KR950004992B1 - 전기장치 제조방법 - Google Patents

전기장치 제조방법 Download PDF

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Publication number
KR950004992B1
KR950004992B1 KR1019920012559A KR920012559A KR950004992B1 KR 950004992 B1 KR950004992 B1 KR 950004992B1 KR 1019920012559 A KR1019920012559 A KR 1019920012559A KR 920012559 A KR920012559 A KR 920012559A KR 950004992 B1 KR950004992 B1 KR 950004992B1
Authority
KR
South Korea
Prior art keywords
palladium
alloy
nickel
plated
temperature
Prior art date
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Expired - Fee Related
Application number
KR1019920012559A
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English (en)
Korean (ko)
Other versions
KR930003459A (ko
Inventor
앤쏘니 애비스 죠셉
벨예코 카디야 이고르
죤 매이사노 2세 죠셉
쇼헤이 나까하라
Original Assignee
아메리칸 텔리폰 앤드 텔레그라프 캄파니
오레그 이. 앨버
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Publication date
Application filed by 아메리칸 텔리폰 앤드 텔레그라프 캄파니, 오레그 이. 앨버 filed Critical 아메리칸 텔리폰 앤드 텔레그라프 캄파니
Publication of KR930003459A publication Critical patent/KR930003459A/ko
Application granted granted Critical
Publication of KR950004992B1 publication Critical patent/KR950004992B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
KR1019920012559A 1991-07-22 1992-07-15 전기장치 제조방법 Expired - Fee Related KR950004992B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/733,492 US5180482A (en) 1991-07-22 1991-07-22 Thermal annealing of palladium alloys
US733,492 1991-07-22

Publications (2)

Publication Number Publication Date
KR930003459A KR930003459A (ko) 1993-02-24
KR950004992B1 true KR950004992B1 (ko) 1995-05-16

Family

ID=24947830

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920012559A Expired - Fee Related KR950004992B1 (ko) 1991-07-22 1992-07-15 전기장치 제조방법

Country Status (9)

Country Link
US (1) US5180482A (https=)
EP (1) EP0524760B1 (https=)
JP (1) JP2607002B2 (https=)
KR (1) KR950004992B1 (https=)
CA (1) CA2069363C (https=)
DE (1) DE69210704T2 (https=)
HK (1) HK179096A (https=)
SG (1) SG43778A1 (https=)
TW (1) TW208046B (https=)

