KR960043151A - Ac 결합 회로를 가지는 반도체 디바이스 - Google Patents

Ac 결합 회로를 가지는 반도체 디바이스 Download PDF

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Publication number
KR960043151A
KR960043151A KR1019960018643A KR19960018643A KR960043151A KR 960043151 A KR960043151 A KR 960043151A KR 1019960018643 A KR1019960018643 A KR 1019960018643A KR 19960018643 A KR19960018643 A KR 19960018643A KR 960043151 A KR960043151 A KR 960043151A
Authority
KR
South Korea
Prior art keywords
conductive plate
coupled
semiconductor device
capacitor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019960018643A
Other languages
English (en)
Korean (ko)
Inventor
존 가바라 타데우스
Original Assignee
리차드 제이. 보토스
에이 티 앤드 티 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리차드 제이. 보토스, 에이 티 앤드 티 코포레이션 filed Critical 리차드 제이. 보토스
Publication of KR960043151A publication Critical patent/KR960043151A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H10W72/9232—Bond pads having multiple stacked layers with additional elements interposed between layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1019960018643A 1995-05-30 1996-05-30 Ac 결합 회로를 가지는 반도체 디바이스 Withdrawn KR960043151A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US454,049 1989-12-20
US45404995A 1995-05-30 1995-05-30

Publications (1)

Publication Number Publication Date
KR960043151A true KR960043151A (ko) 1996-12-23

Family

ID=23803086

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960018643A Withdrawn KR960043151A (ko) 1995-05-30 1996-05-30 Ac 결합 회로를 가지는 반도체 디바이스

Country Status (4)

Country Link
EP (1) EP0746024A3 (https=)
JP (1) JPH08330525A (https=)
KR (1) KR960043151A (https=)
TW (1) TW291595B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09167827A (ja) * 1995-12-14 1997-06-24 Tokai Rika Co Ltd 半導体装置
KR19990072936A (ko) 1998-02-27 1999-09-27 가나이 쓰도무 아이솔레이터및그것을사용하는모뎀장치
KR100294449B1 (ko) * 1998-07-15 2001-07-12 윤종용 본딩패드하부에형성되는커패시터를구비한반도체집적회로장치
FR2925980B1 (fr) * 2007-12-28 2010-06-04 St Microelectronics Sa Plot de contact electrique
GB2491111B (en) * 2011-05-19 2015-08-19 Oxford Instr Nanotechnology Tools Ltd Charge-sensitive amplifier
WO2014021358A1 (ja) * 2012-08-02 2014-02-06 株式会社堀場製作所 増幅器及び放射線検出器
JP6149503B2 (ja) * 2013-05-17 2017-06-21 住友電気工業株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134951A (ja) * 1984-07-26 1986-02-19 Toshiba Corp 半導体装置の容量評価用モニタ部
JPS63184358A (ja) * 1987-01-27 1988-07-29 Oki Electric Ind Co Ltd 半導体集積回路
JPH02304963A (ja) * 1989-05-19 1990-12-18 Nec Corp 半導体集積回路装置
FR2714528B1 (fr) * 1993-12-27 1996-03-15 Sgs Thomson Microelectronics Structure de test de circuit intégré.

Also Published As

Publication number Publication date
JPH08330525A (ja) 1996-12-13
TW291595B (https=) 1996-11-21
EP0746024A3 (en) 1997-03-26
EP0746024A2 (en) 1996-12-04

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000