CN100484371C - 防止主机板短路的焊盘 - Google Patents

防止主机板短路的焊盘 Download PDF

Info

Publication number
CN100484371C
CN100484371C CNB2004100278441A CN200410027844A CN100484371C CN 100484371 C CN100484371 C CN 100484371C CN B2004100278441 A CNB2004100278441 A CN B2004100278441A CN 200410027844 A CN200410027844 A CN 200410027844A CN 100484371 C CN100484371 C CN 100484371C
Authority
CN
China
Prior art keywords
pad
short circuit
components
area
prevents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100278441A
Other languages
English (en)
Other versions
CN1713801A (zh
Inventor
王萍
李艳芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNB2004100278441A priority Critical patent/CN100484371C/zh
Priority to US11/027,215 priority patent/US7079399B2/en
Publication of CN1713801A publication Critical patent/CN1713801A/zh
Application granted granted Critical
Publication of CN100484371C publication Critical patent/CN100484371C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/0949Pad close to a hole, not surrounding the hole
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10651Component having two leads, e.g. resistor, capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1446Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

一种防止主机板短路的焊盘,用以防止通过机器设备在印刷电路板上插接元器件时,元器件引脚弯折搭接到周围线路引起的短路。所述防止主机板短路的焊盘,包括一对插孔、一对分别分布在对应插孔周围的焊盘区域,插孔分别穿过对应的焊盘区域的中心,插孔用于插接元器件引脚,布线时,在印刷电路板原有焊盘区域外围,增加一附加区域且与所述焊盘区域相接,所述附加区域用于承接元器件引脚弯折出所述焊盘区域的部分,此时,通过机器设备向印刷电路板上插接元器件时,弯折的元器件引脚超出原焊盘的部分即可以落入这些增加的附加区域所圈定的区域中,从而防止其搭接到印刷电路板上的线路上,避免短路现象发生。

