KR950702789A - 에폭시 유출을 제어할 수 있는 전자 팩키지(Electronic package having controlled epoxy flow) - Google Patents

에폭시 유출을 제어할 수 있는 전자 팩키지(Electronic package having controlled epoxy flow) Download PDF

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Publication number
KR950702789A
KR950702789A KR1019950700109A KR19950700109A KR950702789A KR 950702789 A KR950702789 A KR 950702789A KR 1019950700109 A KR1019950700109 A KR 1019950700109A KR 19950700109 A KR19950700109 A KR 19950700109A KR 950702789 A KR950702789 A KR 950702789A
Authority
KR
South Korea
Prior art keywords
electronic package
die attach
channel
concave channel
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019950700109A
Other languages
English (en)
Korean (ko)
Inventor
알. 호프만 폴
이. 스트라우만 린다
리앙 덱신
패레노 소니 에스
제이. 래미레쯔 저맨
Original Assignee
폴 와인스타인
오린 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폴 와인스타인, 오린 코포레이션 filed Critical 폴 와인스타인
Publication of KR950702789A publication Critical patent/KR950702789A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/047—Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019950700109A 1992-07-13 1993-06-21 에폭시 유출을 제어할 수 있는 전자 팩키지(Electronic package having controlled epoxy flow) Withdrawn KR950702789A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US912456 1986-09-26
US07/912,456 US5239131A (en) 1992-07-13 1992-07-13 Electronic package having controlled epoxy flow
PCT/US1993/005910 WO1994001986A1 (en) 1992-07-13 1993-06-21 Electronic package having controlled epoxy flow

Publications (1)

Publication Number Publication Date
KR950702789A true KR950702789A (ko) 1995-07-29

Family

ID=25431957

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950700109A Withdrawn KR950702789A (ko) 1992-07-13 1993-06-21 에폭시 유출을 제어할 수 있는 전자 팩키지(Electronic package having controlled epoxy flow)

Country Status (10)

Country Link
US (1) US5239131A (enExample)
EP (1) EP0650658A4 (enExample)
JP (1) JPH07509101A (enExample)
KR (1) KR950702789A (enExample)
AU (1) AU4643193A (enExample)
CA (1) CA2140154A1 (enExample)
MX (1) MX9304183A (enExample)
PH (1) PH30196A (enExample)
TW (1) TW243547B (enExample)
WO (1) WO1994001986A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5455386A (en) * 1994-01-14 1995-10-03 Olin Corporation Chamfered electronic package component
EP0754350A4 (en) * 1994-04-05 1998-10-07 Olin Corp METAL-FILLED CAVITY FOR ELECTRONIC PACKING
WO1995028740A1 (en) * 1994-04-14 1995-10-26 Olin Corporation Electronic package having improved wire bonding capability
EP0882384A4 (en) * 1995-07-14 1999-03-24 Olin Corp WELDED GRID ELECTRONIC BOX
US5764484A (en) * 1996-11-15 1998-06-09 Olin Corporation Ground ring for a metal electronic package
US5989989A (en) * 1996-05-31 1999-11-23 Texas Instruments Incorporated Die and cube reroute process
US5939775A (en) * 1996-11-05 1999-08-17 Gcb Technologies, Llc Leadframe structure and process for packaging intergrated circuits
US5949655A (en) * 1997-09-09 1999-09-07 Amkor Technology, Inc. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
US6261868B1 (en) 1999-04-02 2001-07-17 Motorola, Inc. Semiconductor component and method for manufacturing the semiconductor component
US6426565B1 (en) 2000-03-22 2002-07-30 International Business Machines Corporation Electronic package and method of making same
US6395998B1 (en) 2000-09-13 2002-05-28 International Business Machines Corporation Electronic package having an adhesive retaining cavity
AU2002236421A1 (en) * 2002-02-28 2003-09-09 Infineon Technologies Ag A substrate for a semiconductor device
SG107584A1 (en) * 2002-04-02 2004-12-29 Micron Technology Inc Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such masks
US7368391B2 (en) * 2002-04-10 2008-05-06 Micron Technology, Inc. Methods for designing carrier substrates with raised terminals
DE10319782B4 (de) * 2003-04-30 2009-01-02 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement mit einem Chipträgerelement
US7338841B2 (en) * 2005-04-14 2008-03-04 Stats Chippac Ltd. Leadframe with encapsulant guide and method for the fabrication thereof
KR101237668B1 (ko) * 2011-08-10 2013-02-26 삼성전기주식회사 반도체 패키지 기판
JP5861621B2 (ja) * 2012-11-29 2016-02-16 株式会社デンソー 電子装置
CN103972195A (zh) 2013-01-28 2014-08-06 飞思卡尔半导体公司 半导体装置及其装配方法
US10153535B2 (en) 2016-09-20 2018-12-11 Raytheon Company Bond channel reliefs for bonded assemblies and related techniques

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4105861A (en) * 1975-09-29 1978-08-08 Semi-Alloys, Inc. Hermetically sealed container for semiconductor and other electronic devices
US4461924A (en) * 1982-01-21 1984-07-24 Olin Corporation Semiconductor casing
US4594770A (en) * 1982-07-15 1986-06-17 Olin Corporation Method of making semiconductor casing
US4480262A (en) * 1982-07-15 1984-10-30 Olin Corporation Semiconductor casing
US4451540A (en) * 1982-08-30 1984-05-29 Isotronics, Inc. System for packaging of electronic circuits
JPS62241355A (ja) * 1986-04-14 1987-10-22 Hitachi Ltd 半導体装置
GB2195825B (en) * 1986-09-22 1990-01-10 Motorola Inc Integrated circuit package
US4888449A (en) * 1988-01-04 1989-12-19 Olin Corporation Semiconductor package
US5013871A (en) * 1988-02-10 1991-05-07 Olin Corporation Kit for the assembly of a metal electronic package
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
DD284561A5 (de) * 1989-05-26 1990-11-14 ���@���������������@ ����@���������� @����������k�� Chiptraeger
WO1991005368A1 (en) * 1989-10-05 1991-04-18 Digital Equipment Corporation Die attach structure and method
US5025114A (en) * 1989-10-30 1991-06-18 Olin Corporation Multi-layer lead frames for integrated circuit packages
US5073521A (en) * 1989-11-15 1991-12-17 Olin Corporation Method for housing a tape-bonded electronic device and the package employed
JPH0423441A (ja) * 1990-05-18 1992-01-27 Fujitsu Ltd セラミックパッケージ半導体装置およびその製造方法
US5066368A (en) * 1990-08-17 1991-11-19 Olin Corporation Process for producing black integrally colored anodized aluminum components

Also Published As

Publication number Publication date
EP0650658A4 (en) 1996-03-13
JPH07509101A (ja) 1995-10-05
PH30196A (en) 1997-02-05
AU4643193A (en) 1994-01-31
CA2140154A1 (en) 1994-01-20
WO1994001986A1 (en) 1994-01-20
EP0650658A1 (en) 1995-05-03
MX9304183A (es) 1994-05-31
US5239131A (en) 1993-08-24
TW243547B (enExample) 1995-03-21

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000