KR970073243A - 전자 부품 탑재 기판 및 이의 제조 방법(electronic component mounting base board and method of producing the same) - Google Patents

전자 부품 탑재 기판 및 이의 제조 방법(electronic component mounting base board and method of producing the same) Download PDF

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Publication number
KR970073243A
KR970073243A KR1019970016213A KR19970016213A KR970073243A KR 970073243 A KR970073243 A KR 970073243A KR 1019970016213 A KR1019970016213 A KR 1019970016213A KR 19970016213 A KR19970016213 A KR 19970016213A KR 970073243 A KR970073243 A KR 970073243A
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South Korea
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electronic component
ground hole
heat sink
ground
component mounting
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KR1019970016213A
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English (en)
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KR100368773B1 (ko
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마사루 다까다
키요다까 쯔까다
모리오 나까노
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엔도 마사루
이비덴 가부시끼 가이샤
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Publication of KR970073243A publication Critical patent/KR970073243A/ko
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Publication of KR100368773B1 publication Critical patent/KR100368773B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L2224/73265—Layer and wire connectors
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    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
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    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/1517—Multilayer substrate
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    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
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    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
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  • Chemical & Material Sciences (AREA)
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  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

전자 부품을 탑재하기 위한 탑재부를 구비하는 절연 기판 및 상기 절연 기판의 저면상에 배치된 히트싱크판을 포함하는 전자 부품 탑재 기판에 있어서, 상기 절연 기판이 신호 또는 파우워용 배선 패턴, 접지 패턴 및 접지공을 구비하며, 상기 접지 패턴의 전기적 연결을 위해 상기 접지공은 그 내벽 상에 금속 도금막이 구비되어 있고, 상기 히트싱크판과의 전기적 연결을 위해 상기 접지공의 내부에는 땜납이 채워져 있는 전자 부품 탑재 기판이 개시되어 있다.

Description

전자 부품 탑재 기판 및 이의 제조 방법(ELECTRONIC COMPONENT MOUNTING BASE BOARD AND METHOD OF PRODUCING THE SAME)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도 1은 본 발명의 제1 실시예의 따른 전자 부품 탑재 기판의 평면도, 도 2는 도 1에서 Ⅱ-Ⅱ 선을 따라 자른 개략적인 단면도이다.

Claims (14)

  1. 전자 부품을 탑재하기 위한 탑재부를 구비하는 절연 기판 및 상기 절연 기판의 저면상에 배치된 히트싱크판을 포함하는 전자 부품 탑재 기판에 있어서, 상기 절연 기판이 신호 또는 파우워용 배선 패턴, 접지 패턴 및 접지공을 구비하며, 상기 접지 패텬과의 전기적 연결을 위해 상기 접지공은 그 내벽 상에 금속 도금막이 구비되어 있고, 상기 히트싱크판과의 전기적 연결을 위해 상기 접지공의 내부에는 땜납이 채워져 있는 것을 특징으로 하는 전자 부품 탑재 기판.
  2. 제1항에 있어서, 상기 히트싱크판의 단면으로부터 연장되어 이로부터 접힌 돌출부가 상기 접지공의 내부로 삽입되어 땜납을 통하여 이에 고정되는 것을 특징으로 하는 전자 부품 탑재 기판.
  3. 제2항에 있어서, 상기 히트싱크판의 단면에 짝수 개의 돌출부가 형성되어 있는 것을 특징으로 하는 전자 부품 탑재 기판.
  4. 제3항에 있어서, 상기 돌출부가 상기 히트싱크판의 중심에 대하여 대칭으로 배열된 것을 특징으로 하는 전자 부품 탑재 기판.
  5. 제4항에 있어서, 상기 돌출부가 상기 히트싱크판의 중심부로부터 가장 멀리 떨어진 위치에 배열되어 있는 것을 특징으로 하는 전자 부품 탑재 기판.
  6. 제2항에 있어서, 상기 접지공의 내부로 삽입되는 상기 돌출부의 길이가 상기 접지공 깊이의 50 내지 100% 범위에 있는 것을 특징으로 하는 전자 부품 탑재 기판.
  7. 제2항에 있어서, 상기 돌출부의 상기 접지공의 내부로 삽입되는 부분이 상기 삽입부의 전면적의 50 내지 100%에 걸쳐서 상기 접지공의 내부에 충전된 땜납에 결합되는 것을 특징으로 하는 전자 부품 탑재 기판.
  8. 제2항에 있어서, 상기 돌출부의 두께가 0.1 내지 0.5㎜인 것을 특징으로 하는 전자 부품 탑재 기판.
  9. 제1항에 있어서, 상기 히트싱크판의 두께가 0.1 내지 1.0㎜인 것을 특징으로 하는 전자 부품 탑재 기판.
  10. 전자 부품을 탑재하기 위한 탑재부, 신호 또는 파우워용 배선 패턴, 접지 패턴 및 내벽이 금속 도금막으로 덮인 접지공을 절연 기판 상에 제조하는 단계, 상기 접지공에 대응하는 위치에 개구부를 갖는 접착층을 통하여 상기 절연 기판의 저면에 히트싱크판을 부착하는 단계, 상기 접지공의 내부에 땜납을 공급하는 단계, 및 상기 땜납을 가열, 용융하여 상기 접지공의 내벽에 형성된 금속 도금막을 상기 히트싱크판에 결합하는 단계를 포함하는 접지 패턴을 갖는 전자 부품 탑재 기판의 제조 방법.
  11. 제10항에 있어서, 상기 접지공의 내부에 대한 땜납 공급과 상기 신호 또는 파우워용 배선 패턴에 대한 땜납 공급이 동시에 이루어지는 것을 특징으로 하는 방법.
  12. 제10항에 있어서, 상기 접지공의 제조후, 상기 히트싱크판을 상기 절연 기판의 저면상에 부착하기 전에, 상기 히트싱크판의 단면으로부터 연장되고 이로부터 접힌 돌출부가 상기 접지공의 내부로 삽입되는 것을 특징으로 하는 방법.
  13. 제10항에 있어서, 상기 접지공의 내부에 상기 땜납을 공급할 때, 상기 접지공의 내부에 땜납볼이 적하되는 것을 특징으로 하는 방법.
  14. 제10항에 있어서, 상기 접지공의 내부에 상기 땜납을 공급할 때, 땜납 페이스트가 인쇄되는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970016213A 1996-04-29 1997-04-29 전자부품탑재기판및이의제조방법 KR100368773B1 (ko)

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JP9067408A JPH1022589A (ja) 1996-04-29 1997-03-04 電子部品搭載用基板及びその製造方法
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DE19718093A1 (de) 1997-11-13

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