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US6540154B1 (en) * 1991-04-24 2003-04-01 Aerogen, Inc. Systems and methods for controlling fluid feed to an aerosol generator
US7628339B2 (en) 1991-04-24 2009-12-08 Novartis Pharma Ag Systems and methods for controlling fluid feed to an aerosol generator
EP0600570A1 (en) * 1992-11-30 1994-06-08 Dynapro Thin Film Products Inc. Touch switch with coating for inhibiting increased contact resistance
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US5665639A (en) * 1994-02-23 1997-09-09 Cypress Semiconductor Corp. Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal
US5758637A (en) 1995-08-31 1998-06-02 Aerogen, Inc. Liquid dispensing apparatus and methods
US6205999B1 (en) 1995-04-05 2001-03-27 Aerogen, Inc. Methods and apparatus for storing chemical compounds in a portable inhaler
US6085740A (en) 1996-02-21 2000-07-11 Aerogen, Inc. Liquid dispensing apparatus and methods
KR960039315A (ko) * 1995-04-06 1996-11-25 이대원 리드프레임 제조방법
FR2766396B1 (fr) * 1997-07-25 1999-10-01 Radiall Sa Procede pour revetir une piece metallique destinee a etre brasee, revetement utilise a cet effet et piece ainsi revetue
US6807734B2 (en) * 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6235177B1 (en) * 1999-09-09 2001-05-22 Aerogen, Inc. Method for the construction of an aperture plate for dispensing liquid droplets
US6335107B1 (en) 1999-09-23 2002-01-01 Lucent Technologies Inc. Metal article coated with multilayer surface finish for porosity reduction
US7100600B2 (en) * 2001-03-20 2006-09-05 Aerogen, Inc. Fluid filled ampoules and methods for their use in aerosolizers
US7600511B2 (en) * 2001-11-01 2009-10-13 Novartis Pharma Ag Apparatus and methods for delivery of medicament to a respiratory system
US7971588B2 (en) * 2000-05-05 2011-07-05 Novartis Ag Methods and systems for operating an aerosol generator
MXPA02010884A (es) * 2000-05-05 2003-03-27 Aerogen Ireland Ltd Aparato y metodo para el suministro de medicamentos al sistema respiratorio.
US6948491B2 (en) * 2001-03-20 2005-09-27 Aerogen, Inc. Convertible fluid feed system with comformable reservoir and methods
US8336545B2 (en) * 2000-05-05 2012-12-25 Novartis Pharma Ag Methods and systems for operating an aerosol generator
US6546927B2 (en) 2001-03-13 2003-04-15 Aerogen, Inc. Methods and apparatus for controlling piezoelectric vibration
US6732944B2 (en) * 2001-05-02 2004-05-11 Aerogen, Inc. Base isolated nebulizing device and methods
US7360536B2 (en) 2002-01-07 2008-04-22 Aerogen, Inc. Devices and methods for nebulizing fluids for inhalation
US20050205089A1 (en) * 2002-01-07 2005-09-22 Aerogen, Inc. Methods and devices for aerosolizing medicament
US7677467B2 (en) * 2002-01-07 2010-03-16 Novartis Pharma Ag Methods and devices for aerosolizing medicament
WO2003059424A1 (en) 2002-01-15 2003-07-24 Aerogen, Inc. Methods and systems for operating an aerosol generator
US7109111B2 (en) * 2002-02-11 2006-09-19 Applied Materials, Inc. Method of annealing metal layers
ES2572770T3 (es) * 2002-05-20 2016-06-02 Novartis Ag Aparato para proporcionar pulverización para tratamiento médico y métodos
US20070044792A1 (en) * 2005-08-30 2007-03-01 Aerogen, Inc. Aerosol generators with enhanced corrosion resistance
US8616195B2 (en) * 2003-07-18 2013-12-31 Novartis Ag Nebuliser for the production of aerosolized medication
US7946291B2 (en) 2004-04-20 2011-05-24 Novartis Ag Ventilation systems and methods employing aerosol generators
AU2005234774B2 (en) * 2004-04-20 2011-01-20 Novartis Ag Aerosol delivery apparatus for pressure assisted breathing
US7290541B2 (en) * 2004-04-20 2007-11-06 Aerogen, Inc. Aerosol delivery apparatus and method for pressure-assisted breathing systems
US7267121B2 (en) * 2004-04-20 2007-09-11 Aerogen, Inc. Aerosol delivery apparatus and method for pressure-assisted breathing systems
EP1896662B1 (en) * 2005-05-25 2014-07-23 AeroGen, Inc. Vibration systems and methods
JP4828884B2 (ja) * 2005-07-26 2011-11-30 株式会社東芝 プリント回路配線基板、及び電子機器
CN100388572C (zh) * 2006-03-15 2008-05-14 上海坤链电子产品有限公司 电连接器的盒式结构插孔接触件的局部电镀金方法
JP5318375B2 (ja) * 2007-06-25 2013-10-16 株式会社サンユー パラジウム−コバルト合金めっき液、パラジウム−コバルト合金被膜の形成方法及びパラジウム−コバルト合金硬質被膜の製造方法
JP4846740B2 (ja) * 2008-01-23 2011-12-28 旭鍍金株式会社 めっき物の製造方法及び電気めっき方法
US7842170B1 (en) * 2009-03-09 2010-11-30 Von Detten Volker Device for selective plating of electrical contacts for connectors
EP2658719B1 (en) 2010-12-28 2018-08-29 Stamford Devices Limited Photodefined aperture plate and method for producing the same
EP3476982A1 (en) 2012-06-11 2019-05-01 Stamford Devices Limited A method of producing an aperture plate for a nebulizer
WO2015177311A1 (en) 2014-05-23 2015-11-26 Stamford Devices Limited A method for producing an aperture plate
CN117448716B (zh) * 2022-07-18 2026-04-24 中国石油化工股份有限公司 钯合金及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3925170A (en) * 1974-01-23 1975-12-09 American Chem & Refining Co Method and composition for producing bright palladium electrodepositions
GB1495910A (en) * 1975-10-30 1977-12-21 Ibm Method and bath for electroplating palladium on an articl
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
JPS569387A (en) * 1979-07-04 1981-01-30 Seiko Instr & Electronics Ltd Plating method of decorative article
JPS6019630B2 (ja) * 1979-07-18 1985-05-17 日本鉱業株式会社 接触子
US4319967A (en) * 1979-11-01 1982-03-16 Bell Telephone Laboratories, Incorporated Fabrication of palladium anode for X-ray lithography
JPS5772284A (en) * 1980-10-21 1982-05-06 Fujitsu Ltd Method of producing electric contactor
US4486274A (en) * 1981-02-27 1984-12-04 At&T Bell Laboratories Palladium plating prodedure
US4468296A (en) * 1982-12-10 1984-08-28 At&T Bell Laboratories Process for electroplating palladium
JPH0244106B2 (ja) * 1985-06-17 1990-10-02 Yazaki Corp Denkyosetsuten
JPS6353872A (ja) * 1986-08-22 1988-03-08 三菱電機株式会社 接触子用材料
US4911798A (en) * 1988-12-20 1990-03-27 At&T Bell Laboratories Palladium alloy plating process
US4911799A (en) * 1989-08-29 1990-03-27 At&T Bell Laboratories Electrodeposition of palladium films

Also Published As

Publication number Publication date
DE69210704T2 (de) 1996-10-10
TW208046B (https=) 1993-06-21
US5180482A (en) 1993-01-19
CA2069363C (en) 1999-05-18
EP0524760B1 (en) 1996-05-15
CA2069363A1 (en) 1993-01-23
EP0524760A3 (en) 1994-07-13
HK179096A (en) 1996-10-04
JPH05190250A (ja) 1993-07-30
DE69210704D1 (de) 1996-06-20
KR930003459A (ko) 1993-02-24
JP2607002B2 (ja) 1997-05-07
EP0524760A2 (en) 1993-01-27
SG43778A1 (en) 1997-11-14

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