Description

防止主机板短路的焊盘
【技术领域】
本发明是关于一种印刷电路板(PCB)的结构设计,特别是指一种避免因零件引脚弯折而导致主机板短路的焊盘结构。
【背景技术】
一般印刷电路板上开设有许多插孔,这些插孔提供零组件也就是插件元器件与该印刷电路板的插接。印刷电路板布线时,在每个插孔周围呈圆环形成一焊盘区域,这些焊盘覆盖材料通常是锡,焊盘区域是非走线区域。插接元器件插接到印刷电路板插孔中后,需要通过波峰/回流焊接工艺从而将这些插接元器件牢牢固定在印刷电路板上。而焊盘区域即防止焊接时引起周围电路短路。
通常,制造主机板时,将较大的插接元器件,如电阻、电容、调压器等,通过手工插接到印刷电路板对应的插孔中,然而这样不但操作不便,效率也相应低下。所以,业界提出通过机器插接的方法,将较大的插接元器件通过机器设备插接到印刷电路板对应的插孔中,这样操作可以大大提升主机板组装的效率。
插接的元器件的引脚标准情况下应该与印刷电路板垂直,但是,机器插接随之产生一个问题,即插接元器件引脚容易产生弯折,根据插接机器设备的不同,插接元器件引脚弯折的角度也不同。通常引脚弯折有四种可能,请参见图1至图4,每幅图表示一种元器件引脚弯折现象。其中10′及11′为印刷电路板(图未示)上预留的一对插孔,这些插孔10′及11′用于含有两个引脚的元器件(图未示)的插接,20′及21′分别是插孔10′及11′周围的焊盘,30′及31′是一元器件的两引脚,a1及a2、b1及b2为这些引脚30′及31′分别偏离两插孔10′及11′连线的角度,这些角度的值视设备而定,通常a1=a2=45度,b1=b2=45度。一般一种设备插接的元器件只可能发生其中的一种弯脚现象。当该弯折的引脚超过焊盘的范围时,搭接到焊盘周围线路,从而发生短路,因而主机板不良率上升。
【发明内容】
本发明所要解决的技术问题在于提供一种可以解决插接元器件引脚弯折而导致印刷电路板短路的焊盘。
本发明是通过以下技术方案解决上述技术问题的:一种防止主机板短路的焊盘,包括一对插孔、一对分别分布在对应插孔周围的焊盘区域,插孔分别穿过对应的焊盘区域的中心,插孔用于插接元器件引脚,布线时,在印刷电路板原有焊盘区域旁边,增加一附加区域且与所述焊盘区域相接,所述附加区域用于承接元器件引脚弯折出所述焊盘区域的部分,此时,通过机器设备向印刷电路板上插接元器件时,弯折的元器件引脚超出原焊盘的部分即可以落入这些增加的附加区域所圈定的区域中,从而防止其搭接到印刷电路板上的线路上,避免短路现象发生。
本发明防止主机板短路的焊盘的优点在于:印刷电路板上的走线避开了元器件引脚弯折的区域,从而避免了短路现象的发生,提升了主机板生产的良率。
【附图说明】
下面参照附图结合实施例对本发明作进一步的描述。
图1至图4是使用现有焊盘时元器件引脚四种弯折可能示意图。
图5至图8是本发明防止主机板短路的焊盘的四种结构设计示意图。
【具体实施方式】
请参照图5至图8,本发明具体体现在印刷电路板(图未示)的焊盘20的结构改进设计上,该印刷电路板可以是单层板,也可以是多层板。
插孔10、11是印刷电路板上一对对称的圆形开孔区域,供各种较大的含有两个引脚的元器件(图未示)如电阻、电容、调压器等的引脚的插接,以提供这些元器件与印刷电路板的电气连接。焊盘20、21位于印刷电路板的同一面,分别是围绕插孔10、11圆周的焊锡区域,圆盘40、41是与焊盘20、21的圆形区域相切的圆形区域。圆盘40、41上覆盖的材料与焊盘20、21相同,该种材料一般为锡,印刷电路板上含有许多此类焊锡区域,这些焊锡区域是非走线区域,即用来防止插接的元器件引脚与印刷电路板上的线路搭接,从而发生短路。本发明防止主机板短路的焊盘的结构设计改进的地方即是在原有焊盘20、21的基础上增加了圆盘40、41。此时,通过机器设备向印刷电路板上插接元器件时,弯折的元器件引脚30、31超出焊盘20、21的部分即可以落入圆盘40、41所圈定的区域中,从而防止其搭接到印刷电路板上的线路上,避免短路现象发生。
通常,一种机器设备对应一种元器件引脚弯折现象,元器件引脚30、31弯折现象有四种,则相对应圆盘40、41的布线位置有四种。参阅图5及图6,元器件引脚30、31朝向远离焊盘20、21区域方向偏离,且分别与插孔10、11的连线成一定角度c1、c2或d1、d2左右偏离,对于同一种机器设备,c1、c2,d1、d2的值是固定的,且c1=c2,d1=d2,通常情况下,c1=c2=45度,d1=d2=45度。图7及图8中,元器件引脚30、31分别顺着插孔10、11的连线,朝向或远离焊盘20、21区域方向偏离。所以,布线时,圆盘40的布线位置遵循的原则是:圆盘40的圆心与插孔10圆心的连线,圆盘41的圆心与插孔11的连线应分别与引脚30、31偏离的方向重合。圆盘40、41的直径长度根据下列公式计算:
d≥e-r,
其中d为圆盘40、41直径,e=元器件引脚30、31长度-印刷电路板厚度,r为焊盘20、21的半径。

Claims (8)

