KR940011352A - 개선된 특성을 가진 화학 증기 증착- 제조된 실리콘 탄화물 - Google Patents
개선된 특성을 가진 화학 증기 증착- 제조된 실리콘 탄화물 Download PDFInfo
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- KR940011352A KR940011352A KR1019930024883A KR930024883A KR940011352A KR 940011352 A KR940011352 A KR 940011352A KR 1019930024883 A KR1019930024883 A KR 1019930024883A KR 930024883 A KR930024883 A KR 930024883A KR 940011352 A KR940011352 A KR 940011352A
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- C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
- C04B35/571—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide obtained from Si-containing polymer precursors or organosilicon monomers
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/01—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
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- C01P2006/40—Electric properties
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/931—Silicon carbide semiconductor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
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Abstract
본 발명은 가시 구간 및 적외선 구간에서 광투과성이 있는 β-실리콘 탄화물을 화학 증기 증착 방법에 의해 제조하는 것에 관한 것이다. 증착 조건은 온도가 1400-1500℃ 범위이고, 압력은 50 토르 또는 그 이하이며, H2/메틸트리클로로실란의 몰비는 4-30이고, 증착 속도는 분당 1㎛ 또는 그 이하이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 광 투과성 β-SiC를 제조하는데 사용된 화학 증기 증착(CVD)장치의 계통도이다.
제2도는 VCD-β-SiC와 α-SiC의 투과도를 비교한 그래프이다.
제3a도, 제3b도 및 제3c도는 CVD-β-SiC를 제조하기 위한 용광로의 증착실내에 사용된 차폐 장치/굴대(mandrel)의 여러 가지 배열을 도시한 것이다.
제4도는 고광투과성 CVD-β-SiC의 투광 스펙트럼이다.
Claims (16)
- 0.6328㎛에서 약 20㎝-1또는 그 이하의 감쇠계수를 갖는 비-고정형(free-standing) 화학 증기 증착된 β-SiC.
- 제1항에 있어서, 0.6328㎛에서 약 10㎝-1또는 그 이하의 감쇠 계수를 갖는 것을 특징으로 하는 SiC.
- 제1항에 있어서, 0.6328㎛에서 약 8㎝-1또는 그 이하의 감쇠 계수를 갖는 것을 특징으로 하는 SiC.
- 3㎛에서 약 20㎝-1또는 그 이하의 감쇠 계수를 갖는 비-고정형 화학 증기 증착된 β-SiC.
- 제4항에 있어서, 3㎛에서 약 10㎝-1또는 그 이하의 감쇠 계수를 갖는 것을 특징으로 하는 SiC.
- 제4항에 있어서, 3㎛에서 약 8㎝-1또는 그 이하의 감쇠 계수를 갖는 것을 특징으로 하는 SiC.
- 제4항에 있어서, 3㎛에서 약 5㎝-1또는 그 이하의 감쇠 계수를 갖는 것을 특징으로 하는 SiC.
- 화학 증기 증착에 의해 광 투과성 비-고정형 β-SiC를 제조하는 방법으로서, 증착반응실과 그 내부에 SiC가 증착되는 표면을 제공하고, 상기 반응실내의 상기 표면에 실리콘 탄화물이 열분해 증착될 수 있는 조건하에서 메틸트리클로로실란과 H2가스를 도입시키는 단계에 있어서, 상기 조건이 증착실 온도가 약 1400℃ 내지 약 1500℃, 증착실 압력이 약 50토르 또는 그 이하, H2/메틸트리클로로실란의 몰비가 약 4내지 약 30이며 증착 속도가 분당 1㎛ 또는 그 이하인 것을 특징으로 하는 방법.
- 제8항에 있어서, 상기 압력이 약 10토르 또는 그 이하인 것을 특징으로 하는 방법.
- 제8항에 있어서, 상기 압력이 약 5토르 또는 그 이하인 것을 특징으로 하는 방법.
- 제8항에 있어서, 상기 온도가 약 1400℃ 내지 약 1450℃ 범위인 것을 특징으로 하는 방법.
- 제8항에 있어서, 상기 H2/메틸트리클로로실란 비율이 약 10 내지 약 20 사이인 것을 특징으로 하는 방법.
