JPS5291195A - Wiring sheet - Google Patents

Wiring sheet

Info

Publication number
JPS5291195A
JPS5291195A JP820176A JP820176A JPS5291195A JP S5291195 A JPS5291195 A JP S5291195A JP 820176 A JP820176 A JP 820176A JP 820176 A JP820176 A JP 820176A JP S5291195 A JPS5291195 A JP S5291195A
Authority
JP
Japan
Prior art keywords
wiring sheet
layer
metal
improved
stress relaxation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP820176A
Other languages
Japanese (ja)
Inventor
Hideo Kawamura
Toshio Nakanishi
Kunio Iijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP820176A priority Critical patent/JPS5291195A/en
Publication of JPS5291195A publication Critical patent/JPS5291195A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

PURPOSE: On the sheet surface of which surface layer is formed from a specific stress relaxation resin, a metal surface applied with chemical plating is formed, and the adhesion performance is improved between the metal layer and the substratum layer.
COPYRIGHT: (C)1977,JPO&Japio
JP820176A 1976-01-27 1976-01-27 Wiring sheet Pending JPS5291195A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP820176A JPS5291195A (en) 1976-01-27 1976-01-27 Wiring sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP820176A JPS5291195A (en) 1976-01-27 1976-01-27 Wiring sheet

Publications (1)

Publication Number Publication Date
JPS5291195A true JPS5291195A (en) 1977-08-01

Family

ID=11686640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP820176A Pending JPS5291195A (en) 1976-01-27 1976-01-27 Wiring sheet

Country Status (1)

Country Link
JP (1) JPS5291195A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164294A (en) * 1982-03-25 1983-09-29 日立化成工業株式会社 Substrate for printed circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49109476A (en) * 1973-02-21 1974-10-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49109476A (en) * 1973-02-21 1974-10-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164294A (en) * 1982-03-25 1983-09-29 日立化成工業株式会社 Substrate for printed circuit board

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