JPS5421271A - Pattern forming method - Google Patents

Pattern forming method

Info

Publication number
JPS5421271A
JPS5421271A JP8682977A JP8682977A JPS5421271A JP S5421271 A JPS5421271 A JP S5421271A JP 8682977 A JP8682977 A JP 8682977A JP 8682977 A JP8682977 A JP 8682977A JP S5421271 A JPS5421271 A JP S5421271A
Authority
JP
Japan
Prior art keywords
forming method
pattern forming
resist film
etched material
hardening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8682977A
Other languages
Japanese (ja)
Inventor
Jun Uno
Yoichi Akasaka
Teruhiko Yamazaki
Takashi Itasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8682977A priority Critical patent/JPS5421271A/en
Publication of JPS5421271A publication Critical patent/JPS5421271A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make accurate the pattern size of the etched material formed by using the hardened film, by increasing the plasma-proof performance through hardening the remained resist film with ion injection of Ar, after performing exposure development for the resist film coated on the etched material.
COPYRIGHT: (C)1979,JPO&Japio
JP8682977A 1977-07-19 1977-07-19 Pattern forming method Pending JPS5421271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8682977A JPS5421271A (en) 1977-07-19 1977-07-19 Pattern forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8682977A JPS5421271A (en) 1977-07-19 1977-07-19 Pattern forming method

Publications (1)

Publication Number Publication Date
JPS5421271A true JPS5421271A (en) 1979-02-17

Family

ID=13897692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8682977A Pending JPS5421271A (en) 1977-07-19 1977-07-19 Pattern forming method

Country Status (1)

Country Link
JP (1) JPS5421271A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598828A (en) * 1979-01-24 1980-07-28 Hitachi Ltd Removing method of thin organic film
JPS5710411A (en) * 1980-06-23 1982-01-20 Tokyo Seimitsu Co Ltd Measuring device for profile
US4631248A (en) * 1985-06-21 1986-12-23 Lsi Logic Corporation Method for forming an electrical contact in an integrated circuit
EP0528655A2 (en) * 1991-08-16 1993-02-24 Hitachi, Ltd. Dry-etching method and apparatus
CN102315105A (en) * 2010-07-08 2012-01-11 中芯国际集成电路制造(上海)有限公司 Method for manufacturing semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598828A (en) * 1979-01-24 1980-07-28 Hitachi Ltd Removing method of thin organic film
JPS5710411A (en) * 1980-06-23 1982-01-20 Tokyo Seimitsu Co Ltd Measuring device for profile
JPS6359444B2 (en) * 1980-06-23 1988-11-18
US4631248A (en) * 1985-06-21 1986-12-23 Lsi Logic Corporation Method for forming an electrical contact in an integrated circuit
EP0528655A2 (en) * 1991-08-16 1993-02-24 Hitachi, Ltd. Dry-etching method and apparatus
CN102315105A (en) * 2010-07-08 2012-01-11 中芯国际集成电路制造(上海)有限公司 Method for manufacturing semiconductor device

Similar Documents

Publication Publication Date Title
JPS5421271A (en) Pattern forming method
JPS5339075A (en) Step and repeat exposure method of masks
JPS5226171A (en) Mask creation method
JPS52149978A (en) Developing treatment method of photoresist film
JPS52117077A (en) Electron beam-exposing method
JPS53127266A (en) Forming method of marker
JPS52173A (en) X-ray etching mask
JPS5389673A (en) Fine pattern forming method of semiconductor device
JPS51114931A (en) Photoresist pattern formation method
JPS5380168A (en) Exposure method for electronic beam
JPS5269270A (en) Coating method of photoresist
JPS5244571A (en) Method of forming fine pattern
JPS53105982A (en) Micropattern formation method
JPS51151073A (en) Method to adjust the position of an mask for an integrated circuit
JPS53135578A (en) Mark protection method
JPS51147261A (en) Forming method of pattern
JPS52143772A (en) Alignment method of masks using special reference marks
JPS5255866A (en) Etching method
JPS5348458A (en) Production of semiconductor device
JPS53114676A (en) Electron beam exposure method
JPS5384478A (en) Forming method for micropattern
JPS5427367A (en) Manufacture of microwave circuit pattern
JPS52122082A (en) Making method for electronic beam mask
JPS5381079A (en) Mask forming method
JPS5354974A (en) Electron beam exposure system