge coverage |
KR100242165B1 (ko) * | 1996-11-30 | 2000-02-01 | 김영남 | 음극선관의 건식전자사진식 스크린 제조용 광전도막도포용액 및 이를 사용하는 그 스크린 제조방법 |
US5893966A (en) * | 1997-07-28 | 1999-04-13 | Micron Technology, Inc. | Method and apparatus for continuous processing of semiconductor wafers |
US6033548A (en) * | 1997-07-28 | 2000-03-07 | Micron Technology, Inc. | Rotating system and method for electrodepositing materials on semiconductor wafers |
US6153075A (en) | 1998-02-26 | 2000-11-28 | Micron Technology, Inc. | Methods using electrophoretically deposited patternable material |
US6503564B1 (en) * | 1999-02-26 | 2003-01-07 | 3M Innovative Properties Company | Method of coating microstructured substrates with polymeric layer(s), allowing preservation of surface feature profile |
CA2380412A1 (en) | 1999-07-30 | 2001-02-08 | Lawrence G. Anderson | Coating compositions having improved scratch resistance, coated substrates and methods related thereto |
US6623791B2 (en) | 1999-07-30 | 2003-09-23 | Ppg Industries Ohio, Inc. | Coating compositions having improved adhesion, coated substrates and methods related thereto |
JP2003506518A (ja) | 1999-07-30 | 2003-02-18 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | 改良ひっかき抵抗性を有するコーティング組成物、コート基材及びそれに関連する方法 |
US6387519B1 (en) | 1999-07-30 | 2002-05-14 | Ppg Industries Ohio, Inc. | Cured coatings having improved scratch resistance, coated substrates and methods thereto |
US6610777B1 (en) * | 1999-07-30 | 2003-08-26 | Ppg Industries Ohio, Inc. | Flexible coating compositions having improved scratch resistance, coated substrates and methods related thereto |
US6455231B1 (en) * | 1999-11-03 | 2002-09-24 | Shipley Company, L.L.C. | Dry film photoimageable compositions |
KR100686228B1 (ko) * | 2000-03-13 | 2007-02-22 | 삼성전자주식회사 | 사진 식각용 장치 및 방법, 그리고 이를 이용한 액정 표시장치용 박막 트랜지스터 기판의 제조 방법 |
US6379865B1 (en) | 2000-04-11 | 2002-04-30 | 3M Innovative Properties Company | Photoimageable, aqueous acid soluble polyimide polymers |
US6635341B1 (en) | 2000-07-31 | 2003-10-21 | Ppg Industries Ohio, Inc. | Coating compositions comprising silyl blocked components, coating, coated substrates and methods related thereto |
DE10112023A1 (de) * | 2001-03-07 | 2002-10-02 | Atotech Deutschland Gmbh | Verfahren zum Bilden eines Metallmusters auf einen dielektrischen Substrat |
US6671950B2 (en) | 2001-03-08 | 2004-01-06 | Ppg Industries Ohio, Inc. | Multi-layer circuit assembly and process for preparing the same |
US6713587B2 (en) | 2001-03-08 | 2004-03-30 | Ppg Industries Ohio, Inc. | Electrodepositable dielectric coating compositions and methods related thereto |
US7000313B2 (en) * | 2001-03-08 | 2006-02-21 | Ppg Industries Ohio, Inc. | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
US8065795B2 (en) | 2001-03-08 | 2011-11-29 | Ppg Industries Ohio, Inc | Multi-layer circuit assembly and process for preparing the same |
US6951707B2 (en) * | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
US7228623B2 (en) * | 2001-03-08 | 2007-06-12 | Ppg Industries Ohio, Inc. | Process for fabricating a multi layer circuit assembly |
US6803092B2 (en) | 2001-06-26 | 2004-10-12 | 3M Innovative Properties Company | Selective deposition of circuit-protective polymers |
EP1563119A4 (en) * | 2001-08-31 | 2006-03-22 | Semitool Inc | APPARATUS AND METHOD FOR DISPERSING AN ELECTROPHORETIC EMULSION |
WO2003054629A1 (en) * | 2001-12-20 | 2003-07-03 | Koninklijke Philips Electronics N.V. | Method of patterning a layer and method of manufacturing an electronic device |
US7344970B2 (en) * | 2002-04-11 | 2008-03-18 | Shipley Company, L.L.C. | Plating method |
WO2004004432A1 (en) * | 2002-06-27 | 2004-01-08 | Ppg Industries Ohio, Inc. | Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
