IL76702A0 - Process of forming a negative pattern in a photoresist layer - Google Patents

Process of forming a negative pattern in a photoresist layer

Info

Publication number
IL76702A0
IL76702A0 IL76702A IL7670285A IL76702A0 IL 76702 A0 IL76702 A0 IL 76702A0 IL 76702 A IL76702 A IL 76702A IL 7670285 A IL7670285 A IL 7670285A IL 76702 A0 IL76702 A0 IL 76702A0
Authority
IL
Israel
Prior art keywords
layer
photosensitive resin
silicon compound
portions
irradiated portions
Prior art date
Application number
IL76702A
Other versions
IL76702A (en
Original Assignee
Ucb Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ucb Sa filed Critical Ucb Sa
Publication of IL76702A0 publication Critical patent/IL76702A0/en
Publication of IL76702A publication Critical patent/IL76702A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
  • Compounds Of Unknown Constitution (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)

Abstract

1. Process for the formation of negative patterns in a photoresist layer, characterised in that it comprises the following steps : (a) coating of a substrate with a layer of photosensitive resin comprising a polymer having functional groups capable of reacting with a silicon compound, said polymer being mixed or bound by a chemical bound to a diazoquinone, said layer having the property of enabling a silicon compound to diffuse selectively into its irradiated portions when it has been exposed to a visible or ultraviolet radiation in said portions ; (b) exposure of the layer of photosensitive resin to ultraviolet or visible light through a mask to expose only selected portions of the layer ; (c) treatment of the layer of photosensitive resin with a silicon compound, so that this compound is selectively absorbed into the irradiated portions of the layer and reacts with the said functional groups of the photosensitive resin in said irradiated portions, said silicon compound being a silylating agent ; and (d) dry development by plasma etching of the thus treated layer of photosensitive resin to remove selectively the non-irradiated portions thereof in order to obtain the desired negative pattern.
IL76702A 1984-10-26 1985-10-14 Process of forming a negative pattern in a photoresist layer IL76702A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB848427149A GB8427149D0 (en) 1984-10-26 1984-10-26 Resist materials

Publications (2)

Publication Number Publication Date
IL76702A0 true IL76702A0 (en) 1986-02-28
IL76702A IL76702A (en) 1989-07-31

Family

ID=10568805

Family Applications (1)

Application Number Title Priority Date Filing Date
IL76702A IL76702A (en) 1984-10-26 1985-10-14 Process of forming a negative pattern in a photoresist layer

Country Status (11)

