KR970705594A - 프리프레그 및 복합 재료용 에폭시수지 혼합물(epoxy resin mixtures for prepregs and composites) - Google Patents

프리프레그 및 복합 재료용 에폭시수지 혼합물(epoxy resin mixtures for prepregs and composites) Download PDF

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Publication number
KR970705594A
KR970705594A KR1019970701503A KR19970701503A KR970705594A KR 970705594 A KR970705594 A KR 970705594A KR 1019970701503 A KR1019970701503 A KR 1019970701503A KR 19970701503 A KR19970701503 A KR 19970701503A KR 970705594 A KR970705594 A KR 970705594A
Authority
KR
South Korea
Prior art keywords
epoxy resin
resin mixture
group
mass
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1019970701503A
Other languages
English (en)
Korean (ko)
Inventor
볼프강 폰 겐츠코브
위르겐 후버
하인리히 카피트차
볼프강 로글러
우베 쇤암스그루버
Original Assignee
디터 크리스트; 하르도 노르트만
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디터 크리스트; 하르도 노르트만, 지멘스 악티엔게젤샤프트 filed Critical 디터 크리스트; 하르도 노르트만
Publication of KR970705594A publication Critical patent/KR970705594A/ko
Abandoned legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/52—Amino carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
KR1019970701503A 1994-09-09 1995-08-25 프리프레그 및 복합 재료용 에폭시수지 혼합물(epoxy resin mixtures for prepregs and composites) Abandoned KR970705594A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DEP4432189.9 1994-09-09
DE4432189 1994-09-09
PCT/DE1995/001136 WO1996007685A1 (de) 1994-09-09 1995-08-25 Epoxidharzmischungen für prepregs und verbundwerkstoffe

Publications (1)

Publication Number Publication Date
KR970705594A true KR970705594A (ko) 1997-10-09

Family

ID=6527844

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970701503A Abandoned KR970705594A (ko) 1994-09-09 1995-08-25 프리프레그 및 복합 재료용 에폭시수지 혼합물(epoxy resin mixtures for prepregs and composites)

Country Status (10)

Country Link
US (1) US5817736A (enExample)
EP (1) EP0779905B1 (enExample)
JP (1) JPH10505120A (enExample)
KR (1) KR970705594A (enExample)
CN (1) CN1068349C (enExample)
AT (1) ATE167203T1 (enExample)
CZ (1) CZ70497A3 (enExample)
DE (1) DE59502531D1 (enExample)
TW (1) TW294694B (enExample)
WO (1) WO1996007685A1 (enExample)