US6824959B2 (en) * | 2002-06-27 | 2004-11-30 | Ppg Industries Ohio, Inc. | Process for creating holes in polymeric substrates |
US20060213685A1 (en) * | 2002-06-27 | 2006-09-28 | Wang Alan E | Single or multi-layer printed circuit board with improved edge via design |
WO2005020298A1 (ja) * | 2003-08-26 | 2005-03-03 | Nikon Corporation | 光学素子及び露光装置 |
FR2860523B1 (fr) * | 2003-10-01 | 2006-01-13 | Commissariat Energie Atomique | Procede de formation d'un film polymere sur une surface conductrice ou semi-conductrice de l'electricite par electro-greffage, surfaces obtenues et applications |
EP1581034A1 (en) * | 2004-03-25 | 2005-09-28 | DSM IP Assets B.V. | Method of forming solder mask |
US8003293B2 (en) * | 2004-09-30 | 2011-08-23 | Intel Corporation | Pixelated photoresists |
US20060141143A1 (en) * | 2004-12-17 | 2006-06-29 | J Mccollum Gregory | Method for creating circuit assemblies |
TWI342172B (en) * | 2007-01-02 | 2011-05-11 | Advanced Semiconductor Eng | Circuit board and method for manufacturing the same |
EP1975706A3 (en) * | 2007-03-30 | 2010-03-03 | FUJIFILM Corporation | Lithographic printing plate precursor |
CN101693515B (zh) * | 2009-10-30 | 2012-04-25 | 上海交通大学 | 用于mems领域的可图形化聚合物薄膜的制备方法 |
KR101548784B1 (ko) * | 2011-02-14 | 2015-08-31 | 주식회사 엘지화학 | 기재 필름 및 그의 제조방법 |
CN108811359B (zh) * | 2018-07-03 | 2019-11-08 | 刘平 | 一种双面和多层印制电路板的生产方法 |
DE102020206107A1 (de) | 2020-05-14 | 2021-11-18 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines optischen Elements |
GB2613173A (en) * | 2021-11-25 | 2023-05-31 | Bae Systems Plc | Component processing |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL87862C (es) | 1951-08-20 | |||
US2850445A (en) | 1955-01-19 | 1958-09-02 | Oster Gerald | Photopolymerization |
US2875047A (en) | 1955-01-19 | 1959-02-24 | Oster Gerald | Photopolymerization with the formation of coherent plastic masses |
US2893868A (en) * | 1955-08-22 | 1959-07-07 | Du Pont | Polymerizable compositions |
US3074974A (en) | 1957-12-06 | 1963-01-22 | Monsanto Chemicals | Method for the preparation of diglycidyl ether of tetrachlorobisphenol-a |
US3097097A (en) | 1959-02-12 | 1963-07-09 | Gisela K Oster | Photo degrading of gel systems and photographic production of reliefs therewith |
NL254306A (es) | 1959-08-07 | |||
US3200057A (en) | 1960-12-27 | 1965-08-10 | Ford Motor Co | Electrophoretic coating process |
US3303078A (en) | 1962-05-18 | 1967-02-07 | David Wolf | Method of making electrical components |
US3403088A (en) | 1964-05-18 | 1968-09-24 | Ppg Industries Inc | Electrodeposition of water-dispersed acrylic interpolymers |
US3380831A (en) | 1964-05-26 | 1968-04-30 | Du Pont | Photopolymerizable compositions and elements |
GB1090142A (en) | 1965-02-26 | 1967-11-08 | Agfa Gevaert Nv | Photochemical insolubilisation of polymers |
US3479185A (en) | 1965-06-03 | 1969-11-18 | Du Pont | Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers |
FR1486212A (es) | 1965-07-09 | 1967-10-04 | ||
US3549367A (en) | 1968-05-24 | 1970-12-22 | Du Pont | Photopolymerizable compositions containing triarylimidazolyl dimers and p-aminophenyl ketones |
US3469982A (en) | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
JPS4925505B1 (es) | 1969-06-10 | 1974-07-01 | ||
US3738835A (en) * | 1971-10-21 | 1973-06-12 | Ibm | Electrophoretic photoresist composition and a method of forming etch resistant masks |
JPS5221526B2 (es) * | 1972-01-10 | 1977-06-11 | ||
US4040925A (en) * | 1974-05-02 | 1977-08-09 | Scm Corporation | Ultraviolet curing of electrocoating compositions |
US4039414A (en) | 1974-06-19 | 1977-08-02 | Scm Corporation | Ultraviolet curing of electrocoating compositions |