Country Link
EP (1) EP0184567B1 (en)
JP (2) JPS61107346A (en)
KR (1) KR940004423B1 (en)
AT (1) ATE48708T1 (en)
CA (1) CA1275846C (en)
DE (1) DE3574788D1 (en)
GB (1) GB8427149D0 (en)
IE (1) IE56708B1 (en)
IL (1) IL76702A (en)
MY (1) MY100941A (en)
SU (1) SU1498400A3 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4810601A (en) * 1984-12-07 1989-03-07 International Business Machines Corporation Top imaged resists
CA1267378A (en) * 1984-12-07 1990-04-03 Jer-Ming Yang Top imaged and organosilicon treated polymer layer developable with plasma
US4908298A (en) * 1985-03-19 1990-03-13 International Business Machines Corporation Method of creating patterned multilayer films for use in production of semiconductor circuits and systems
US4782008A (en) * 1985-03-19 1988-11-01 International Business Machines Corporation Plasma-resistant polymeric material, preparation thereof, and use thereof
CA1282273C (en) * 1985-03-19 1991-04-02 International Business Machines Corporation Method of creating patterned multilayer films for use in production of semiconductor circuits and systems
JPS61268028A (en) * 1985-04-08 1986-11-27 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Development of mask image in photoresist
US4613398A (en) * 1985-06-06 1986-09-23 International Business Machines Corporation Formation of etch-resistant resists through preferential permeation
US4737425A (en) * 1986-06-10 1988-04-12 International Business Machines Corporation Patterned resist and process
DE3772267D1 (en) * 1986-06-12 1991-09-26 Matsushita Electric Industrial Co Ltd IMAGE GENERATION PROCESS.
EP0250762B1 (en) * 1986-06-23 1995-03-08 International Business Machines Corporation Formation of permeable polymeric films or layers via leaching techniques
JPS63165845A (en) * 1986-12-26 1988-07-09 Toshiba Corp Pattern forming method
CA1286424C (en) * 1987-01-12 1991-07-16 William C. Mccolgin Bilayer lithographic process
NL8700421A (en) * 1987-02-20 1988-09-16 Philips Nv METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
US4808511A (en) * 1987-05-19 1989-02-28 International Business Machines Corporation Vapor phase photoresist silylation process
JPS6479743A (en) * 1987-09-22 1989-03-24 Nippon Telegraph & Telephone Pattern forming method by dry developing
JP2506133B2 (en) * 1987-11-18 1996-06-12 日本電信電話株式会社 Pattern formation method
US5272026A (en) * 1987-12-18 1993-12-21 Ucb S.A. Negative image process utilizing photosensitive compositions containing aromatic fused polycyclic sulfonic acid and partial ester or phenolic resin with diazoquinone sulfonic acid or diazoquinone carboxylic acid, and associated imaged article
GB8729510D0 (en) * 1987-12-18 1988-02-03 Ucb Sa Photosensitive compositions containing phenolic resins & diazoquinone compounds
JPH01186934A (en) * 1988-01-21 1989-07-26 Toshiba Corp Pattern forming method
JPH01302726A (en) * 1988-02-10 1989-12-06 Japan Synthetic Rubber Co Ltd Reactive ion etching equipment
JP2623309B2 (en) * 1988-02-22 1997-06-25 ユーシービー ソシエテ アノニム How to get a resist pattern
JP2521329B2 (en) * 1988-07-04 1996-08-07 シャープ株式会社 Method for manufacturing semiconductor device
JPH0269746A (en) * 1988-08-01 1990-03-08 Internatl Business Mach Corp <Ibm> Method of forming photo-resist, polymer structure and photo-resist
US5094936A (en) * 1988-09-16 1992-03-10 Texas Instruments Incorporated High pressure photoresist silylation process and apparatus
EP0366937A2 (en) * 1988-10-31 1990-05-09 International Business Machines Corporation Method of forming relief patterns and use thereof
JPH02161432A (en) * 1988-12-14 1990-06-21 Nec Corp Formation of fine pattern
JP2848625B2 (en) * 1989-03-31 1999-01-20 株式会社東芝 Pattern formation method
JP2930971B2 (en) * 1989-06-22 1999-08-09 株式会社東芝 Pattern formation method
US5139925A (en) * 1989-10-18 1992-08-18 Massachusetts Institute Of Technology Surface barrier silylation of novolak film without photoactive additive patterned with 193 nm excimer laser
JPH043456A (en) * 1990-04-19 1992-01-08 Nec Corp Formation of active layer laminated element
US5061604A (en) * 1990-05-04 1991-10-29 Minnesota Mining And Manufacturing Company Negative crystalline photoresists for UV photoimaging
DE69208769T2 (en) * 1991-07-31 1996-07-18 Texas Instruments Inc High resolution lithographic process
US5409434A (en) * 1992-01-30 1995-04-25 Toyota Jidosha Kabushiki Kaisha Control system with failsafe for shift-by-wire automatic transmission
KR100396559B1 (en) * 2001-11-05 2003-09-02 삼성전자주식회사 Method for manufacturing monolithic inkjet printhead
JP5324361B2 (en) * 2009-08-28 2013-10-23 東京応化工業株式会社 Surface treatment agent and surface treatment method
US9868902B2 (en) 2014-07-17 2018-01-16 Soulbrain Co., Ltd. Composition for etching

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4232110A (en) * 1979-03-12 1980-11-04 Bell Telephone Laboratories, Incorporated Solid state devices formed by differential plasma etching of resists
US4307178A (en) * 1980-04-30 1981-12-22 International Business Machines Corporation Plasma develoment of resists
JPS5723937A (en) * 1980-07-17 1982-02-08 Matsushita Electric Ind Co Ltd Photographic etching method
US4396704A (en) * 1981-04-22 1983-08-02 Bell Telephone Laboratories, Incorporated Solid state devices produced by organometallic plasma developed resists
JPS57202533A (en) * 1981-06-09 1982-12-11 Fujitsu Ltd Formation of pattern
JPS57202535A (en) * 1981-06-09 1982-12-11 Fujitsu Ltd Formation of negative resist pattern
US4426247A (en) * 1982-04-12 1984-01-17 Nippon Telegraph & Telephone Public Corporation Method for forming micropattern
JPS5961928A (en) * 1982-10-01 1984-04-09 Hitachi Ltd Pattern formation
CA1248402A (en) * 1983-09-16 1989-01-10 Larry E. Stillwagon Method of making articles using gas functionalized plasma developed layer
JPS60501777A (en) * 1983-11-02 1985-10-17 ヒユ−ズ・エアクラフト・カンパニ− Silicon dioxide based graft polymerization lithography mask
US4552833A (en) * 1984-05-14 1985-11-12 International Business Machines Corporation Radiation sensitive and oxygen plasma developable resist

Also Published As

Publication number Publication date
MY100941A (en) 1991-05-31
DE3574788D1 (en) 1990-01-18
JPH065385B2 (en) 1994-01-19
EP0184567B1 (en) 1989-12-13
JPH0456979B2 (en) 1992-09-10
JPS61107346A (en) 1986-05-26
IE852643L (en) 1986-04-26
SU1498400A3 (en) 1989-07-30
ATE48708T1 (en) 1989-12-15
KR940004423B1 (en) 1994-05-25
GB8427149D0 (en) 1984-12-05
IL76702A (en) 1989-07-31
CA1275846C (en) 1990-11-06
KR860003674A (en) 1986-05-28
EP0184567A1 (en) 1986-06-11
IE56708B1 (en) 1991-11-06
JPH0220869A (en) 1990-01-24

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