- 제8항에 있어서, 상기 HCI이 HCl/메틸트리클로로실란 몰비가 약 0.2 이상으로 상기 증착반응실에 공급되는 것을 특징으로 하는 방법.
- 약 500 Ω-㎝ 또는 그 이상의 전기저항도를 갖는 비-고정형 화학 증기 증착된 β-SiC.
- 제14항에 있어서, 저항도가 약 1000 Ω-㎝ 또는 그 이상인 것을 특징으로 하는 SiC.
- 제14항에 있어서, 저항도가 약 10,000 Ω-㎝ 또는 그 이상인 것을 특징으로 하는 SiC.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US97996592A | 1992-11-23 | 1992-11-23 | |
US07/979,965 | 1992-11-23 | ||
US7/979,965 | 1992-11-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940011352A true KR940011352A (ko) | 1994-06-21 |
KR970008982B1 KR970008982B1 (ko) | 1997-06-03 |
Family
ID=25527249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930024883A KR970008982B1 (ko) | 1992-11-23 | 1993-11-22 | 개선된 특성을 가진 화학 증기 증착-제조된 실리콘 탄화물 |
Country Status (11)
Country | Link |
---|---|
US (2) | US5604151A (ko) |
EP (1) | EP0599468B1 (ko) |
JP (1) | JP2667357B2 (ko) |
KR (1) | KR970008982B1 (ko) |
CA (1) | CA2104411C (ko) |
DE (1) | DE69316172T2 (ko) |
HK (1) | HK1003034A1 (ko) |
IL (1) | IL106864A (ko) |
MY (1) | MY111078A (ko) |
SG (1) | SG48942A1 (ko) |
TW (1) | TW337513B (ko) |
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JP3524679B2 (ja) * | 1996-06-21 | 2004-05-10 | 東芝セラミックス株式会社 | 高純度CVD−SiC質の半導体熱処理用部材及びその製造方法 |
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JPH1179846A (ja) * | 1997-09-01 | 1999-03-23 | Tokai Carbon Co Ltd | 炭化珪素成形体 |
JP4043003B2 (ja) * | 1998-02-09 | 2008-02-06 | 東海カーボン株式会社 | SiC成形体及びその製造方法 |
FR2786208B1 (fr) | 1998-11-25 | 2001-02-09 | Centre Nat Rech Scient | Procede de croissance cristalline sur substrat et reacteur pour sa mise en oeuvre |
JP2001048649A (ja) | 1999-07-30 | 2001-02-20 | Asahi Glass Co Ltd | 炭化ケイ素およびその製造方法 |
US6936102B1 (en) * | 1999-08-02 | 2005-08-30 | Tokyo Electron Limited | SiC material, semiconductor processing equipment and method of preparing SiC material therefor |
US6939821B2 (en) * | 2000-02-24 | 2005-09-06 | Shipley Company, L.L.C. | Low resistivity silicon carbide |
US7018947B2 (en) * | 2000-02-24 | 2006-03-28 | Shipley Company, L.L.C. | Low resistivity silicon carbide |
TW464977B (en) * | 2000-11-03 | 2001-11-21 | United Microelectronics Corp | Method for peeling off silicon carbide layer |
EP1205573A1 (en) * | 2000-11-10 | 2002-05-15 | Shipley Company LLC | Silicon carbide with high thermal conductivity |
JP3959952B2 (ja) * | 2000-11-10 | 2007-08-15 | 株式会社デンソー | 炭化珪素単結晶の製造方法及び製造装置 |
JP4000552B2 (ja) * | 2000-12-27 | 2007-10-31 | スズキ株式会社 | 窒化鉄薄膜の製造方法 |
US8202621B2 (en) * | 2001-09-22 | 2012-06-19 | Rohm And Haas Company | Opaque low resistivity silicon carbide |
DE10243022A1 (de) * | 2002-09-17 | 2004-03-25 | Degussa Ag | Abscheidung eines Feststoffs durch thermische Zersetzung einer gasförmigen Substanz in einem Becherreaktor |
US7704327B2 (en) * | 2002-09-30 | 2010-04-27 | Applied Materials, Inc. | High temperature anneal with improved substrate support |
US7540920B2 (en) * | 2002-10-18 | 2009-06-02 | Applied Materials, Inc. | Silicon-containing layer deposition with silicon compounds |
US20040173597A1 (en) * | 2003-03-03 | 2004-09-09 | Manoj Agrawal | Apparatus for contacting gases at high temperature |
