KR970069878A - 실린화 실리카 - Google Patents

실린화 실리카 Download PDF

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Publication number
KR970069878A
KR970069878A KR1019970015688A KR19970015688A KR970069878A KR 970069878 A KR970069878 A KR 970069878A KR 1019970015688 A KR1019970015688 A KR 1019970015688A KR 19970015688 A KR19970015688 A KR 19970015688A KR 970069878 A KR970069878 A KR 970069878A
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silica
silanized silica
silanized
polymer
low
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KR1019970015688A
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KR100260325B1 (ko
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베르너 하르트만
쥐르겐 마이어
하우케 야곱젠
토마스 헤니그
헤닝 카르베
우베 샤크텔리
Original Assignee
메르크 볼프강, 베버 볼프강
데구사 악티엔게젤샤프트
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3081—Treatment with organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/42—Gloss-reducing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/19—Oil-absorption capacity, e.g. DBP values
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • C01P2006/82—Compositional purity water content
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/90—Other properties not specified above
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0243—Silica-rich compounds, e.g. silicates, cement, glass
    • C09K2200/0247—Silica

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Composite Materials (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)

Abstract

하기 물리-화학적 성질 :
비표면적 ㎡/g 80-400
일차 입자 크기 ㎚ 7-40
탭 밀도 g/l 50-300
pH 수치 3-10
탄소 함량 % 0.1-15
DBP 수 % 〈200
을 갖는 실리카는, 집중 혼합하에 경우에 따라 우선적으로 물 또는 묽은 산과 함께, 및 이어서 표면-변형제 또는 몇몇 표면-변형제 또는 몇몇 표면-변형제의 혼합물과 함께 실리카를 분무하고, 혼합하여 단련시키고, 다음으로 분쇄/압축 및 파쇄하므로써 생성된다.

Description

실란화 실리카
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 하기 물리-화학적 성질을 갖는 실란화 실리카 :
    비표면적 ㎡/g 80-400
    일차 입자 크기 ㎚ 7-40
    탭 밀도 g/l 50-300
    pH 수치 3-10
    탄소 함량 % 0.1-15
    DBP 수 % 〈200
  2. 실리카를 집중 혼합하에 혼합 용기내에, 경우에 따라 우선적으로 물 또는 묽은 산과 함께, 및 이어서 표면-변형제 도는 몇몇 변형제의 혼합물과 함께 분무하고, 15 내지 30분간 혼합하고, 100~400℃의 온도에서 1~6시간 동안 단련시켜 소수성, 실란화 실리카를 생성하는 것을 특징으로 하는, 제1항에 따른 실란화 실리카의 생성 방법.
  3. 제2항에 있어서, 다음으로 기계적 작용에 의해서 상기 실리카를 분쇄하거나 또는 압착시키는 것을 더 포함하는 방법.
  4. 제3항에 있어서, 상기 실리카를 분쇄하는 것을 더 포함하는 방법.
  5. 제2항에 있어서, 상기 표면 변형제가 헥사메틸디실라잔인 방법.
  6. 중합체 및 제1항에 따른 실란화 실리카를 함유하는 중합체 조성물.
  7. 제6항에 있어서, 낮은 점성도 및 낮은 유동점을 갖는 중합체 조성물.
  8. 중합체 조성물에 제1항의 실란화 실리카를 첨가하는 것을 특징으로 하는, 낮은 유동점을 갖는 낮은-점성도 중합체 시스템의 생성 방법.
  9. 제1항의 실란화 실리카를 첨가하는 것을 특징으로 하는 페인트 또는 필름의 성질 변형 방법.
  10. 액체 중합체 시스템 및 제1항의 실란화 실리카를 함유하는 피복 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970015688A 1996-04-26 1997-04-25 실란화 실리카 KR100260325B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19616781.7 1996-04-26
DE19616781A DE19616781A1 (de) 1996-04-26 1996-04-26 Silanisierte Kieselsäure

Publications (2)

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KR970069878A true KR970069878A (ko) 1997-11-07
KR100260325B1 KR100260325B1 (ko) 2000-07-01

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EP (1) EP0808880B1 (ko)
JP (1) JP3553315B2 (ko)
KR (1) KR100260325B1 (ko)
CN (1) CN1083397C (ko)
CA (1) CA2203726C (ko)
DE (2) DE19616781A1 (ko)

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CN1083397C (zh) 2002-04-24
CA2203726A1 (en) 1997-10-26
JP3553315B2 (ja) 2004-08-11
KR100260325B1 (ko) 2000-07-01
JPH1087317A (ja) 1998-04-07
CN1167729A (zh) 1997-12-17
EP0808880A2 (de) 1997-11-26
EP0808880B1 (de) 2003-01-08
CA2203726C (en) 2001-08-07
DE59709069D1 (de) 2003-02-13
EP0808880A3 (de) 1999-10-27
DE19616781A1 (de) 1997-11-06

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