KR940000740B1 - 레진몰드 반도체의 제조방법 및 장치 - Google Patents

레진몰드 반도체의 제조방법 및 장치 Download PDF

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Publication number
KR940000740B1
KR940000740B1 KR1019860009162A KR860009162A KR940000740B1 KR 940000740 B1 KR940000740 B1 KR 940000740B1 KR 1019860009162 A KR1019860009162 A KR 1019860009162A KR 860009162 A KR860009162 A KR 860009162A KR 940000740 B1 KR940000740 B1 KR 940000740B1
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KR
South Korea
Prior art keywords
mold
resin
cavity
lead frame
runner
Prior art date
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Expired - Fee Related
Application number
KR1019860009162A
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English (en)
Korean (ko)
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KR870005456A (ko
Inventor
준이지 사에기
아이조우 가네다
마사가즈 오자와
다가시 나가가와
구니히고 니시
Original Assignee
가부시기가이샤 히다찌세이사꾸쇼
미쓰다 가쓰시게
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Publication of KR870005456A publication Critical patent/KR870005456A/ko
Application granted granted Critical
Publication of KR940000740B1 publication Critical patent/KR940000740B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • B29C2045/2712—Serial gates for moulding articles in successively filled serial mould cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1019860009162A 1985-11-08 1986-10-31 레진몰드 반도체의 제조방법 및 장치 Expired - Fee Related KR940000740B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60248715A JPS62122136A (ja) 1985-11-08 1985-11-08 レジンモールド半導体の製造方法および装置
JP60-248715 1985-11-08

Publications (2)

Publication Number Publication Date
KR870005456A KR870005456A (ko) 1987-06-09
KR940000740B1 true KR940000740B1 (ko) 1994-01-28

Family

ID=17182261

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860009162A Expired - Fee Related KR940000740B1 (ko) 1985-11-08 1986-10-31 레진몰드 반도체의 제조방법 및 장치

Country Status (3)

Country Link
US (1) US4900501A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS62122136A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR940000740B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4946633A (en) * 1987-04-27 1990-08-07 Hitachi, Ltd. Method of producing semiconductor devices
KR920005448B1 (ko) * 1988-03-14 1992-07-04 가부시끼가이샤 히다찌세이사꾸쇼 반도체 소자의 수지봉지장치 및 그것을 사용한 반도체 소자의 수지봉지방법
JP2724491B2 (ja) * 1989-02-01 1998-03-09 株式会社日立製作所 成形装置
US5044912A (en) * 1989-12-11 1991-09-03 Motorola, Inc. Mold assembly having positioning means
JPH03205117A (ja) * 1990-01-05 1991-09-06 Toshiba Corp マルチプランジャー成形金型
JPH03110848U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1990-02-28 1991-11-13
JP2548625B2 (ja) * 1990-08-27 1996-10-30 シャープ株式会社 半導体装置の製造方法
IT1246743B (it) * 1990-12-28 1994-11-26 Sgs Thomson Microelectronics Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.
US5326243A (en) * 1992-06-25 1994-07-05 Fierkens Richard H J Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device
US5254501A (en) * 1992-09-11 1993-10-19 Cypress Semiconductor Corporation Same-side gated process for encapsulating semiconductor devices
US5460502A (en) * 1993-09-15 1995-10-24 Majercak; Michael L. Plunger apparatus used in a resin molding device for encapsulating electronic components
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
USH1654H (en) * 1995-01-10 1997-06-03 Rounds; Nicholas A. Transfer molding process for encapsulating semiconductor devices
US6531083B1 (en) * 1995-05-02 2003-03-11 Texas Instruments Incorporated Sproutless pre-packaged molding for component encapsulation
US5766987A (en) * 1995-09-22 1998-06-16 Tessera, Inc. Microelectronic encapsulation methods and equipment
US5888443A (en) * 1996-05-02 1999-03-30 Texas Instruments Incorporated Method for manufacturing prepackaged molding compound for component encapsulation
US6173490B1 (en) * 1997-08-20 2001-01-16 National Semiconductor Corporation Method for forming a panel of packaged integrated circuits
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
US6338813B1 (en) 1999-10-15 2002-01-15 Advanced Semiconductor Engineering, Inc. Molding method for BGA semiconductor chip package
KR100423131B1 (ko) * 1999-11-01 2004-03-18 앰코 테크놀로지 코리아 주식회사 반도체 패키지 제조용 부재
US6257857B1 (en) 2000-01-31 2001-07-10 Advanced Semiconductor Engineering, Inc. Molding apparatus for flexible substrate based package
US6856006B2 (en) * 2002-03-28 2005-02-15 Siliconix Taiwan Ltd Encapsulation method and leadframe for leadless semiconductor packages
KR100400496B1 (ko) * 2001-12-13 2003-10-08 서화일 멀티 플립칩의 언더필 인캡슐레이션 공정용 몰드
US7602054B2 (en) * 2005-10-05 2009-10-13 Semiconductor Components Industries, L.L.C. Method of forming a molded array package device having an exposed tab and structure
GB2481974A (en) * 2010-07-12 2012-01-18 Biocomposites Ltd Bone cement pellet mould
CN103050863A (zh) * 2012-12-29 2013-04-17 番禺得意精密电子工业有限公司 电连接结构制造方法
CN107225369A (zh) * 2017-06-19 2017-10-03 乐清市臣功汽车配件有限公司 一种开关用嵌件的成型工艺

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US3716764A (en) * 1963-12-16 1973-02-13 Texas Instruments Inc Process for encapsulating electronic components in plastic
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3484533A (en) * 1966-09-29 1969-12-16 Texas Instruments Inc Method for fabricating semiconductor package and resulting article of manufacture
JPS4637098Y1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1969-12-06 1971-12-21
US3672046A (en) * 1970-01-14 1972-06-27 Technitrol Inc The method of making an electrical component
US3628483A (en) * 1970-03-20 1971-12-21 Amp Inc Method of making power frame for integrated circuit
US3698074A (en) * 1970-06-29 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
US4368168A (en) * 1978-07-17 1983-01-11 Dusan Slepcevic Method for encapsulating electrical components
JPS5612741A (en) * 1979-07-10 1981-02-07 Nec Corp Plastic-sealed integrated circuit device
DE2941770C2 (de) * 1979-10-16 1982-11-04 C.A. Weidmüller KG, 4930 Detmold Verfahren und Vorrichtung zur Herstellung von Kontakten mit Crimpanschluß
EP0070320A4 (en) * 1981-01-26 1985-03-06 Dai Ichi Seiko Co Ltd MOLDING AND SEALING APPARATUS.
JPH0237856B2 (ja) * 1982-05-20 1990-08-28 Nippon Denki Hoomu Erekutoronikusu Kk Jushimoorudohoho
US4513942A (en) * 1983-05-25 1985-04-30 Bourns, Inc. Plate molding apparatus with interlocking cavity plates
DE3336173C2 (de) * 1983-10-05 1985-08-29 Maschinenfabrik Lauffer GmbH & Co KG, 7240 Horb Presse mit mehreren Spritzkolben zur gleichzeitigen Herstellung mehrerer Kunststoffpreßteile

Also Published As

Publication number Publication date
KR870005456A (ko) 1987-06-09
JPH0560656B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-09-02
US4900501A (en) 1990-02-13
JPS62122136A (ja) 1987-06-03

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