KR960701468A - 전자소자용 패키지(package for electronic element) - Google Patents

전자소자용 패키지(package for electronic element) Download PDF

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Publication number
KR960701468A
KR960701468A KR1019950704023A KR19950704023A KR960701468A KR 960701468 A KR960701468 A KR 960701468A KR 1019950704023 A KR1019950704023 A KR 1019950704023A KR 19950704023 A KR19950704023 A KR 19950704023A KR 960701468 A KR960701468 A KR 960701468A
Authority
KR
South Korea
Prior art keywords
package
electronic device
metal foil
electronic
resin adhesive
Prior art date
Application number
KR1019950704023A
Other languages
English (en)
Inventor
시게히로 가와우라
Original Assignee
아메미야 이사무
닛폰 카바이도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아메미야 이사무, 닛폰 카바이도 고교 가부시키가이샤 filed Critical 아메미야 이사무
Publication of KR960701468A publication Critical patent/KR960701468A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0509—Holders; Supports for bulk acoustic wave devices consisting of adhesive elements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Glass Compositions (AREA)

Abstract

전자소자를 수납하고, 기밀하게 봉함하는 본 발명의 전자소자용 패키지는 패키지의 덮개부가 금속박으로 형성되며, 이 덮개부와 본체부를 수지게 접착제로 봉함하는 것을 특징으로 한다.

Description

전자소자용 패키지(PACKAGE FOR ELECTRONIC ELEMENT)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 패키지의 단면도.

Claims (6)

  1. 전자소자를 수납해서, 기밀하게 봉함되어 있는 패키지에 있어서 패키지의 덮개부가 금속박으로 이루어져 있고, 이 덮개부와 본체부가 수지계 접착제로 봉함되어 있는 것을 특징으로 하는 전자소장용 패키지.
  2. 제1항에 있어서, 금속박의 두께는 0.3㎜∼0.005㎜인 것을 특징으로 하는 전자소자용 패키지.
  3. 제1항에 있어서, 금속박의 스테인레스인 것을 특징으로 하는 전자소자용 패키지.
  4. 제1항에 있어서, 금속박의 적어도 접착면측을 표면조도화한 것을 특징으로 하는 전자소자용 패키지.
  5. 제1항에 있어서, 수지계 접착제가 에폭시계수지 접착제인 것을 특징으로 하는 전자소자용 패키지.
  6. 제1항에 있어서, 전자소자가 압전소자인 것을 특징으로 하는 전자소자용 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950704023A 1994-01-21 1995-01-19 전자소자용 패키지(package for electronic element) KR960701468A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP94-19815 1994-01-21
JP6019815A JPH07212169A (ja) 1994-01-21 1994-01-21 電子素子用パッケージ
PCT/JP1995/000049 WO1995020244A1 (en) 1994-01-21 1995-01-19 Package for electronic element

Publications (1)

Publication Number Publication Date
KR960701468A true KR960701468A (ko) 1996-02-24

Family

ID=12009826

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950704023A KR960701468A (ko) 1994-01-21 1995-01-19 전자소자용 패키지(package for electronic element)

Country Status (7)

Country Link
US (1) US5635672A (ko)
EP (1) EP0691680A4 (ko)
JP (1) JPH07212169A (ko)
KR (1) KR960701468A (ko)
CN (1) CN1122167A (ko)
CA (1) CA2157682A1 (ko)
WO (1) WO1995020244A1 (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578890A (en) * 1994-12-29 1996-11-26 The United States Of America As Represented By The Secretary Of The Army Crystal resonator package
JP2970525B2 (ja) * 1996-03-28 1999-11-02 日本電気株式会社 中空パッケージの製造方法および中空パッケージ用製造装置
JP3042431B2 (ja) * 1996-12-03 2000-05-15 株式会社村田製作所 電子部品の封止構造および封止方法
US5945774A (en) * 1997-03-28 1999-08-31 Industrial Technology Research Institute Open package for crystal oscillator chips
US6409859B1 (en) * 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
US6080031A (en) * 1998-09-02 2000-06-27 Motorola, Inc. Methods of encapsulating electroluminescent apparatus
JP3365743B2 (ja) 1999-02-03 2003-01-14 ローム株式会社 半導体装置
JP4710149B2 (ja) * 2001-02-26 2011-06-29 株式会社村田製作所 電子部品パッケージおよびその製造方法
TWI260096B (en) * 2005-02-23 2006-08-11 Advanced Semiconductor Eng Optoelectronic package with wire-protection lid
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
JP2007089117A (ja) * 2005-08-24 2007-04-05 Seiko Instruments Inc 圧電振動子、発振器、電子部品、電子機器、圧電振動子の製造方法及び電子部品の製造方法
US8179022B2 (en) * 2006-09-30 2012-05-15 Citizen Finetech Miyota Co., Ltd. Piezoelectric device with improved separation between input-output terminals and external connecting terminals
US20080115772A1 (en) * 2006-11-21 2008-05-22 Ti Group Automotive Systems, L.L.C. Fluid encapsulant for protecting electronics
US20080136277A1 (en) * 2006-12-08 2008-06-12 Hans Esders Motor-Pump Unit Having a Wet-Running Electric Motor and a Hydraulic Pump which is Driven by the Electric Motor
US20090110845A1 (en) * 2007-10-30 2009-04-30 General Electric Company Methods for bonding high temperature sensors
JP2009130235A (ja) * 2007-11-27 2009-06-11 Panasonic Corp 圧電デバイスとこれを用いた電子機器、及び自動車
JP4555359B2 (ja) * 2008-04-02 2010-09-29 日本電波工業株式会社 水晶振動子
FI126349B (en) * 2012-12-31 2016-10-14 Suunto Oy Electronic device case

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1580600A (en) * 1978-05-09 1980-12-03 Philips Electronic Associated Kpiezoelectric devices
FR2458150A1 (fr) * 1979-05-31 1980-12-26 Ebauches Sa Resonateur a cristal taille pour fonctionner en cisaillement d'epaisseur
US4480262A (en) * 1982-07-15 1984-10-30 Olin Corporation Semiconductor casing
JPS6066836A (ja) * 1983-09-22 1985-04-17 Matsushita Electric Works Ltd 封止半導体装置
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4814943A (en) * 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
DE3716095C1 (de) * 1987-05-14 1988-09-08 Hamba Maschf Becherfuellwerk fuer Nahrungs- und Genussmittel,insbesondere fuer Molkereiprodukte
JPH02271556A (ja) * 1989-04-12 1990-11-06 Denki Kagaku Kogyo Kk 半導体素子パツケージおよびその製造方法
JPH04107955A (ja) * 1990-08-28 1992-04-09 Matsushita Electric Ind Co Ltd 電子回路素子の封止方法
US5473216A (en) * 1994-06-29 1995-12-05 Motorola, Inc. Piezoelectric device for controlling the frequency-temperature shift of piezoelectric crystals and method of making same

Also Published As

Publication number Publication date
CA2157682A1 (en) 1995-07-27
US5635672A (en) 1997-06-03
WO1995020244A1 (en) 1995-07-27
EP0691680A1 (en) 1996-01-10
EP0691680A4 (en) 1996-04-03
CN1122167A (zh) 1996-05-08
JPH07212169A (ja) 1995-08-11

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