KR920009891A - 수소 실세스퀴옥산 수지 분획 및 피복재료로서의 이의 용도 - Google Patents

수소 실세스퀴옥산 수지 분획 및 피복재료로서의 이의 용도 Download PDF

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KR920009891A
KR920009891A KR1019910021202A KR910021202A KR920009891A KR 920009891 A KR920009891 A KR 920009891A KR 1019910021202 A KR1019910021202 A KR 1019910021202A KR 910021202 A KR910021202 A KR 910021202A KR 920009891 A KR920009891 A KR 920009891A
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hydrogen silsesquioxane
ceramic coating
silsesquioxane resin
solvent
weight
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KR1019910021202A
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KR960007346B1 (ko
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프래지어 하네만 래리
아일린 젠틀 테레사
죠오지 샤프 케네스
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노만 에드워드 루이스
다우 코닝 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/32—Post-polymerisation treatment
    • C08G77/36—Fractionation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H01L21/02134—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material comprising hydrogen silsesquioxane, e.g. HSQ
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/4505—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application
    • C04B41/455—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application the coating or impregnating process including a chemical conversion or reaction
    • C04B41/4554—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application the coating or impregnating process including a chemical conversion or reaction the coating or impregnating material being an organic or organo-metallic precursor of an inorganic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/312—Organic layers, e.g. photoresist
    • H01L21/3121—Layers comprising organo-silicon compounds
    • H01L21/3122—Layers comprising organo-silicon compounds layers comprising polysiloxane compounds
    • H01L21/3124—Layers comprising organo-silicon compounds layers comprising polysiloxane compounds layers comprising hydrogen silsesquioxane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Ceramic Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Silicon Polymers (AREA)
  • Formation Of Insulating Films (AREA)
  • Ceramic Products (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Catalysts (AREA)

Abstract

내용 없음

Description

수소 실세스퀴옥산 수지 분획 및 피복재료로서의 이의 용도
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 분산도가 약 3.0미만인 수소 실세스퀴옥산 수지.
  2. 중합체 종의 약 90%가 약 500 내지 10,000의 분량을 갖는 수소 실세스퀴옥산 수지.
  3. 알콜, 방향족탄화수소, 알칸, 케톤, 사이클릭 디메틸폴리실록산, 에세테르 또는 글리콜에테르로 이루어지는 그룹 중에서 선택된 용매 중에 용해되어 있는 수소 실세스퀴옥산 수지(여기서, 수지는 이의 중합체 종의 약 90%가 약 520 내지 10,000의 분자량을 가지며, 용매는 약 0.1 내지 약 50중량%의 수소 실세스퀴옥산 수지 용액을 형성할 수 있는 양으로 존재한다) 및 티탄, 지르코늄, 알루미늅, 탄탈, 바나듐, 니오븀, 붕소 및 인으로 이루어지는 그룹 중에서 선택된 원소를 함유하는 화합물(여기서, 이 화합물을 알콕시 또는 아실옥시로 이루어지는 그룹중에서 선택된 가소분해성 치환체 하나 이상을 함유하며 세라믹 피막이 개질 세라믹 산화를 0.1 내지 30중량%를 함유하도록 하는 양으로 존재한다)을 포함하는 개질 세라믹 산화물 선구물질을 함유하는 피복용액.
  4. 제3항에 있어서, 분획 중량을 기준으로 백금이 약 5 내지 약 500ppm이 되는 양으로 백금 또는 로듐 촉매를 추가로 함유하는 용액.
  5. 용매 및 수평균 분자량이 약 700 내지 약 6000이고 분산도가 약 3.0이만인 수소 실세스퀴옥산 수지를 포함하는 용액으로 기판을 피복하고, 용매를 증발시켜 기판상에 예비세라믹 피막을 부착시키고, 예비세라믹 피막의 세라믹 피막으로의 전환을 촉진시키기에 충분한 온도에 예비세라믹 피막을 노출시킴을 특징으로 하여 세라믹 피막을 형성시키는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910021202A 1990-11-28 1991-11-26 수소 실세스퀴옥산 수지 분획 및 피복재료로서의 이의 용도 KR960007346B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/618,865 1990-11-28
US07/618,865 US5063267A (en) 1990-11-28 1990-11-28 Hydrogen silsesquioxane resin fractions and their use as coating materials

Publications (2)

Publication Number Publication Date
KR920009891A true KR920009891A (ko) 1992-06-25
KR960007346B1 KR960007346B1 (ko) 1996-05-31

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US (1) US5063267A (ko)
EP (1) EP0493879B1 (ko)
JP (1) JPH04275337A (ko)
KR (1) KR960007346B1 (ko)
CA (1) CA2055306C (ko)
DE (1) DE69100590T2 (ko)
ES (1) ES2047987T3 (ko)
TW (1) TW218858B (ko)

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JPH0579693B2 (ko) 1993-11-04
EP0493879A2 (en) 1992-07-08
EP0493879A3 (en) 1992-09-30
US5063267A (en) 1991-11-05
CA2055306C (en) 1996-06-18
TW218858B (ko) 1994-01-11
CA2055306A1 (en) 1992-05-29
ES2047987T3 (es) 1994-03-01
DE69100590D1 (de) 1993-12-09
EP0493879B1 (en) 1993-11-03
JPH04275337A (ja) 1992-09-30
DE69100590T2 (de) 1994-05-11

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