US3925181A (en) * | 1974-10-31 | 1975-12-09 | Scm Corp | Cathodic electrocoating process |
BE835203A (nl) * | 1974-11-04 | 1976-05-04 | Fotoresistieve verwijderingssystemen | |
US3975251A (en) | 1975-03-19 | 1976-08-17 | Scm Corporation | Cathodic electrocoating process |
US4025409A (en) * | 1975-07-14 | 1977-05-24 | Scm Corporation | Dual cure cathodic electrocoating process |
JPS5211601A (en) | 1975-07-17 | 1977-01-28 | Taiho Kensetsu Kk | Excavation device |
GB1572441A (en) * | 1975-12-23 | 1980-07-30 | Vickers Ltd | Photopolymerisable polymers with free carboxyl groups and printing plates therefrom |
US4029561A (en) * | 1976-01-22 | 1977-06-14 | Scm Corporation | Photocurable cathodic electrocoating |
US4066523A (en) * | 1976-02-17 | 1978-01-03 | Scm Corporation | Dual cure cathodic electrocoating composition |
US4035274A (en) | 1976-05-24 | 1977-07-12 | Scm Corporation | Dual cure cathodic electrocoating |
US4035273A (en) * | 1976-05-24 | 1977-07-12 | Scm Corporation | Cathodic electrocoating process |
US4166017A (en) * | 1976-05-24 | 1979-08-28 | Scm Corporation | Process for cathodic electrocoating and photocuring |
JPS60432B2 (ja) * | 1978-03-27 | 1985-01-08 | 凸版印刷株式会社 | 部分着色金属化粧板 |
DE2651507C3 (de) | 1976-11-11 | 1981-09-10 | Bayer Ag, 5090 Leverkusen | Verwendung von Triacrylaten von oxäthyliertem Trimethylolpropan mit einem Oxäthylierungsgrad von 2,5 bis 4 als Verdünnungsmittel in strahlenhärtbaren Zusammensetzungen |
DE2816774A1 (de) * | 1977-04-22 | 1978-10-26 | Du Pont | Photopolymerisierbares material |
US4162162A (en) | 1978-05-08 | 1979-07-24 | E. I. Du Pont De Nemours And Company | Derivatives of aryl ketones and p-dialkyl-aminoarylaldehydes as visible sensitizers of photopolymerizable compositions |
US4343885A (en) | 1978-05-09 | 1982-08-10 | Dynachem Corporation | Phototropic photosensitive compositions containing fluoran colorformer |
JPS5527647A (en) | 1978-08-17 | 1980-02-27 | Nippon Telegraph & Telephone | Paint for forming insulating film of conductive printed circuit board and method of forming insulating film |
JPS55148491A (en) | 1979-05-09 | 1980-11-19 | Meidensha Electric Mfg Co Ltd | Method of fabricating printed circuit board |
US4338235A (en) | 1979-12-21 | 1982-07-06 | E. I. Du Pont De Nemours And Company | Electrocoating composition with polyhydroxyamine and acrylic or methacrylic polymers |
DE3005034A1 (de) * | 1980-02-11 | 1981-08-20 | Basf Ag, 6700 Ludwigshafen | Verfahren zur herstellung von ueberzuegen |
US4378264A (en) | 1980-05-27 | 1983-03-29 | E. I. Du Pont De Nemours And Company | Integrated laminating process |
US4382135A (en) | 1981-04-01 | 1983-05-03 | Diamond Shamrock Corporation | Radiation-hardenable diluents |
DE3131448A1 (de) * | 1981-08-07 | 1983-02-24 | Basf Ag, 6700 Ludwigshafen | Fuer die herstellung von photoresistschichten geeignete photopolymerisierbare aufzeichnungsmasse |
CA1182469A (en) | 1981-12-11 | 1985-02-12 | William D. Emmons | Esters of michael addition homopolymers of acrylic acid |
US4414311A (en) * | 1982-03-18 | 1983-11-08 | American Hoechst Corporation | Cathodic deposition of light sensitive components |
-
1984
- 1984-09-26 US US06/654,821 patent/US4592816A/en not_active Expired - Lifetime
-
1985
- 1985-09-12 CA CA000490519A patent/CA1257803A/en not_active Expired
- 1985-09-16 PH PH32784A patent/PH22139A/en unknown
- 1985-09-17 JP JP60205180A patent/JPH081519B2/ja not_active Expired - Lifetime
- 1985-09-23 IE IE234385A patent/IE58622B1/en not_active IP Right Cessation
- 1985-09-23 BR BR8504640A patent/BR8504640A/pt not_active IP Right Cessation
- 1985-09-24 IL IL76491A patent/IL76491A/xx not_active IP Right Cessation
- 1985-09-24 NO NO853738A patent/NO168857C/no not_active IP Right Cessation
