KR950004421A - 웨이퍼 정렬장치 - Google Patents

웨이퍼 정렬장치 Download PDF

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Publication number
KR950004421A
KR950004421A KR1019940015585A KR19940015585A KR950004421A KR 950004421 A KR950004421 A KR 950004421A KR 1019940015585 A KR1019940015585 A KR 1019940015585A KR 19940015585 A KR19940015585 A KR 19940015585A KR 950004421 A KR950004421 A KR 950004421A
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South Korea
Prior art keywords
wafer
pushing
moving
wafers
wafer holding
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KR1019940015585A
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English (en)
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KR0146270B1 (ko
Inventor
도시오 오오노
Original Assignee
기다오까 다까시
미쓰비시 뎅끼 가부시끼가이샤
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Publication of KR950004421A publication Critical patent/KR950004421A/ko
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Publication of KR0146270B1 publication Critical patent/KR0146270B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

복수의 웨이퍼를 다른 피치로 재정렬할 수 있는 웨이퍼 정렬장치.
장치는 각각 복수의 웨이퍼를 유지하는 복수의 웨이퍼 유지판과, 웨이퍼 유지판을 안내하는 안내수단과, 안내수단을 따라 웨이퍼 유지수단을 이동하는 이동수단과를 포함하되, 복수의 웨이퍼 유지판이 안내수단의 일단부에 형성된 때에는 제1피치간격으로 정렬되고, 웨이퍼 유지판이 안내수단의 타단부에 형성된 때에는 제1과는 다른 피치간격, 즉 2피치간격으로 형성된다.

Description

웨이퍼 정렬장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예에 관련하는 웨이퍼 정렬장치의 사시도.

Claims (8)

  1. 각각 복수의 웨이퍼를 유지하는 복수의 웨이퍼 유지판과; 웨이퍼 유지판을 안내하는 안내수단과; 안내수단을 따라 상기 복수의 웨이퍼 유지판을 이동하는 유지판 이동수단과를 포함하되, 상기 복수의 웨이퍼 유지판이 안내수단의 일단부에 형성된 때에는 제1피치 간격으로 정렬되고, 상기 복수의 웨이퍼 유지판이 안내수단의 타단부에 형성된 때에는 제1피치 수단과는 다른 제2피치 간격으로 정렬되는 웨이퍼 정렬장치.
  2. 제1항에 있어서, 각각의 웨이퍼 유지판이 한쌍의 웨이퍼를 유지하기 위하여 제1피치간격으로 형성된 한쌍의 그루브를 가지는 웨이퍼 정렬장치.
  3. 제1항에 있어서, 상기 안내수단이 상기 복수의 웨이퍼 유지판에 대응하여 형성된 복수의 안내홈을 가지는 플레이트캠과, 대응하는 안내홈으로 슬라이드 가능하게 형성되고 대응하는 웨이퍼 유지판에 형성된 복수의 안내 베어링을 포함하는 웨이퍼 정렬장치.
  4. 제3항에 있어서, 상기 유지판 이동수단이 회전 액츄에이터와, 상기 회전 액츄에이터에 의하여 회전되는 회전축과, 상기 회전축에 공정된 아암과, 상기 아암의 선단에 링크되어 회전축의 회전에 따라 상하로 움직이는 상하 이동판과, 상기 회전축에 평행한 상기 상하 이동판에 슬라이드 가능하게 형성되고 대응하는 웨이퍼 유지판을 지지하는 복수의 슬라이딩 베어링과를 포함하는 웨이퍼 정렬장치.
  5. 제3항에 있어서, 상기 플레이트캠이 대치가능하도록 형성된 웨이퍼 정렬장치.
  6. 제1항에 있어서, 카세트에 수납된 복수의 웨이퍼의 기수번째 웨이퍼를 카세트 위로 동시에 밀어올리는 제1밀어올림수단과; 카세트에 수납된 복수의 웨이퍼의 짝수번째 웨이퍼를 카세트 위로 동시에 밀어올리는 제2밀어올림수단과; 상기 제1,2밀어올림수단에 의하여 밀어올려진 복수의 웨이퍼를 파지하는 클램프 수단과; 복수의 웨이퍼 유지판 위로 상기 클램프수단을 이동하는 클램프이동수단과를 또한 포함하고, 복수의 웨이퍼 유지판이 복수의 웨이퍼를 상기 클램프수단으로부터 받아들이는 웨이퍼 정렬장치.
  7. 제6항에 있어서, 상기 제1,2밀어올림수단이 각각 밀어올림판 본체와, 밀어올림판 본체의 상단부에 형성되고 1개의 웨이퍼를 유지하기 위한 그루브가 형성된 밀어올림 블록과, 밀어올림 블록을 밀어올림 본체의 상단부에 제거가능하도록 부착하기 위한 록 레버(lock lever)와를 포함하는 웨이퍼 정렬장치.
  8. 제6항에 있어서, 상기 클램프이동수단이 상기 클램프수단을 상하로 이동시키는 상하이동수단과, 수직축 둘레로 상기 클램프수단을 회전시키기 위한 회전수단과, 상기 클램프수단을 수평으로 이동시키는 수평이동수단과를 포함하는 웨이퍼 정렬장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940015585A 1993-07-01 1994-06-30 웨이퍼 정렬장치 KR0146270B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16365693A JP2812642B2 (ja) 1993-07-01 1993-07-01 ウエハ整列機
JP93-163656 1993-07-01