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US7247513B2 (en) * | 2003-05-08 | 2007-07-24 | Caracal, Inc. | Dissociation of silicon clusters in a gas phase during chemical vapor deposition homo-epitaxial growth of silicon carbide |
JP4380236B2 (ja) * | 2003-06-23 | 2009-12-09 | 東京エレクトロン株式会社 | 載置台及び熱処理装置 |
US20060008661A1 (en) * | 2003-08-01 | 2006-01-12 | Wijesundara Muthu B | Manufacturable low-temperature silicon carbide deposition technology |
US20050123713A1 (en) * | 2003-12-05 | 2005-06-09 | Forrest David T. | Articles formed by chemical vapor deposition and methods for their manufacture |
US8114505B2 (en) * | 2003-12-05 | 2012-02-14 | Morgan Advanced Ceramics, Inc. | Free-standing silicon carbide articles formed by chemical vapor deposition and methods for their manufacture |
WO2008127425A2 (en) * | 2006-11-22 | 2008-10-23 | S.O.I.Tec Silicon On Insulator Technologies | Abatement of reaction gases from gallium nitride deposition |
CN100577866C (zh) * | 2007-02-27 | 2010-01-06 | 中微半导体设备(上海)有限公司 | 应用于等离子体反应室中的气体喷头组件、其制造方法及其翻新再利用的方法 |
JP2010519773A (ja) * | 2007-02-27 | 2010-06-03 | シクストロン アドヴァンスド マテリアルズ、インコーポレイテッド | 基板上に膜を形成するための方法 |
US8105649B1 (en) | 2007-08-09 | 2012-01-31 | Imaging Systems Technology | Fabrication of silicon carbide shell |
EP2541559B1 (en) | 2011-06-30 | 2014-03-26 | Rohm and Haas Electronic Materials LLC | Transparent conductive articles |
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JP2015052661A (ja) * | 2013-09-06 | 2015-03-19 | イビデン株式会社 | 反射ミラー |
CN110318037B (zh) * | 2018-03-30 | 2021-06-22 | 揖斐电株式会社 | 透光性SiC的制造方法 |
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1993
- 1993-08-17 TW TW082106621A patent/TW337513B/zh active
- 1993-08-19 CA CA002104411A patent/CA2104411C/en not_active Expired - Fee Related
- 1993-09-01 IL IL106864A patent/IL106864A/xx not_active IP Right Cessation
- 1993-10-07 SG SG1996003924A patent/SG48942A1/en unknown
- 1993-10-07 DE DE69316172T patent/DE69316172T2/de not_active Expired - Fee Related
- 1993-10-07 EP EP93307966A patent/EP0599468B1/en not_active Expired - Lifetime
- 1993-11-12 JP JP5283398A patent/JP2667357B2/ja not_active Expired - Fee Related
- 1993-11-22 MY MYPI93002444A patent/MY111078A/en unknown
- 1993-11-22 KR KR1019930024883A patent/KR970008982B1/ko not_active IP Right Cessation
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1995
- 1995-05-11 US US08/439,034 patent/US5604151A/en not_active Expired - Fee Related
- 1995-05-31 US US08/455,007 patent/US5612132A/en not_active Expired - Lifetime
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1998
- 1998-03-13 HK HK98102095A patent/HK1003034A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
IL106864A (en) | 1997-04-15 |
IL106864A0 (en) | 1993-12-28 |
SG48942A1 (en) | 1998-05-18 |
CA2104411A1 (en) | 1994-05-24 |
KR970008982B1 (ko) | 1997-06-03 |
EP0599468A1 (en) | 1994-06-01 |
JPH06239609A (ja) | 1994-08-30 |
MY111078A (en) | 1999-08-30 |
HK1003034A1 (en) | 1998-09-30 |
CA2104411C (en) | 1999-01-19 |
EP0599468B1 (en) | 1998-01-07 |
DE69316172D1 (de) | 1998-02-12 |
TW337513B (en) | 1998-08-01 |
JP2667357B2 (ja) | 1997-10-27 |
DE69316172T2 (de) | 1998-04-16 |
US5604151A (en) | 1997-02-18 |
US5612132A (en) | 1997-03-18 |
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