JPS5612741A - Plastic-sealed integrated circuit device - Google Patents

Plastic-sealed integrated circuit device

Info

Publication number
JPS5612741A
JPS5612741A JP8704379A JP8704379A JPS5612741A JP S5612741 A JPS5612741 A JP S5612741A JP 8704379 A JP8704379 A JP 8704379A JP 8704379 A JP8704379 A JP 8704379A JP S5612741 A JPS5612741 A JP S5612741A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
plurality
plastic
circuits
connecting
separable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8704379A
Inventor
Tetsuo Ishida
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To simplify the mold and the production process by sealing a plurality of integrated circuits connected to a plurality of terminal blocks with connecting plastics so molded to arrange the circuits successively while notched are provided to make the circuits separable to each element. CONSTITUTION:A plurality of integrated circuits are connected to a lead frame 10 having a plurality of the terminal blocks and the connecting plastic section 7 is molded with a plastic molding machine in such a manner that a plurality of unit plastic parts 1' are successively arranged. The notches having V grooves are so formed between the unit plastic parts of the connecting plastic section 7 to make the circuits separable. This allows plastics to flow in the direction of the arrow C at the molding thereby reducing the number of gates in the die. Hence, simplifying the die, the production process can be curtailed while waste plasitcs during the filling of the gate can be minimized.
JP8704379A 1979-07-10 1979-07-10 Plastic-sealed integrated circuit device Pending JPS5612741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8704379A JPS5612741A (en) 1979-07-10 1979-07-10 Plastic-sealed integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8704379A JPS5612741A (en) 1979-07-10 1979-07-10 Plastic-sealed integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5612741A true true JPS5612741A (en) 1981-02-07

Family

ID=13903905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8704379A Pending JPS5612741A (en) 1979-07-10 1979-07-10 Plastic-sealed integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5612741A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900501A (en) * 1985-11-08 1990-02-13 Hitachi, Ltd. Method and apparatus for encapsulating semi-conductors
US4937654A (en) * 1986-12-26 1990-06-26 Idec Izumi Corporation Electronic part carrying strip and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900501A (en) * 1985-11-08 1990-02-13 Hitachi, Ltd. Method and apparatus for encapsulating semi-conductors
US4937654A (en) * 1986-12-26 1990-06-26 Idec Izumi Corporation Electronic part carrying strip and method of manufacturing the same

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