Publications (2)

Publication Number Publication Date
KR950004421A true KR950004421A (ko) 1995-02-18
KR0146270B1 KR0146270B1 (ko) 1998-11-02

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Application Number Title Priority Date Filing Date
KR1019940015585A KR0146270B1 (ko) 1993-07-01 1994-06-30 웨이퍼 정렬장치

Country Status (5)

Country Link
US (1) US5501568A (ko)
JP (1) JP2812642B2 (ko)
KR (1) KR0146270B1 (ko)
DE (1) DE4423207C2 (ko)
TW (1) TW259891B (ko)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0992704A (ja) * 1995-09-21 1997-04-04 Nakajima:Kk 半導体用シリコンウェハーの移し替え装置
KR100248864B1 (ko) * 1995-12-29 2000-03-15 윤종용 웨이퍼 이송장치를 위한 챠저 어셈블리
US6286688B1 (en) * 1996-04-03 2001-09-11 Scp Global Technologies, Inc. Compliant silicon wafer handling system
US5735662A (en) * 1996-05-14 1998-04-07 Micron Technology, Inc. Adjustable wafer transfer machine
US6250870B1 (en) 1998-08-05 2001-06-26 Micron Electronics, Inc. Apparatus for handling and processing microelectronic-device substrate assemblies
US6413459B1 (en) 1998-08-05 2002-07-02 Micron Technology, Inc. Method for handling and processing microelectronic-device substrate assemblies
DE50002101D1 (de) * 1999-08-27 2003-06-12 Brooks Automation Ag Taegerwil Handhabungsvorrichtung zur bereitstellung eines wafer-stapels
KR100714262B1 (ko) * 2000-10-13 2007-05-02 삼성전자주식회사 반도체장치 제조설비의 웨이퍼 이송장치 및 그에 따른카세트
JP4180787B2 (ja) * 2000-12-27 2008-11-12 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4033689B2 (ja) * 2002-03-01 2008-01-16 東京エレクトロン株式会社 液処理装置および液処理方法
US7600359B2 (en) * 2002-05-09 2009-10-13 Seagate Technology Llc Method of merging two disks concentrically without gap between disks
MY138480A (en) * 2002-05-09 2009-06-30 Maxtor Corp Method of simultaneous two-disk processing of single-sided magnetic recording disks
US7180709B2 (en) * 2002-05-09 2007-02-20 Maxtor Corporation Information-storage media with dissimilar outer diameter and/or inner diameter chamfer designs on two sides
US7083871B2 (en) * 2002-05-09 2006-08-01 Maxtor Corporation Single-sided sputtered magnetic recording disks
US7052739B2 (en) * 2002-05-09 2006-05-30 Maxtor Corporation Method of lubricating multiple magnetic storage disks in close proximity
US7367773B2 (en) * 2002-05-09 2008-05-06 Maxtor Corporation Apparatus for combining or separating disk pairs simultaneously
US7628895B2 (en) * 2002-05-09 2009-12-08 Seagate Technology Llc W-patterned tools for transporting/handling pairs of disks
US7168153B2 (en) * 2002-10-10 2007-01-30 Maxtor Corporation Method for manufacturing single-sided hard memory disks
US7083502B2 (en) * 2002-10-10 2006-08-01 Maxtor Corporation Method for simultaneous two-disk texturing
US7083376B2 (en) * 2002-10-10 2006-08-01 Maxtor Corporation Automated merge nest for pairs of magnetic storage disks
US8172954B2 (en) * 2002-10-10 2012-05-08 Seagate Technology Llc Apparatus for simultaneous two-disk scrubbing and washing
US7748532B2 (en) * 2002-10-10 2010-07-06 Seagate Technology Llc Cassette for holding disks of different diameters
US7882616B1 (en) * 2004-09-02 2011-02-08 Seagate Technology Llc Manufacturing single-sided storage media
ES2329401T3 (es) * 2006-11-24 2009-11-25 JONAS & REDMANN AUTOMATIONSTECHNIK GMBH Procedimiento para la formacion de una carga de obleas "dorso a dorso" a posicionar en una barquilla de soporte y sistema de manipulacion para la formacion de la carga de obleas "dorso a dorso".
JP5151306B2 (ja) * 2007-08-09 2013-02-27 富士通株式会社 部品供給装置及びその方法
US8567837B2 (en) * 2010-11-24 2013-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Reconfigurable guide pin design for centering wafers having different sizes
US8936425B2 (en) * 2012-01-23 2015-01-20 Tera Autotech Corporation Ancillary apparatus and method for loading glass substrates into a bracket
CN102651427A (zh) * 2012-04-21 2012-08-29 中国电子科技集团公司第四十八研究所 一种批量硅片导向装置
CN102983229B (zh) * 2012-12-27 2015-05-20 无锡先导自动化设备股份有限公司 太阳能电池片自动上料装置
CN111916384B (zh) * 2020-08-17 2022-05-17 鑫天虹(厦门)科技有限公司 一种键合机对准模块和键合机

