KR970704246A - 반도체 기판의 준비방법 및 그 방법에 따른 반도체 디바이스 - Google Patents
반도체 기판의 준비방법 및 그 방법에 따른 반도체 디바이스 Download PDFInfo
- Publication number
- KR970704246A KR970704246A KR1019960707298A KR19960707298A KR970704246A KR 970704246 A KR970704246 A KR 970704246A KR 1019960707298 A KR1019960707298 A KR 1019960707298A KR 19960707298 A KR19960707298 A KR 19960707298A KR 970704246 A KR970704246 A KR 970704246A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- buffer layer
- iron
- doped
- semiconductor
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract 27
- 239000004065 semiconductor Substances 0.000 title claims abstract 18
- 238000000034 method Methods 0.000 title claims 21
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims abstract 8
- 239000012535 impurity Substances 0.000 claims abstract 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 13
- 229910052742 iron Inorganic materials 0.000 claims 7
- 239000000463 material Substances 0.000 claims 5
- 238000000137 annealing Methods 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 3
- 230000005669 field effect Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000007935 neutral effect Effects 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 230000005693 optoelectronics Effects 0.000 claims 1
- FAIAAWCVCHQXDN-UHFFFAOYSA-N phosphorus trichloride Chemical compound ClP(Cl)Cl FAIAAWCVCHQXDN-UHFFFAOYSA-N 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract 2
- 238000009825 accumulation Methods 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02505—Layer structure consisting of more than two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02392—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02461—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02463—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02581—Transition metal or rare earth elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP94304754.8 | 1994-06-29 | ||
| EP94304754 | 1994-06-29 | ||
| PCT/GB1995/001541 WO1996000979A1 (en) | 1994-06-29 | 1995-06-29 | Preparation of semiconductor substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970704246A true KR970704246A (ko) | 1997-08-09 |
Family
ID=8217756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960707298A KR970704246A (ko) | 1994-06-29 | 1995-06-29 | 반도체 기판의 준비방법 및 그 방법에 따른 반도체 디바이스 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0767969A1 (zh) |
| JP (1) | JPH10504685A (zh) |
| KR (1) | KR970704246A (zh) |
| CN (1) | CN1092839C (zh) |
| CA (1) | CA2193098C (zh) |
| WO (1) | WO1996000979A1 (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6462361B1 (en) | 1995-12-27 | 2002-10-08 | Showa Denko K.K. | GaInP epitaxial stacking structure and fabrication method thereof, and a FET transistor using this structure |
| TW522574B (en) * | 1999-09-28 | 2003-03-01 | Showa Denko Kk | GaInP epitaxial stacking structure, a GaInP epitaxial stacking structure for FETs and a fabrication method thereof |
| US6956237B2 (en) | 2002-12-28 | 2005-10-18 | Lg.Philips Lcd Co., Ltd. | Thin film transistor array substrate and method for manufacturing the same |
| CN100364063C (zh) * | 2004-06-21 | 2008-01-23 | 中国科学院半导体研究所 | 电化学腐蚀制备多孔磷化铟半导体材料的方法 |
| CN106972058B (zh) * | 2016-12-15 | 2020-02-11 | 苏州能讯高能半导体有限公司 | 一种半导体器件及其制备方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01226796A (ja) * | 1988-03-04 | 1989-09-11 | Sumitomo Electric Ind Ltd | インジウムリン基板の処理方法 |
| CN1040401A (zh) * | 1989-04-14 | 1990-03-14 | 吉林大学 | 砷化镓/磷化铟异质气相外延技术 |
| JPH03161922A (ja) * | 1989-11-20 | 1991-07-11 | Nec Corp | 異種基板上への３―５族化合物半導体のヘテロエピタキシャル成長法 |
| CN1053146A (zh) * | 1991-02-04 | 1991-07-17 | 中国科学院西安光学精密机械研究所 | 砷化镓衬底上的混合并质外延 |
-
1995
- 1995-06-29 CN CN95194628A patent/CN1092839C/zh not_active Expired - Fee Related
- 1995-06-29 WO PCT/GB1995/001541 patent/WO1996000979A1/en not_active Application Discontinuation
- 1995-06-29 EP EP95923462A patent/EP0767969A1/en not_active Withdrawn
- 1995-06-29 JP JP8502952A patent/JPH10504685A/ja active Pending
- 1995-06-29 KR KR1019960707298A patent/KR970704246A/ko not_active Application Discontinuation
- 1995-06-29 CA CA002193098A patent/CA2193098C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0767969A1 (en) | 1997-04-16 |
| CA2193098C (en) | 2001-02-20 |
| WO1996000979A1 (en) | 1996-01-11 |
| CN1092839C (zh) | 2002-10-16 |
| CA2193098A1 (en) | 1996-01-11 |
| CN1155353A (zh) | 1997-07-23 |
| JPH10504685A (ja) | 1998-05-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |