JPS5732444A - Formation of resist pattern - Google Patents
Formation of resist patternInfo
- Publication number
- JPS5732444A JPS5732444A JP10719880A JP10719880A JPS5732444A JP S5732444 A JPS5732444 A JP S5732444A JP 10719880 A JP10719880 A JP 10719880A JP 10719880 A JP10719880 A JP 10719880A JP S5732444 A JPS5732444 A JP S5732444A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- resist material
- film
- resist pattern
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
Abstract
PURPOSE:To form a resist pattern with high sensitivity and high resolution by coating a substrate with a resist material prepared by adding disulfonyl chloride to a positive type resist material, causing a crosslinking reaction by heat treatment, exposing the resulting film to ionized radiation, and dissolving the exposed part in a solvent. CONSTITUTION:A substrate is coated with a resist material prepared by adding disulfonyl chloride such as benzenedisulfonyl chloride to a positive type resist material such as polymethyl methacrylate, and a crosslinking reaction is caused by heat treatment at about 120-250 deg.C to form a resist film having a 3-dimensional network structure. The film is exposed to ionized radiation, and the exposed part alone is dissolved in a solvent to form a resist pattern with high sensitivity and less reduction in the resist film thickness during development, that is, high resolution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10719880A JPS5732444A (en) | 1980-08-06 | 1980-08-06 | Formation of resist pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10719880A JPS5732444A (en) | 1980-08-06 | 1980-08-06 | Formation of resist pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5732444A true JPS5732444A (en) | 1982-02-22 |
Family
ID=14452960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10719880A Pending JPS5732444A (en) | 1980-08-06 | 1980-08-06 | Formation of resist pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5732444A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002228245A (en) * | 2001-01-30 | 2002-08-14 | Kawamura Electric Inc | Mounting structure for square louver |
JP2007308909A (en) * | 2006-05-17 | 2007-11-29 | Matsushita Electric Works Ltd | Flexible drain for eaves gutter |
-
1980
- 1980-08-06 JP JP10719880A patent/JPS5732444A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002228245A (en) * | 2001-01-30 | 2002-08-14 | Kawamura Electric Inc | Mounting structure for square louver |
JP2007308909A (en) * | 2006-05-17 | 2007-11-29 | Matsushita Electric Works Ltd | Flexible drain for eaves gutter |
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