AU4643193A - Electronic package having controlled epoxy flow - Google Patents

Electronic package having controlled epoxy flow

Info

Publication number
AU4643193A
AU4643193A AU46431/93A AU4643193A AU4643193A AU 4643193 A AU4643193 A AU 4643193A AU 46431/93 A AU46431/93 A AU 46431/93A AU 4643193 A AU4643193 A AU 4643193A AU 4643193 A AU4643193 A AU 4643193A
Authority
AU
Australia
Prior art keywords
electronic package
epoxy flow
controlled epoxy
controlled
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU46431/93A
Other languages
English (en)
Inventor
Paul R. Hoffman
Dexin Liang
Sonny S Pareno
German J Ramirez
Linda E Strauman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of AU4643193A publication Critical patent/AU4643193A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H10W70/047—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01308—
    • H10W72/07311—
    • H10W72/381—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AU46431/93A 1992-07-13 1993-06-21 Electronic package having controlled epoxy flow Abandoned AU4643193A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US912456 1992-07-13
US07/912,456 US5239131A (en) 1992-07-13 1992-07-13 Electronic package having controlled epoxy flow
PCT/US1993/005910 WO1994001986A1 (en) 1992-07-13 1993-06-21 Electronic package having controlled epoxy flow

Publications (1)

Publication Number Publication Date
AU4643193A true AU4643193A (en) 1994-01-31

Family

ID=25431957

Family Applications (1)

Application Number Title Priority Date Filing Date
AU46431/93A Abandoned AU4643193A (en) 1992-07-13 1993-06-21 Electronic package having controlled epoxy flow

Country Status (10)

Country Link
US (1) US5239131A (enExample)
EP (1) EP0650658A4 (enExample)
JP (1) JPH07509101A (enExample)
KR (1) KR950702789A (enExample)
AU (1) AU4643193A (enExample)
CA (1) CA2140154A1 (enExample)
MX (1) MX9304183A (enExample)
PH (1) PH30196A (enExample)
TW (1) TW243547B (enExample)
WO (1) WO1994001986A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5455386A (en) * 1994-01-14 1995-10-03 Olin Corporation Chamfered electronic package component
JPH09511617A (ja) * 1994-04-05 1997-11-18 オリン コーポレイション キャビティの充填がなされた金属製電子パッケージ
WO1995028740A1 (en) * 1994-04-14 1995-10-26 Olin Corporation Electronic package having improved wire bonding capability
KR19990028818A (ko) * 1995-07-14 1999-04-15 와인스타인 폴 금속 볼 그리드 전자 패키지
US5764484A (en) * 1996-11-15 1998-06-09 Olin Corporation Ground ring for a metal electronic package
US5989989A (en) * 1996-05-31 1999-11-23 Texas Instruments Incorporated Die and cube reroute process
US5939775A (en) * 1996-11-05 1999-08-17 Gcb Technologies, Llc Leadframe structure and process for packaging intergrated circuits
US5949655A (en) * 1997-09-09 1999-09-07 Amkor Technology, Inc. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
US6261868B1 (en) 1999-04-02 2001-07-17 Motorola, Inc. Semiconductor component and method for manufacturing the semiconductor component
US6426565B1 (en) 2000-03-22 2002-07-30 International Business Machines Corporation Electronic package and method of making same
US6395998B1 (en) 2000-09-13 2002-05-28 International Business Machines Corporation Electronic package having an adhesive retaining cavity
DE10297665T5 (de) * 2002-02-28 2005-04-14 Infineon Technologies Ag Substrat für eine Halbleitervorrichtung
SG107584A1 (en) * 2002-04-02 2004-12-29 Micron Technology Inc Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such masks
US7368391B2 (en) * 2002-04-10 2008-05-06 Micron Technology, Inc. Methods for designing carrier substrates with raised terminals
DE10319782B4 (de) * 2003-04-30 2009-01-02 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement mit einem Chipträgerelement
US7338841B2 (en) * 2005-04-14 2008-03-04 Stats Chippac Ltd. Leadframe with encapsulant guide and method for the fabrication thereof
KR101237668B1 (ko) * 2011-08-10 2013-02-26 삼성전기주식회사 반도체 패키지 기판
JP5861621B2 (ja) * 2012-11-29 2016-02-16 株式会社デンソー 電子装置
CN103972195A (zh) 2013-01-28 2014-08-06 飞思卡尔半导体公司 半导体装置及其装配方法
US10153535B2 (en) 2016-09-20 2018-12-11 Raytheon Company Bond channel reliefs for bonded assemblies and related techniques

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4105861A (en) * 1975-09-29 1978-08-08 Semi-Alloys, Inc. Hermetically sealed container for semiconductor and other electronic devices
US4461924A (en) * 1982-01-21 1984-07-24 Olin Corporation Semiconductor casing
US4594770A (en) * 1982-07-15 1986-06-17 Olin Corporation Method of making semiconductor casing
US4480262A (en) * 1982-07-15 1984-10-30 Olin Corporation Semiconductor casing
US4451540A (en) * 1982-08-30 1984-05-29 Isotronics, Inc. System for packaging of electronic circuits
JPS62241355A (ja) * 1986-04-14 1987-10-22 Hitachi Ltd 半導体装置
GB2195825B (en) * 1986-09-22 1990-01-10 Motorola Inc Integrated circuit package
US4888449A (en) * 1988-01-04 1989-12-19 Olin Corporation Semiconductor package
US5013871A (en) * 1988-02-10 1991-05-07 Olin Corporation Kit for the assembly of a metal electronic package
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
DD284561A5 (de) * 1989-05-26 1990-11-14 ���@���������������@ ����@���������� @����������k�� Chiptraeger
EP0495005A1 (en) * 1989-10-05 1992-07-22 Digital Equipment Corporation Die attach structure
US5025114A (en) * 1989-10-30 1991-06-18 Olin Corporation Multi-layer lead frames for integrated circuit packages
US5073521A (en) * 1989-11-15 1991-12-17 Olin Corporation Method for housing a tape-bonded electronic device and the package employed
JPH0423441A (ja) * 1990-05-18 1992-01-27 Fujitsu Ltd セラミックパッケージ半導体装置およびその製造方法
US5066368A (en) * 1990-08-17 1991-11-19 Olin Corporation Process for producing black integrally colored anodized aluminum components

Also Published As

Publication number Publication date
MX9304183A (es) 1994-05-31
KR950702789A (ko) 1995-07-29
TW243547B (enExample) 1995-03-21
JPH07509101A (ja) 1995-10-05
CA2140154A1 (en) 1994-01-20
PH30196A (en) 1997-02-05
US5239131A (en) 1993-08-24
EP0650658A4 (en) 1996-03-13
EP0650658A1 (en) 1995-05-03
WO1994001986A1 (en) 1994-01-20

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