MY100941A - A process of forming a negative patern in a photoresist layer. - Google Patents
A process of forming a negative patern in a photoresist layer.Info
- Publication number
- MY100941A MY100941A MYPI87000750A MYPI19870750A MY100941A MY 100941 A MY100941 A MY 100941A MY PI87000750 A MYPI87000750 A MY PI87000750A MY PI19870750 A MYPI19870750 A MY PI19870750A MY 100941 A MY100941 A MY 100941A
- Authority
- MY
- Malaysia
- Prior art keywords
- layer
- irradiated portions
- photoresist layer
- portions
- patern
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 5
- 229920002120 photoresistant polymer Polymers 0.000 title abstract 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 150000003377 silicon compounds Chemical class 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000001312 dry etching Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 238000001020 plasma etching Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
Abstract
THE INVENTION RELATES TO A PROCESS OF FORMING HIGH RESOLUTION NEGATIVE PATTERNS IN A PHOTORESIST LAYER.THE PROCESS COMPRISES THE STEPS OF (A) COATING A SUBSTRATE WITH A LAYER OF A PHOTOSENSITIVE RESIN COMPRISING A POLYMER, PREFERABLY A PHENOLIC POLYMER, MIXED OR BOUND TO A PHOTOACTIVE COMPOUND SUCH AS A DIAZOQUINONE, (B) EXPOSING THE LAYER TO ULTRAVIOLET OR VISIBLE LIGHT THROUGH A MASK, (C) TREATING THE LAYER WITH A SILICON COMPOUND (E.G. HEXAMETHYLDISILAZANE) AND (D) DRY DEVELOPING BY PLASMA ETCHING (E.G. AN OXYGEN PLASMA) TO REMOVE THE NON-IRRADIATED PORTIONS OF THE LAYER. THE SILICON COMPOUND IS ABLE TO DIFFUSE SELECTIVELY IN THE IRRADIATED PORTIONS OF THE LAYER AND FIX IN THESE PORTIONS; BY DRY ETCHING A SILICON OXIDE ETCH MASK IS FORMED WHICH PROTECTS THESE IRRADIATED PORTIONS EFFICIENTLY THROUGHOUT THIS PROCESS.THE PROCESS IS USEFUL IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES, INCLUDING INTEGRATED CIRCUITS. (FIG. 2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB848427149A GB8427149D0 (en) | 1984-10-26 | 1984-10-26 | Resist materials |
EP85870142A EP0184567B1 (en) | 1984-10-26 | 1985-10-24 | Process for the formation of negative patterns in a photoresist layer |
Publications (1)
Publication Number | Publication Date |
---|---|
MY100941A true MY100941A (en) | 1991-05-31 |
Family
ID=10568805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI87000750A MY100941A (en) | 1984-10-26 | 1987-06-01 | A process of forming a negative patern in a photoresist layer. |
Country Status (11)
Country | Link |
---|---|
EP (1) | EP0184567B1 (en) |
JP (2) | JPS61107346A (en) |
KR (1) | KR940004423B1 (en) |
AT (1) | ATE48708T1 (en) |
CA (1) | CA1275846C (en) |
DE (1) | DE3574788D1 (en) |
GB (1) | GB8427149D0 (en) |
IE (1) | IE56708B1 (en) |
IL (1) | IL76702A (en) |
MY (1) | MY100941A (en) |
SU (1) | SU1498400A3 (en) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1267378A (en) * | 1984-12-07 | 1990-04-03 | Jer-Ming Yang | Top imaged and organosilicon treated polymer layer developable with plasma |
US4810601A (en) * | 1984-12-07 | 1989-03-07 | International Business Machines Corporation | Top imaged resists |
US4908298A (en) * | 1985-03-19 | 1990-03-13 | International Business Machines Corporation | Method of creating patterned multilayer films for use in production of semiconductor circuits and systems |
US4782008A (en) * | 1985-03-19 | 1988-11-01 | International Business Machines Corporation | Plasma-resistant polymeric material, preparation thereof, and use thereof |
