KR850005136A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR850005136A
KR850005136A KR1019830005971A KR830005971A KR850005136A KR 850005136 A KR850005136 A KR 850005136A KR 1019830005971 A KR1019830005971 A KR 1019830005971A KR 830005971 A KR830005971 A KR 830005971A KR 850005136 A KR850005136 A KR 850005136A
Authority
KR
South Korea
Prior art keywords
semiconductor devices
substrate
conductive paste
semiconductor element
metal powder
Prior art date
Application number
KR1019830005971A
Other languages
English (en)
Other versions
KR920000559B1 (ko
Inventor
기미오 미요시
Original Assignee
아라끼 쓰데오
간사이 닛뽄덴끼 가부시기 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아라끼 쓰데오, 간사이 닛뽄덴끼 가부시기 가이샤 filed Critical 아라끼 쓰데오
Priority to KR1019830005971A priority Critical patent/KR920000559B1/ko
Publication of KR850005136A publication Critical patent/KR850005136A/ko
Application granted granted Critical
Publication of KR920000559B1 publication Critical patent/KR920000559B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Abstract

내용 없음

Description

반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. 금속 도금층이 형성되어 있지 아니한 기판에 반도체소자를 금속분말, 수지, 용제를 함유하며 또한 금속 분말의 전체에서 점유하는 비율을 88-95중량%로 설정하여서 이루어진 도전성 페이스트를 사용하여 고정함과 아울러, 기판과 반도체 소자와의 사이에 개재된 도전성 페이스트의 평균적인 두께를 15㎛이하로 설정한 것을 특징으로 하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019830005971A 1983-12-16 1983-12-16 반도체장치 KR920000559B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019830005971A KR920000559B1 (ko) 1983-12-16 1983-12-16 반도체장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019830005971A KR920000559B1 (ko) 1983-12-16 1983-12-16 반도체장치

Publications (2)

Publication Number Publication Date
KR850005136A true KR850005136A (ko) 1985-08-21
KR920000559B1 KR920000559B1 (ko) 1992-01-16

Family

ID=19230631

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019830005971A KR920000559B1 (ko) 1983-12-16 1983-12-16 반도체장치

Country Status (1)

Country Link
KR (1) KR920000559B1 (ko)

Also Published As

Publication number Publication date
KR920000559B1 (ko) 1992-01-16

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