- 1985-09-25 DK DK434885A patent/DK168802B1/da not_active IP Right Cessation
- 1985-09-25 DE DE8585306800T patent/DE3566047D1/de not_active Expired
- 1985-09-25 AU AU47862/85A patent/AU586189B2/en not_active Ceased
- 1985-09-25 EP EP85306800A patent/EP0176356B1/en not_active Expired
- 1985-09-25 KR KR1019850007029A patent/KR920005775B1/ko not_active IP Right Cessation
- 1985-09-25 FI FI853691A patent/FI80350C/fi not_active IP Right Cessation
- 1985-09-26 ZA ZA857435A patent/ZA857435B/xx unknown
- 1985-10-01 MX MX000032A patent/MX165458B/es unknown
-
1986
- 1986-01-11 CN CN91108683A patent/CN1058431A/zh not_active Withdrawn
- 1986-01-11 CN CN198686100150A patent/CN86100150A/zh active Pending
-
1989
- 1989-02-14 SG SG84/89A patent/SG8489G/en unknown
- 1989-07-20 HK HK582/89A patent/HK58289A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
NO168857C (no) | 1992-04-08 |
DK434885D0 (da) | 1985-09-25 |
EP0176356B1 (en) | 1988-11-02 |
CN86100150A (zh) | 1987-07-22 |
IL76491A (en) | 1989-07-31 |
DK168802B1 (da) | 1994-06-13 |
SG8489G (en) | 1989-07-14 |
HK58289A (en) | 1989-07-28 |
AU586189B2 (en) | 1989-07-06 |
IE58622B1 (en) | 1993-10-20 |
JPS6180240A (ja) | 1986-04-23 |
FI853691L (fi) | 1986-03-27 |
KR860002735A (ko) | 1986-04-28 |
AU4786285A (en) | 1986-04-10 |
ZA857435B (en) | 1987-11-25 |
NO168857B (no) | 1991-12-30 |
CA1257803A (en) | 1989-07-25 |
EP0176356A3 (en) | 1986-08-20 |
FI80350B (fi) | 1990-01-31 |
DE3566047D1 (en) | 1988-12-08 |
CN1058431A (zh) | 1992-02-05 |
BR8504640A (pt) | 1986-07-15 |
US4592816A (en) | 1986-06-03 |
NO853738L (no) | 1986-04-01 |
FI80350C (fi) | 1990-05-10 |
EP0176356A2 (en) | 1986-04-02 |
KR920005775B1 (ko) | 1992-07-18 |
JPH081519B2 (ja) | 1996-01-10 |
PH22139A (en) | 1988-06-01 |
IE852343L (en) | 1986-03-26 |
FI853691A0 (fi) | 1985-09-25 |
DK434885A (da) | 1986-03-27 |
IL76491A0 (en) | 1986-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MX165458B (es) | Procedimiento electroforetico de deposito | |
KR970063430A (ko) | 패턴 형성 재료 및 패턴 형성 방법 | |
ATE544095T1 (de) | Verfahren zur herstellung einer druckplatte | |
GB1457924A (en) | Manufacturing processes using photoresist masks | |
KR970011911A (ko) | 차광층, 차광층의 형성방법 및 기판의 제조방법 | |
ATE94662T1 (de) | Verfahren zur herstellung von flachdruckplatten. | |
KR950001416A (ko) | 네가형 감광성 조성물 및 이것을 사용한 패턴의 형성방법 | |
KR850005630A (ko) | 음성 포토레지스트 시스템(Negative photoresist system) | |
FR950294A (fr) | Perfectionnements à la fabrication de clichés obtenus par photographie | |
US3506442A (en) | Photomask modification and registration test methods | |
FR2393346A1 (fr) | Element photographique comportant un systeme de neutralisation pour procede de diffusion-transfert | |
KR970076092A (ko) | 감광성 조성물, 패턴 형성방법 및 전자부품의 제조방법 | |
KR910001464A (ko) | 디-불포화 단량체의 중합에 의하여 형성된 감광성 내식막 | |
US2389504A (en) | Process of making reticles or the like | |
KR900003689A (ko) | 고에너지선에 민감한 공중합체 및 이를 사용한 내식막 패턴 제조방법 | |
ATE310975T1 (de) | Verfahren zur herstellung eines für die bildung metallischer leiterbahnen im submikronbereich geeigneten musters | |
JPS5640823A (en) | Forming method of negative type photoresist pattern | |
KR940012544A (ko) | 레지스트 패턴 형성방법 | |
DE69400326T2 (de) | Negativ sowie positiv arbeitende, in einem Schritt entwickelbare Druckplatte sowie Bilderzeugungsverfahren | |
JPS5570847A (en) | Processing method of waterless lithographic printing plate | |
KR890005841A (ko) | 리프트오프에 의한 전극 패턴 형성방법 | |
SU941212A1 (ru) | Способ изготовлени трафаретной печатной формы | |
GB1013332A (en) | Presensitized bi-metal plates for use in offset printing | |
JPS57142657A (en) | Electrophotographic image forming method | |
JPS57105736A (en) | Photosensitive image-forming material |