KR920006459A - 이방도전성 접착제 조성물 - Google Patents

이방도전성 접착제 조성물 Download PDF

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Publication number
KR920006459A
KR920006459A KR1019910014971A KR910014971A KR920006459A KR 920006459 A KR920006459 A KR 920006459A KR 1019910014971 A KR1019910014971 A KR 1019910014971A KR 910014971 A KR910014971 A KR 910014971A KR 920006459 A KR920006459 A KR 920006459A
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South Korea
Prior art keywords
anisotropic conductive
adhesive composition
conductive adhesive
metal
weight
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KR1019910014971A
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English (en)
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KR950000710B1 (ko
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히데모토 후쿠자와
타츠히로 이마이
야스히로 오카다
노리유키 오우사카
Original Assignee
나가지마 모토
소켄 가가꾸 가부시끼가이샤
노나카 타다즈
케미테크 가부시끼가이샤
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Publication of KR920006459A publication Critical patent/KR920006459A/ko
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Publication of KR950000710B1 publication Critical patent/KR950000710B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0233—Deformable particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)

Abstract

내용 없음.

Description

이방도전성 접착제 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명 이방도전성 접착제 조성물에 배합되는 금속함유입자의 구조를 모식적으로 도시하는 도면.
제 2 도 및 제 3 도는 시이트상으로 한 본 발명 이방도전성 접착제 조성물을 이용하여 배선기판을 접착하는 때의 상태를 모식적으로 도시하는 도면.
제 4 도는 실시예에 있어서, 도통저항, 절연성 및 접착성을 측정하기에 알맞도록 이용된 예시도.
* 도면의 주요 부분에 대한 부호의 설명
1 : 절연성 접착성 성분 3 : 금속함유입자
3a : 수지층이 피복된 금속합유입자 5 : 시이트상
7 : 심지재 9 : 금속층
11 : 수지층 15 : 수지미분체
20 : 배선패턴 21 : 기판
30 : 무기분체입자

Claims (7)

  1. 절연성 접착성 성분과 이 절연성 접착성 성분 중에 분산된 입자로 이루어진 이방도전성 접착제 조성물에 있어서, 상기 절연성 접착성 성분이, 탄소원자수 1∼4의 알킬기를 가지는 아크릴산 에스테르와 말레이미드 유도체로부터 형성되는 공중합체와, 이 공중합체 100중량부에 대해, 5∼60중량부의 열경화성수지와 0.05∼5.0중량부의 결합체를 함유하고, 그리고 상기 입자가 수지제의 심지재와 이 심지재를 피복하는 금속층 및 이 금속층 표면에 드라이플랜트법에 의해 고정된 수지미분체로부터 형성되는 수지층을 가지는 금속함유입자인 것을 특징으로 하는 이방도전성 접착제 조성물.
  2. 제 1 항에 있어서, 상기 공중합체에 있어서의 말레이미드 유도체로부터 유도되는 반복단위의 함유율이, 이 공중합체 중에 있어서의 아크릴산 에스테르로부터 유도되는 반복 단위의 단량체 환상중량 100중량부에 대해, 단량체 환상량으로 0.5∼10.0 중량부의 범위 내에 있는 것을 특징으로 하는 이방도전성 접착제 조성물.
  3. 제 1 항에 있어서, 상기 금속함유 입자의 수지층을 형성하는 수지미분체가 불소수지 미분체인 것을 특징으로 하는 이방도전성 접착제 조성물.
  4. 절연성 접착성 성분과 이 절연성 접착성 성분 중에 분산된 입자로 이루어진 이방도전성 접착제 조성물에 있어서, 상기 절연성 접착성 성분이 탄소원자수 1∼4의 알킬기를 가지는 아크릴산 에스테르와 말레이미드 유도체로부터 형성되는 공중합체와 이 공중합제 100중량부에 대해, 5∼60중량부의 열경화성 수지와 0.05∼5.0중량부의 결합체를 함유하고, 그리고 상기 입자가 수지제의 심지재와 이 심지재를 피복하는 금속층과 이 금속층 표면에 드라이플랜트법에 의해 고정된 수지미분체로부터 형성되는 수지층을 가지는 금속함유입자 및 이 금속함유입자의 평균입자직경의 1/10 이하의 평균입자직경을 가지는 무기분체 입자로 이루어진 것을 특징으로 하는 이방도전성 접착제 조성물.
  5. 제 4 항에 있어서, 상기 금속함유 입자의 평균입자직경이 1∼50㎛의 범위 내에서 있고, 또 무기분체 입자의 평균입자직경이 0.01∼5.0㎛의 범위 내에 있는 것을 특징으로 하는 이방도전성 접착제 조성물.
  6. 제 4 항에 있어서, 상기 공중합체에 있어서의 말레이미드 유도체로 부터 유도되는 반복단위의 함유율이 이 공중합체 중에 있어서의 아크릴산 에스테르로 부터 유도되는 반복단위의 단량체 환상중량 100중량부에 대해, 단량체 환상중량으로 0.5∼10.0중량부의 범위 내에 있는 것을 특징으로 하는 이방도전성 접착제 조성물.
  7. 제 4 항에 있어서, 상기 금속함유 입자의 수지층을 구성하는 수지미분체가, 불소수지 미분체인 것을 특징으로 하는 이방도전성 접착제 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910014971A 1990-09-03 1991-08-29 이방도전성 접착제 조성물 KR950000710B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2-232671 1990-09-03
JP90-232,671 1990-09-03
JP2232671A JPH04115407A (ja) 1990-09-03 1990-09-03 異方導電性接着剤組成物

Publications (2)

Publication Number Publication Date
KR920006459A true KR920006459A (ko) 1992-04-27
KR950000710B1 KR950000710B1 (ko) 1995-01-27

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KR1019910014971A KR950000710B1 (ko) 1990-09-03 1991-08-29 이방도전성 접착제 조성물

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US (1) US5162087A (ko)
EP (1) EP0475655A3 (ko)
JP (1) JPH04115407A (ko)
KR (1) KR950000710B1 (ko)

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