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4108323A (en) * 1977-09-28 1978-08-22 Rca Corporation Machine for changing the spacing of a plurality of wafers
US4573851A (en) * 1983-05-18 1986-03-04 Microglass, Inc. Semiconductor wafer transfer apparatus and method
US4695217A (en) * 1983-11-21 1987-09-22 Lau John J Semiconductor wafer transfer apparatus
JPS60182735A (ja) * 1984-02-29 1985-09-18 Tomuko:Kk ウエ−ハの配列ピツチ変更装置
JPS6270437U (ko) * 1985-10-21 1987-05-02
JPS636857A (ja) * 1986-06-26 1988-01-12 Fujitsu Ltd ウエ−ハ移し替え装置
JPS6448442A (en) * 1987-08-19 1989-02-22 Texas Instruments Japan Shifter for semiconductor wafer
US5030057A (en) * 1987-11-06 1991-07-09 Tel Sagami Limited Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer
US4856957A (en) * 1988-01-11 1989-08-15 Mactronix, Inc. Semiconductor wafer transfer apparatus with back-to-back positioning and separation
FR2627760B1 (fr) * 1988-02-26 1993-01-22 Stephanois Rech Mec Dispositif pour le transfert d'articles d'au moins un organe support a au moins un autre organe support
JP2590363B2 (ja) * 1988-04-05 1997-03-12 東京エレクトロン株式会社 ピッチ変換機
KR0129405B1 (ko) * 1988-04-25 1998-04-07 하자마 겐쥬 배열된 판형상체의 상호 피치간격을 변환하는 피치변환장치 및 피치변환방법
JPH02169408A (ja) * 1988-12-21 1990-06-29 Matsushita Electric Ind Co Ltd 基板ピッチ変更装置
US4957406A (en) * 1989-05-08 1990-09-18 Intelmatec Corporation Apparatus for transferring disks from one cassette to another with different pitch
JPH0379341A (ja) * 1989-08-22 1991-04-04 Kawasaki Steel Corp 溶接性の良好な塗装鋼板
JPH0384043A (ja) * 1989-08-28 1991-04-09 Nippon Sheet Glass Co Ltd 二酸化珪素被覆ポリカーボネート成形体およびその製造方法
JP2796169B2 (ja) * 1990-03-23 1998-09-10 株式会社タカトリハイテック ウエーハの移載装置
US5188499A (en) * 1990-12-14 1993-02-23 Mactronix Method and apparatus for varying wafer spacing

Also Published As

Publication number Publication date
JP2812642B2 (ja) 1998-10-22
DE4423207A1 (de) 1995-01-12
JPH0717629A (ja) 1995-01-20
TW259891B (ko) 1995-10-11
DE4423207C2 (de) 1997-09-25
US5501568A (en) 1996-03-26
KR0146270B1 (ko) 1998-11-02

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