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* Cited by examiner, † Cited by third party
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KR20000048654A (ko) 1996-09-26 2000-07-25 칼 하인쯔 호르닝어 에폭시 수지 혼합물
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
US6440566B1 (en) 1998-10-01 2002-08-27 Airtech International, Inc. Method of molding or curing a resin material at high temperatures using a multilayer release film
AU2089701A (en) * 1999-12-13 2001-06-18 Dow Chemical Company, The Phosphorus element-containing crosslinking agents and flame retardant phosphoruselement-containing epoxy resin compositions prepared therewith
WO2001042359A1 (en) 1999-12-13 2001-06-14 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
DE10043205A1 (de) * 2000-09-01 2002-03-28 Siemens Ag Epoxidharzmischung
US7070861B2 (en) * 2000-12-18 2006-07-04 Mitsubishi Rayon Co., Ltd. Flame retardant epoxy resin composition, and prepreg and fiber-reinforced composite materials made by using the composition
AU2003226414A1 (en) * 2002-05-30 2003-12-19 Dow Global Technologies, Inc. Halogen free ignition resistant thermoplastic resin compositions
RU2230756C1 (ru) * 2002-11-15 2004-06-20 Российский химико-технологический университет им. Д.И. Менделеева Способ получения катализатора отверждения эпоксидно-фенольных композиций
US20050075024A1 (en) * 2003-10-01 2005-04-07 Ranken Paul F. Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
CN102653598B (zh) 2004-05-28 2015-05-13 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
CA2577029C (en) * 2004-09-01 2010-10-26 Bell Helicopter Textron Inc. Compression-molded parts having an embedded conductive layer and method for making same
JP4581599B2 (ja) * 2004-09-27 2010-11-17 住友ベークライト株式会社 樹脂組成物、プリプレグおよび積層板
JP4600029B2 (ja) * 2004-12-17 2010-12-15 住友ベークライト株式会社 樹脂組成物、プリプレグおよび積層板
JP2007169602A (ja) * 2005-11-01 2007-07-05 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物
CN101104727B (zh) * 2007-06-12 2010-04-14 广东生益科技股份有限公司 一种无卤素树脂组合物及其高密度互连用涂树脂铜箔
EP2110462B8 (en) 2008-04-19 2012-09-05 Cognis IP Management GmbH Compositions for degreasing metal surfaces
KR101555191B1 (ko) * 2009-02-11 2015-09-24 삼성전자 주식회사 카본/에폭시 수지 조성물 및 이를 이용한 카본-에폭시 유전막의 제조방법
US20110065870A1 (en) * 2009-09-11 2011-03-17 Chemtura Corporation Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins
US20110065838A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
JP5402732B2 (ja) * 2010-03-08 2014-01-29 住友ベークライト株式会社 樹脂組成物、プリプレグおよび積層板
WO2012064703A1 (en) 2010-11-12 2012-05-18 Albemarle Corporation Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions
CN102051026B (zh) * 2011-01-28 2012-12-12 宏昌电子材料股份有限公司 无卤阻燃环氧树脂组合物及其应用
CA2863546C (en) * 2012-02-06 2018-03-20 Momentive Specialty Chemicals Inc. Epoxy resin formulations for textiles, mats and other fibrous reinforcements for composite applications
CN103382242B (zh) 2013-06-25 2015-06-24 江苏雅克科技股份有限公司 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物
CN104592467A (zh) 2014-08-15 2015-05-06 江苏雅克科技股份有限公司 含磷酚醛树脂化合物及以其为原料制备的含磷阻燃环氧树脂固化物
CN105623238B (zh) 2014-11-06 2018-07-27 江苏雅克科技股份有限公司 含磷官能化聚(亚芳基醚)及以其为原料制备组合物
CN106750226B (zh) 2014-11-11 2019-01-08 江苏雅克科技股份有限公司 含磷聚酯化合物组成及含磷阻燃环氧树脂固化物的制备方法
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
WO2016166226A1 (de) 2015-04-17 2016-10-20 Alzchem Ag Härter und härtungsbeschleuniger mit flammschutzwirkung zur härtung von epoxidharzen
WO2018164833A1 (en) 2017-03-07 2018-09-13 Icl-Ip America Inc. Non-migratory, high-melting/softening polymeric phosphorus-containing flame retardant for printed wiring boards
CN114057395B (zh) * 2021-12-13 2023-09-12 苏州市华研富士新材料有限公司 一种高强度耐高温的玻璃纤维复合板及其生产工艺
CN119505175B (zh) * 2024-10-17 2025-11-11 浙江大学 一种无卤环氧树脂的制备方法

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JPS4839832B1 (enExample) * 1970-08-10 1973-11-27
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JPS58142913A (ja) * 1982-02-20 1983-08-25 Toshiba Chem Corp 熱硬化性樹脂組成物
JPH01123892A (ja) * 1987-11-09 1989-05-16 Dai Ichi Kogyo Seiyaku Co Ltd 新規な反応性難燃剤
ATE107677T1 (de) * 1989-03-03 1994-07-15 Siemens Ag Epoxidharzmischungen.
DE4308185A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung sowie deren Verwendung
WO1994021704A1 (de) * 1993-03-15 1994-09-29 Siemens Aktiengesellschaft Phosphormodifizierte epoxidharze, verfahren zu ihrer herstellung sowie deren verwendung
DE4308187A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
DE4308184A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen

Also Published As

Publication number Publication date
ATE167203T1 (de) 1998-06-15
CN1157626A (zh) 1997-08-20
CN1068349C (zh) 2001-07-11
CZ70497A3 (en) 1997-06-11
DE59502531D1 (de) 1998-07-16
EP0779905A1 (de) 1997-06-25
JPH10505120A (ja) 1998-05-19
US5817736A (en) 1998-10-06
WO1996007685A1 (de) 1996-03-14
TW294694B (enExample) 1997-01-01
EP0779905B1 (de) 1998-06-10

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