1.一种防止主机板短路的焊盘,用以防止通过机器设备在印刷电路板上插接元器件时,元器件引脚弯折搭接到周围线路引起的短路,包括一对插孔、一对分别分布在对应插孔周围的焊盘区域,插孔分别穿过对应的焊盘区域的中心,插孔用于插接元器件引脚,其特征在于:防止主机板短路的焊盘还包括一对附加区域,所述附加区域分别位于所述焊盘区域外围且与所述焊盘区域相接,所述附加区域用于承接元器件引脚弯折出所述焊盘区域的部分。
2.如权利要求1所述的防止主机板短路的焊盘,其特征在于:所述附加区域与所述焊盘区域同是印刷电路板的非走线区域。
3.如权利要求1所述的防止主机板短路的焊盘,其特征在于:所述焊盘区域为圆形。
4.如权利要求3所述的防止主机板短路的焊盘,其特征在于:所述附加区域是圆盘区域。
5.如权利要求4所述的防止主机板短路的焊盘,其特征在于:所述圆盘区域与所述焊盘区域相外切。
6.如权利要求5所述的防止主机板短路的焊盘,其特征在于:所述圆盘区域与相切的焊盘区域中心连线,偏离所述焊盘区域中心的相互连线的角度,与元器件引脚弯折的角度相同。
7.如权利要求6所述的防止主机板短路的焊盘,其特征在于:所述圆盘区域的直径大于或等于元器件引脚的长度减去印刷电路板厚度及所述焊盘区域的半径。
8.如权利要求1所述的防止主机板短路的焊盘,其特征在于:所述印刷电路板可以是单层板也可以是多层板。
CNB2004100278441A 2004-06-21 2004-06-21 防止主机板短路的焊盘 Expired - Fee Related CN100484371C (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNB2004100278441A CN100484371C (zh) 2004-06-21 2004-06-21 防止主机板短路的焊盘
US11/027,215 US7079399B2 (en) 2004-06-21 2004-12-29 Printed circuit boards having improved solder pads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2004100278441A CN100484371C (zh) 2004-06-21 2004-06-21 防止主机板短路的焊盘

Publications (2)

Publication Number Publication Date
CN1713801A CN1713801A (zh) 2005-12-28
CN100484371C true CN100484371C (zh) 2009-04-29

Family

ID=35481195

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100278441A Expired - Fee Related CN100484371C (zh) 2004-06-21 2004-06-21 防止主机板短路的焊盘

Country Status (2)

Country Link
US (1) US7079399B2 (zh)
CN (1) CN100484371C (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103983809A (zh) * 2013-02-08 2014-08-13 辉达公司 Pcb板及其在线测试结构以及该在线测试结构的制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5784262A (en) * 1995-11-06 1998-07-21 Symbios, Inc. Arrangement of pads and through-holes for semiconductor packages

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE457838B (sv) * 1987-06-11 1989-01-30 Ericsson Telefon Ab L M Stift vilket aer fastsatt vid ett kretskort genom loedning
US5092035A (en) * 1990-09-10 1992-03-03 Codex Corporation Method of making printed circuit board assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5784262A (en) * 1995-11-06 1998-07-21 Symbios, Inc. Arrangement of pads and through-holes for semiconductor packages

Also Published As

Publication number Publication date
CN1713801A (zh) 2005-12-28
US20050282415A1 (en) 2005-12-22
US7079399B2 (en) 2006-07-18

Similar Documents

Publication Publication Date Title
CN1307855C (zh) 防止碑立现象形成的结构及其制造方法
CN1078805C (zh) 印刷电路板用焊盘
JP3935529B2 (ja) プリント回路基板
CN100484371C (zh) 防止主机板短路的焊盘
CN102625581B (zh) 柔性电路板及其制造方法
US9769925B2 (en) Relieved component pad for 0201 use between vias
WO2021097614A1 (zh) 集成式微型焊板结构及其制作工艺
CN111864924B (zh) 定子总成及电机
US7393217B2 (en) Surface mount connector and circuit board assembly with same
CN209964405U (zh) 一种应用于smt贴装线的pcb板波峰焊治具
CN107580425A (zh) 一种电路板组件及其制作方法、电路板拼板、移动终端
JP2000021525A (ja) コネクタシステム
CN209693151U (zh) 一种多层盲孔电路板结构
JPH06334294A (ja) プリント配線構造
CN221328286U (zh) 转接板及适配器
CN217336039U (zh) 一种将电子元器件内置安装的多层电路板
CN101179144A (zh) 一种介质滤波器及其实现方法
CN212936298U (zh) 一种低压柜线路板
CN216626205U (zh) 一种可控制排针出脚长度的电路板结构
CN220067793U (zh) 一种pcb板以及应用其的led单元板、led显示屏
CN104932761B (zh) 电容式触控板及其制造方法
CN215345243U (zh) 电路板组件和电机
CN216896919U (zh) 一种金属导电连接件及柔性灯带
CN113840456A (zh) 电路板组件、控制器和电机
CN114333660B (zh) Goa电路测试板、测试方法及显示面板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090429