KR910013498A - 반도체장치 및 그 제조방법 - Google Patents
반도체장치 및 그 제조방법 Download PDFInfo
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- KR910013498A KR910013498A KR1019900020476A KR900020476A KR910013498A KR 910013498 A KR910013498 A KR 910013498A KR 1019900020476 A KR1019900020476 A KR 1019900020476A KR 900020476 A KR900020476 A KR 900020476A KR 910013498 A KR910013498 A KR 910013498A
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Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시에에 따른 반도체장치에 있어서 접착제의 조성을 나타낸 종단면도,
제2도는 본 발명을 적용시킬 수 있는 반도체장치의 외관을 나타낸 사시도,
제3도는 동 반도체장치의 외관을 나타낸 종단면도.
Claims (6)
- 리이드 프레임의 베드(1a)상에 반도체 펠렛(11, 12)과 절연기판(2)이 각각 탑재된 반도체장치에 있어서, 상기 절연기판은 절연성 접착제(3)에 의해 상기 베드상에 고착되어 있고, 더욱이 상기 절연성 접착제는 산화규소 이외에 표면에 산화막이 붙은 금속(6)을 함유하고 있는 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 금속은 니켈-크롬강인 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 금속은 상기 산화규소보다도 입자가 작은 것을 특징으로 하는 반도체장치.
- 리이드 프레임의 베드상에 반도체 펠렛과 절연기판이 각각 탑재된 반도체장치를 제조하는 방법에 있어서, 상기 절연기판을 상기 베드상에 절연성 접착제를 이용하고 고착시킬 때에 산화규소 이외에 표면에 산화막이 붙은 금속(6)을 함유한 절연성 접착제(3)를 이용하는 것을 특징으로 하는 반도체장치의 제조방법.
- 제4항에 있어서, 상기 금속은 니켈-크롬강인 것을 특징으로 하는 반도체장치의 제조방법.
- 제4항에 있어서, 상기 금속은 상기 산화규소보다도 입자가 작은 것을 특징으로 하는 반도체장치의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1324753A JPH0724270B2 (ja) | 1989-12-14 | 1989-12-14 | 半導体装置及びその製造方法 |
JP1-324753 | 1989-12-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910013498A true KR910013498A (ko) | 1991-08-08 |
KR940010536B1 KR940010536B1 (ko) | 1994-10-24 |
Family
ID=18169298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900020476A KR940010536B1 (ko) | 1989-12-14 | 1990-12-13 | 반도체장치 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5113241A (ko) |
EP (1) | EP0437746B1 (ko) |
JP (1) | JPH0724270B2 (ko) |
KR (1) | KR940010536B1 (ko) |
DE (1) | DE69030171T2 (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5371404A (en) * | 1993-02-04 | 1994-12-06 | Motorola, Inc. | Thermally conductive integrated circuit package with radio frequency shielding |
JP3445641B2 (ja) * | 1993-07-30 | 2003-09-08 | 株式会社デンソー | 半導体装置 |
JPH0774290A (ja) * | 1993-09-03 | 1995-03-17 | Rohm Co Ltd | 電子部品のパッケージング用材料 |
KR100218996B1 (ko) * | 1995-03-24 | 1999-09-01 | 모기 쥰이찌 | 반도체장치 |
US5644168A (en) * | 1995-05-03 | 1997-07-01 | Texas Instruments Incorporated | Mechanical interlocking of fillers and epoxy/resin |
US5682066A (en) * | 1996-08-12 | 1997-10-28 | Motorola, Inc. | Microelectronic assembly including a transparent encapsulant |
US5891753A (en) | 1997-01-24 | 1999-04-06 | Micron Technology, Inc. | Method and apparatus for packaging flip chip bare die on printed circuit boards |
JP2990113B2 (ja) * | 1997-06-26 | 1999-12-13 | 山形日本電気株式会社 | 半導体基板の不良解析装置及び不良解析方法 |
DE19756887A1 (de) * | 1997-12-19 | 1999-07-01 | Siemens Ag | Kunststoffverbundkörper |
US6157085A (en) * | 1998-04-07 | 2000-12-05 | Citizen Watch Co., Ltd. | Semiconductor device for preventing exfoliation from occurring between a semiconductor chip and a resin substrate |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3753056A (en) * | 1971-03-22 | 1973-08-14 | Texas Instruments Inc | Microwave semiconductor device |
FR2480488A1 (fr) * | 1980-04-15 | 1981-10-16 | Eaton Manford | Liant thermiquement conducteur et isolant electriquement pour composants electriques et electroniques, et son procede de fabrication |
JPS5780838U (ko) * | 1980-11-05 | 1982-05-19 | ||
JPS57111034A (en) * | 1980-12-10 | 1982-07-10 | Hitachi Ltd | Semiconductor device and its manufacture |
JPS5834932A (ja) * | 1981-08-26 | 1983-03-01 | Toshiba Corp | 半導体装置 |
NL8202470A (nl) * | 1982-06-18 | 1984-01-16 | Philips Nv | Hoogfrequentschakelinrichting en halfgeleiderinrichting voor toepassing in een dergelijke inrichting. |
JPS5942703A (ja) * | 1982-09-02 | 1984-03-09 | ティーディーケイ株式会社 | 絶縁性良熱伝導体及びその製造方法 |
CA1238119A (en) * | 1985-04-18 | 1988-06-14 | Douglas W. Phelps, Jr. | Packaged semiconductor chip |
JPS61296749A (ja) * | 1985-06-25 | 1986-12-27 | Toray Silicone Co Ltd | 半導体装置用リードフレームの製造方法 |
JPH0676474B2 (ja) * | 1986-12-23 | 1994-09-28 | 住友ベークライト株式会社 | 半導体用絶縁樹脂ペ−スト |
US4907068A (en) * | 1987-01-21 | 1990-03-06 | Siemens Aktiengesellschaft | Semiconductor arrangement having at least one semiconductor body |
CA1290676C (en) * | 1987-03-30 | 1991-10-15 | William Frank Graham | Method for bonding integrated circuit chips |
DE3817400A1 (de) * | 1988-05-21 | 1989-11-30 | Bosch Gmbh Robert | Waermeleitender, elektrisch isolierender kleber |
JPH02184054A (ja) * | 1989-01-11 | 1990-07-18 | Toshiba Corp | ハイブリッド型樹脂封止半導体装置 |
-
1989
- 1989-12-14 JP JP1324753A patent/JPH0724270B2/ja not_active Expired - Fee Related
-
1990
- 1990-12-13 KR KR1019900020476A patent/KR940010536B1/ko not_active IP Right Cessation
- 1990-12-14 DE DE69030171T patent/DE69030171T2/de not_active Expired - Lifetime
- 1990-12-14 EP EP90124195A patent/EP0437746B1/en not_active Expired - Lifetime
- 1990-12-14 US US07/627,573 patent/US5113241A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69030171D1 (de) | 1997-04-17 |
JPH0724270B2 (ja) | 1995-03-15 |
JPH03185741A (ja) | 1991-08-13 |
US5113241A (en) | 1992-05-12 |
EP0437746A3 (en) | 1991-09-11 |
DE69030171T2 (de) | 1997-07-31 |
KR940010536B1 (ko) | 1994-10-24 |
EP0437746B1 (en) | 1997-03-12 |
EP0437746A2 (en) | 1991-07-24 |
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