CA1282273C (en) * | 1985-03-19 | 1991-04-02 | International Business Machines Corporation | Method of creating patterned multilayer films for use in production of semiconductor circuits and systems |
JPS61268028A (en) * | 1985-04-08 | 1986-11-27 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Development of mask image in photoresist |
US4613398A (en) * | 1985-06-06 | 1986-09-23 | International Business Machines Corporation | Formation of etch-resistant resists through preferential permeation |
US4737425A (en) * | 1986-06-10 | 1988-04-12 | International Business Machines Corporation | Patterned resist and process |
DE3772267D1 (en) * | 1986-06-12 | 1991-09-26 | Matsushita Electric Ind Co Ltd | IMAGE GENERATION PROCESS. |
DE3751127T2 (en) * | 1986-06-23 | 1995-09-14 | Ibm | Production of permeable polymeric films or layers by leaching. |
JPS63165845A (en) * | 1986-12-26 | 1988-07-09 | Toshiba Corp | Pattern forming method |
CA1286424C (en) * | 1987-01-12 | 1991-07-16 | William C. Mccolgin | Bilayer lithographic process |
NL8700421A (en) * | 1987-02-20 | 1988-09-16 | Philips Nv | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE |
US4808511A (en) * | 1987-05-19 | 1989-02-28 | International Business Machines Corporation | Vapor phase photoresist silylation process |
JPS6479743A (en) * | 1987-09-22 | 1989-03-24 | Nippon Telegraph & Telephone | Pattern forming method by dry developing |
JP2506133B2 (en) * | 1987-11-18 | 1996-06-12 | 日本電信電話株式会社 | Pattern formation method |
US5272026A (en) * | 1987-12-18 | 1993-12-21 | Ucb S.A. | Negative image process utilizing photosensitive compositions containing aromatic fused polycyclic sulfonic acid and partial ester or phenolic resin with diazoquinone sulfonic acid or diazoquinone carboxylic acid, and associated imaged article |
GB8729510D0 (en) * | 1987-12-18 | 1988-02-03 | Ucb Sa | Photosensitive compositions containing phenolic resins & diazoquinone compounds |
JPH01186934A (en) * | 1988-01-21 | 1989-07-26 | Toshiba Corp | Pattern forming method |
JPH01302726A (en) * | 1988-02-10 | 1989-12-06 | Japan Synthetic Rubber Co Ltd | Reactive ion etching equipment |
JP2623309B2 (en) * | 1988-02-22 | 1997-06-25 | ユーシービー ソシエテ アノニム | How to get a resist pattern |
JP2521329B2 (en) * | 1988-07-04 | 1996-08-07 | シャープ株式会社 | Method for manufacturing semiconductor device |
JPH0269746A (en) * | 1988-08-01 | 1990-03-08 | Internatl Business Mach Corp <Ibm> | Method of forming photo-resist, polymer structure and photo-resist |
US5094936A (en) * | 1988-09-16 | 1992-03-10 | Texas Instruments Incorporated | High pressure photoresist silylation process and apparatus |
JPH02158737A (en) * | 1988-10-31 | 1990-06-19 | Internatl Business Mach Corp <Ibm> | Generation of relief pattern and use |
JPH02161432A (en) * | 1988-12-14 | 1990-06-21 | Nec Corp | Formation of fine pattern |
JP2848625B2 (en) * | 1989-03-31 | 1999-01-20 | 株式会社東芝 | Pattern formation method |
JP2930971B2 (en) * | 1989-06-22 | 1999-08-09 | 株式会社東芝 | Pattern formation method |
US5139925A (en) * | 1989-10-18 | 1992-08-18 | Massachusetts Institute Of Technology | Surface barrier silylation of novolak film without photoactive additive patterned with 193 nm excimer laser |
JPH043456A (en) * | 1990-04-19 | 1992-01-08 | Nec Corp | Formation of active layer laminated element |
US5061604A (en) * | 1990-05-04 | 1991-10-29 | Minnesota Mining And Manufacturing Company | Negative crystalline photoresists for UV photoimaging |
