KR920702599A - 인쇄 배선 기판(printed circuit board)의 제조방법 - Google Patents

인쇄 배선 기판(printed circuit board)의 제조방법

Info

Publication number
KR920702599A
KR920702599A KR1019920700968A KR920700968A KR920702599A KR 920702599 A KR920702599 A KR 920702599A KR 1019920700968 A KR1019920700968 A KR 1019920700968A KR 920700968 A KR920700968 A KR 920700968A KR 920702599 A KR920702599 A KR 920702599A
Authority
KR
South Korea
Prior art keywords
holes
pcb
component
solder
substrate
Prior art date
Application number
KR1019920700968A
Other languages
English (en)
Other versions
KR960010739B1 (ko
Inventor
티. 맥미첸 블래인
제이. 맥멀린 케리
에이. 서대노워쯔 3세 죤
Original Assignee
원본미기재
코덱스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 코덱스 코포레이션 filed Critical 원본미기재
Publication of KR920702599A publication Critical patent/KR920702599A/ko
Application granted granted Critical
Publication of KR960010739B1 publication Critical patent/KR960010739B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1081—Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

내용 없음

Description

인쇄 배선 기판(printed circuit board)의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 PCB의 부분 평면도, 제2도는 제1도의 라인2-2를 따라 취해진 단면도, 제3도는 본 발명에 따라 삽입된 가압결합 커넥터를 설명하는 PCB의 부분사시도.

Claims (6)

  1. 인쇄 배선 기판(PCB)을 제조하는 방법에 있어서, 상기 PCB의 적어도 한 표면상에 도체를 형성하는 것을 포함하고, 상기 PCB는 부품쪽면 및 솔더쪽면을 가지며, 상기 PCB내에 제1및 제2세트의 도금된-관통 구멍(plated-through holes)을 형성하는 것을 포함하며, 상기 방법은; 상기 제1세트의 구멍이 덮혀지고 상기 제2세트의 구멍이 노출되도록, PCB와 상기 솔더쪽 면상에 마스크 층을 퇴적시키고; 상기 제2세트의 구멍을 사용하여 상기 PCB의 상기 부품쪽면으로 부품을 삽입하며; 그곳에서 상기 제2세트의 구멍과 부품들을 납땜하기 위해, 솔더 웨이브(solder wave)를 받도록 PCB의 상기 솔더쪽면을 통과시키고; 도체핀들이 PCB의 상기 부품및 솔더쪽면으로부터 바깥쪽으로 돌출되도록 상기 제1세트의 구멍내로 도체핀들을 삽입하는 단계를 포함하며, 상기 도체 핀의 규격은 전기적 접촉이 형성되게 상기 제1세트의 구멍내로 가압 결합할 정도의 규격인 것을 특징으로 하는 인쇄 배선 기판 제조방법.
  2. 제1항에 있어서, 상기 핀의 삽입 단계가 상기 핀들의 단부들이 결합되게 PCB의 상기 부품쪽면으로 부터 상기 제1세트의 구멍 각각을 덮는 상기 마스크 층을 깨뜨려 그러한 마스크 층이 상기 구멍을 바깥쪽으로 떨어져 나가도록 하는 단계를 포함하는 것을 특징으로 하는 인쇄 배선 기판 제조방법.
  3. 제1항에 있어서, 상기 핀 삽입 단계가 다수의 핀을 구비하는 커넥터 조립체를 상기 제1세트의 구멍내로 동시에 가압하는 단계를 포함하는 것을 특징으로 하는 인쇄 배선 기판 제조방법.
  4. 제1항에 있어서, 상기 핀들이 상기 제1세트의 구멍내로 가압되기 전에 지지 고정물상에 PCB의 상기 솔더측면을 위치시키는 단계를 더 포함하는 것을 특징으로 하는 인쇄 배선 기판 제조방법.
  5. 제1항에 있어서, 상기 제1세트의 구멍을 덮는 상기 마스크 층을 상기 솔더 웨이브로 동일하게 가열함에 의해 보다 깨지기 쉽게 하는 단계를 더 포함하는 것을 특징으로 하는 인쇄 배선 기판 제조방법.
  6. 상기 PCQ에 제1및 제2세트의 도금된 관통 구멍과 실제 비전도성 기판(substrate)을 포함하는 인쇄 배선 기판(PCB)에 있어서, 상기 기판은 부품쪽면 및 솔더쪽면을 가지고 있고, 도체가 적어도 상기 기판의 적어도 한 쪽면에 형성되며, 상기 조립체는; 상기 제1세트의 구멍이 덮히게 하고, 상기 제2세트의 구멍을 노출되도록 상기 기판의 솔더쪽면에 배치된 미스크 층과, 부품의 리드가 상기 제2세트의 구멍에 납땜되어 있는, 상기 기판의 상기 부품쪽면에 배치된 부품과, 상기 기판의 상기 부품 및 솔더쪽면을 지나 상당 부분이 돌출되게 상기 제1세트의 구멍내에 배치된 전도성 핀들을 포함하며, 상기 제1세트의 구멍을 덮는 상기 마스크 층은 상기 핀들이 상기 제2세트의 구멍을 통해 돌출될때 깨져나가는 것을 특징으로 하는 인쇄 배선 기판 조립체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920700968A 1990-09-10 1991-09-04 인쇄 회로 기판의 제조 방법 및 인쇄 회로 기판 조립체 KR960010739B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US07/580,408 US5092035A (en) 1990-09-10 1990-09-10 Method of making printed circuit board assembly
US580,408 1990-09-10
PCT/US1991/006416 WO1992004812A1 (en) 1990-09-10 1991-09-04 Printed circuit board manufacturing method accommodates wave soldering and press fitting of components
US580408 1995-12-28

Publications (2)

Publication Number Publication Date
KR920702599A true KR920702599A (ko) 1992-09-04
KR960010739B1 KR960010739B1 (ko) 1996-08-07

Family

ID=24320987

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920700968A KR960010739B1 (ko) 1990-09-10 1991-09-04 인쇄 회로 기판의 제조 방법 및 인쇄 회로 기판 조립체

Country Status (7)

Country Link
US (1) US5092035A (ko)
JP (1) JPH05502341A (ko)
KR (1) KR960010739B1 (ko)
CA (1) CA2073008C (ko)
DE (2) DE4192038C2 (ko)
MX (1) MX174268B (ko)
WO (1) WO1992004812A1 (ko)

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Also Published As

Publication number Publication date
WO1992004812A1 (en) 1992-03-19
DE4192038T (ko) 1992-08-27
DE4192038C2 (de) 1996-10-31
MX174268B (es) 1994-05-02
US5092035A (en) 1992-03-03
CA2073008A1 (en) 1992-03-11
CA2073008C (en) 1995-12-26
KR960010739B1 (ko) 1996-08-07
JPH05502341A (ja) 1993-04-22

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