JPS5640823A - Forming method of negative type photoresist pattern - Google Patents
Forming method of negative type photoresist patternInfo
- Publication number
- JPS5640823A JPS5640823A JP11605579A JP11605579A JPS5640823A JP S5640823 A JPS5640823 A JP S5640823A JP 11605579 A JP11605579 A JP 11605579A JP 11605579 A JP11605579 A JP 11605579A JP S5640823 A JPS5640823 A JP S5640823A
- Authority
- JP
- Japan
- Prior art keywords
- negative type
- ultraviolet rays
- substrate
- photoresist pattern
- qda
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
Abstract
PURPOSE:To obtain a negative type photoresist pattern of superior resolving power for production of LSIs, etc. by developing the photosensitive layer consisting of a polymer containing glycidyl methacrylate and o-quinonediazo compound within the specific temperature range after irradiation of ultraviolet rays. CONSTITUTION:A copolymer such as methyl methacrylate containing >=1% glycidyl methacrylate (GCM) and O-naphthoquinone diazide sulfonic acid ester (QDA) is coated on a silicon substrate. Next, it is prebaked for about 10min at 80 deg.C, after which ultraviolet rays are irradiated thereto and the substrate is immediately heat- treated at 70-130 deg.C. Thence, it is dipped in dioxane etc. and is developed, whereby the negative type resist patterns of superior resolution of about 1mum are obtained. This substrate is treated with an etchant of hydrofluoric acid system and is used for production of elements such as LSIs and magnetic bulbs of high accuracy. The ketene produced by the decomposition of QDA insolubilizes by reacting with the epoxy groups in GCM through baking after the irradiation of ultraviolet rays, while the unradiated portions dissolve. In this way, the fine patterns are obtained with good accuracy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11605579A JPS6053867B2 (en) | 1979-09-12 | 1979-09-12 | Method of forming negative photoresist pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11605579A JPS6053867B2 (en) | 1979-09-12 | 1979-09-12 | Method of forming negative photoresist pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5640823A true JPS5640823A (en) | 1981-04-17 |
JPS6053867B2 JPS6053867B2 (en) | 1985-11-27 |
Family
ID=14677578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11605579A Expired JPS6053867B2 (en) | 1979-09-12 | 1979-09-12 | Method of forming negative photoresist pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6053867B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58115435A (en) * | 1981-12-14 | 1983-07-09 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | Formation of patterned photoresist |
JPS5955431A (en) * | 1982-09-24 | 1984-03-30 | Fujitsu Ltd | Method for forming positive resist pattern for far ultraviolet rays |
EP0212482A2 (en) * | 1985-08-12 | 1987-03-04 | Hoechst Celanese Corporation | Process for obtaining negative images from positive photoresists |
JPH02973A (en) * | 1988-03-15 | 1990-01-05 | Sumitomo Chem Co Ltd | Curable resin composition |
JPH06206297A (en) * | 1992-11-20 | 1994-07-26 | Gerber Scient Prod Inc | Pressplate making method by jet printer or scanning printer using sensitizer |
-
1979
- 1979-09-12 JP JP11605579A patent/JPS6053867B2/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58115435A (en) * | 1981-12-14 | 1983-07-09 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | Formation of patterned photoresist |
JPH0216911B2 (en) * | 1981-12-14 | 1990-04-18 | Intaanashonaru Bijinesu Mashiinzu Corp | |
JPS5955431A (en) * | 1982-09-24 | 1984-03-30 | Fujitsu Ltd | Method for forming positive resist pattern for far ultraviolet rays |
EP0212482A2 (en) * | 1985-08-12 | 1987-03-04 | Hoechst Celanese Corporation | Process for obtaining negative images from positive photoresists |
JPH02973A (en) * | 1988-03-15 | 1990-01-05 | Sumitomo Chem Co Ltd | Curable resin composition |
JPH06206297A (en) * | 1992-11-20 | 1994-07-26 | Gerber Scient Prod Inc | Pressplate making method by jet printer or scanning printer using sensitizer |
Also Published As
Publication number | Publication date |
---|---|
JPS6053867B2 (en) | 1985-11-27 |
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