JPS5421271A - Pattern forming method - Google Patents
Pattern forming methodInfo
- Publication number
- JPS5421271A JPS5421271A JP8682977A JP8682977A JPS5421271A JP S5421271 A JPS5421271 A JP S5421271A JP 8682977 A JP8682977 A JP 8682977A JP 8682977 A JP8682977 A JP 8682977A JP S5421271 A JPS5421271 A JP S5421271A
- Authority
- JP
- Japan
- Prior art keywords
- forming method
- pattern forming
- resist film
- etched material
- hardening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To make accurate the pattern size of the etched material formed by using the hardened film, by increasing the plasma-proof performance through hardening the remained resist film with ion injection of Ar, after performing exposure development for the resist film coated on the etched material.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8682977A JPS5421271A (en) | 1977-07-19 | 1977-07-19 | Pattern forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8682977A JPS5421271A (en) | 1977-07-19 | 1977-07-19 | Pattern forming method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5421271A true JPS5421271A (en) | 1979-02-17 |
Family
ID=13897692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8682977A Pending JPS5421271A (en) | 1977-07-19 | 1977-07-19 | Pattern forming method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5421271A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598828A (en) * | 1979-01-24 | 1980-07-28 | Hitachi Ltd | Removing method of thin organic film |
JPS5710411A (en) * | 1980-06-23 | 1982-01-20 | Tokyo Seimitsu Co Ltd | Measuring device for profile |
US4631248A (en) * | 1985-06-21 | 1986-12-23 | Lsi Logic Corporation | Method for forming an electrical contact in an integrated circuit |
EP0528655A2 (en) * | 1991-08-16 | 1993-02-24 | Hitachi, Ltd. | Dry-etching method and apparatus |
CN102315105A (en) * | 2010-07-08 | 2012-01-11 | 中芯国际集成电路制造(上海)有限公司 | Method for manufacturing semiconductor device |
-
1977
- 1977-07-19 JP JP8682977A patent/JPS5421271A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5598828A (en) * | 1979-01-24 | 1980-07-28 | Hitachi Ltd | Removing method of thin organic film |
JPS5710411A (en) * | 1980-06-23 | 1982-01-20 | Tokyo Seimitsu Co Ltd | Measuring device for profile |
JPS6359444B2 (en) * | 1980-06-23 | 1988-11-18 | ||
US4631248A (en) * | 1985-06-21 | 1986-12-23 | Lsi Logic Corporation | Method for forming an electrical contact in an integrated circuit |
EP0528655A2 (en) * | 1991-08-16 | 1993-02-24 | Hitachi, Ltd. | Dry-etching method and apparatus |
CN102315105A (en) * | 2010-07-08 | 2012-01-11 | 中芯国际集成电路制造(上海)有限公司 | Method for manufacturing semiconductor device |
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