KR960029866A - 박막트랜지스터 액정디스플레이 소자의 저항부 및 그 제조방법 - Google Patents

박막트랜지스터 액정디스플레이 소자의 저항부 및 그 제조방법 Download PDF

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KR960029866A
KR960029866A KR1019950001529A KR19950001529A KR960029866A KR 960029866 A KR960029866 A KR 960029866A KR 1019950001529 A KR1019950001529 A KR 1019950001529A KR 19950001529 A KR19950001529 A KR 19950001529A KR 960029866 A KR960029866 A KR 960029866A
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South Korea
Prior art keywords
liquid crystal
crystal display
thin film
film transistor
transistor liquid
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KR1019950001529A
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English (en)
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KR0145902B1 (ko
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김동규
박운용
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김광호
삼성전자 주식회사
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Priority to KR1019950001529A priority Critical patent/KR0145902B1/ko
Priority to US08/593,242 priority patent/US5828428A/en
Publication of KR960029866A publication Critical patent/KR960029866A/ko
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Publication of KR0145902B1 publication Critical patent/KR0145902B1/ko

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136204Arrangements to prevent high voltage or static electricity failures
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/127Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
    • H01L27/1274Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film

Abstract

이 발명은 박막트랜지스터 액정디스플레이 소자의 저항부에 관한 것으로, 저항부로써 n+아몰퍼스실리콘 및 실리사이드를이용하므로써 그 면적을 박막트랜지스터 액정디스플레이 소자의 양산에 바람직하도록 한 것으로써, 기판위에 아몰퍼스 실리콘 및 n+아몰퍼스실리콘이 차례로 패턴되어 있는 반도체층과; 상기 반도체층의 상부에 쇼팅바와 패드로 구성된 금속층과; 상기 금속층의 상부에 패턴되어 적층되어 있는 보호막과; 상기 보호막의 상부에 패턴되어 적층되어 있는 제2패드금속층으로 이루어져 있는 것을 특징으로 하는 박막트랜지스터 액정디스플레이 소자의 저항부에 관한 것이다.

Description

박막트랜지스터 액정디스플레이 소자의 저항부 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명의 박막트랜지스터 액정디스플레이 소자의 저항부를 나타낸 단면도이다.

Claims (4)

  1. 기판(40)위에 아몰퍼스 실리콘(50) 및 n+아몰퍼스실리콘(52)이 차례로 패턴되어 있는 반도체층(50,52)과;상기 반도체층(50,52)의 상부에 쇼팅바(41)와 패드(42)로 구성된 금속층(41,42)과; 상기 금속층(41,42)의 상부에 패턴되어 적층되어 있는 보호막(46)과; 상기 보호막(46)의 상부에 패턴되어 적층되어 있는 제2패드금속층(45)으로 이루어져 있는 박막트랜지스터 액정디스플레이 소자의 저항부.
  2. 제1항에 있어서, 상기 금속층(41,42)은 Cr, Ti, Mo 등을 이용하는 것을 특징으로 하는 박막트랜지스터 액정디스플레이 소자의 저항부.
  3. 제1항에 있어서, 상기 보호막(46)은 상기 금속층(41,42) 상부에 패드위보호막콘택구멍(53)과 저항부 보호막콘택구멍(54)을 형성하는 것을 특징으로 하는 박막트랜지스터 액정디스플레이 소자의 저항부.
  4. 기판(40)위에 아몰퍼스 실리콘(50) 및 n+아몰퍼스실리콘(52)을 연속하여 차례로 적층한 후 패턴하여 반도체층(50,52)을 형성하는 단계와; 상기 반도체층(50,52)의 상부에 소오스/드레인 전극에 사용되는 금속을 적층한 후 패턴하여 쇼팅바(41)와 패드(42)로 구성된 금속층(41,42)을 형성하는 단계와; 상기 금속층(41,42)의 상부에 보호막을 적층한후 패턴하여 보호막(46)을 형성하는 단계와; 상기 보호막(46)의 상부에 화소전극에 사용되는 금속을 적층한 후 패턴하여패드금속층(45)을 형성하는 단계와; 상기 보호막(46)을 마스크로 하여 상기 보호막(46)의 하부에 위치한 금속층(41,45)을식각하는 단계로 이루어져 있는 것을 특징으로 하는 박막트랜지스터 액정디스플레이 소자의 저항부의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950001529A 1995-01-27 1995-01-27 박막트랜지스터 액정디스플레이 소자의 저항부 및 그 제조방법 KR0145902B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1019950001529A KR0145902B1 (ko) 1995-01-27 1995-01-27 박막트랜지스터 액정디스플레이 소자의 저항부 및 그 제조방법
US08/593,242 US5828428A (en) 1995-01-27 1996-01-29 Resistive circuit for a thin film transistor liquid crystal display and a method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950001529A KR0145902B1 (ko) 1995-01-27 1995-01-27 박막트랜지스터 액정디스플레이 소자의 저항부 및 그 제조방법

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KR0145902B1 KR0145902B1 (ko) 1998-09-15

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US5828428A (en) 1998-10-27

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