DE69208769T2 (en) * | 1991-07-31 | 1996-07-18 | Texas Instruments Inc | High resolution lithographic process |
US5409434A (en) * | 1992-01-30 | 1995-04-25 | Toyota Jidosha Kabushiki Kaisha | Control system with failsafe for shift-by-wire automatic transmission |
KR100396559B1 (en) * | 2001-11-05 | 2003-09-02 | 삼성전자주식회사 | Method for manufacturing monolithic inkjet printhead |
JP5324361B2 (en) * | 2009-08-28 | 2013-10-23 | 東京応化工業株式会社 | Surface treatment agent and surface treatment method |
US9868902B2 (en) | 2014-07-17 | 2018-01-16 | Soulbrain Co., Ltd. | Composition for etching |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4232110A (en) * | 1979-03-12 | 1980-11-04 | Bell Telephone Laboratories, Incorporated | Solid state devices formed by differential plasma etching of resists |
US4307178A (en) * | 1980-04-30 | 1981-12-22 | International Business Machines Corporation | Plasma develoment of resists |
JPS5723937A (en) * | 1980-07-17 | 1982-02-08 | Matsushita Electric Ind Co Ltd | Photographic etching method |
US4396704A (en) * | 1981-04-22 | 1983-08-02 | Bell Telephone Laboratories, Incorporated | Solid state devices produced by organometallic plasma developed resists |
JPS57202533A (en) * | 1981-06-09 | 1982-12-11 | Fujitsu Ltd | Formation of pattern |
JPS57202535A (en) * | 1981-06-09 | 1982-12-11 | Fujitsu Ltd | Formation of negative resist pattern |
DE3377597D1 (en) * | 1982-04-12 | 1988-09-08 | Nippon Telegraph & Telephone | Method for forming micropattern |
JPS5961928A (en) * | 1982-10-01 | 1984-04-09 | Hitachi Ltd | Pattern formation |
CA1248402A (en) * | 1983-09-16 | 1989-01-10 | Larry E. Stillwagon | Method of making articles using gas functionalized plasma developed layer |
JPS60501777A (en) * | 1983-11-02 | 1985-10-17 | ヒユ−ズ・エアクラフト・カンパニ− | Silicon dioxide based graft polymerization lithography mask |
US4552833A (en) * | 1984-05-14 | 1985-11-12 | International Business Machines Corporation | Radiation sensitive and oxygen plasma developable resist |
-
1984
- 1984-10-26 GB GB848427149A patent/GB8427149D0/en active Pending
-
1985
- 1985-10-14 IL IL76702A patent/IL76702A/en not_active IP Right Cessation
- 1985-10-18 CA CA000493257A patent/CA1275846C/en not_active Expired - Lifetime
- 1985-10-24 EP EP85870142A patent/EP0184567B1/en not_active Expired
- 1985-10-24 AT AT85870142T patent/ATE48708T1/en not_active IP Right Cessation
- 1985-10-24 JP JP60238553A patent/JPS61107346A/en active Granted
- 1985-10-24 DE DE8585870142T patent/DE3574788D1/en not_active Expired - Lifetime
- 1985-10-25 SU SU853974782A patent/SU1498400A3/en active
- 1985-10-25 IE IE2643/85A patent/IE56708B1/en not_active IP Right Cessation
- 1985-10-26 KR KR1019850007981A patent/KR940004423B1/en not_active IP Right Cessation
-
1987
- 1987-06-01 MY MYPI87000750A patent/MY100941A/en unknown
-
1988
- 1988-10-11 JP JP63255722A patent/JPH065385B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
IL76702A (en) | 1989-07-31 |
EP0184567A1 (en) | 1986-06-11 |
JPS61107346A (en) | 1986-05-26 |
CA1275846C (en) | 1990-11-06 |
JPH0220869A (en) | 1990-01-24 |
DE3574788D1 (en) | 1990-01-18 |
IE56708B1 (en) | 1991-11-06 |
JPH065385B2 (en) | 1994-01-19 |
KR860003674A (en) | 1986-05-28 |
GB8427149D0 (en) | 1984-12-05 |
ATE48708T1 (en) | 1989-12-15 |
EP0184567B1 (en) | 1989-12-13 |
IL76702A0 (en) | 1986-02-28 |
SU1498400A3 (en) | 1989-07-30 |
JPH0456979B2 (en) | 1992-09-10 |
IE852643L (en) | 1986-04-26 |
KR940004423B1 (en) | 1994-05-25 |
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