JPS5291195A - Wiring sheet - Google Patents
Wiring sheetInfo
- Publication number
- JPS5291195A JPS5291195A JP820176A JP820176A JPS5291195A JP S5291195 A JPS5291195 A JP S5291195A JP 820176 A JP820176 A JP 820176A JP 820176 A JP820176 A JP 820176A JP S5291195 A JPS5291195 A JP S5291195A
- Authority
- JP
- Japan
- Prior art keywords
- wiring sheet
- layer
- metal
- improved
- stress relaxation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Non-Insulated Conductors (AREA)
Abstract
PURPOSE: On the sheet surface of which surface layer is formed from a specific stress relaxation resin, a metal surface applied with chemical plating is formed, and the adhesion performance is improved between the metal layer and the substratum layer.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP820176A JPS5291195A (en) | 1976-01-27 | 1976-01-27 | Wiring sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP820176A JPS5291195A (en) | 1976-01-27 | 1976-01-27 | Wiring sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5291195A true JPS5291195A (en) | 1977-08-01 |
Family
ID=11686640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP820176A Pending JPS5291195A (en) | 1976-01-27 | 1976-01-27 | Wiring sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5291195A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58164294A (en) * | 1982-03-25 | 1983-09-29 | 日立化成工業株式会社 | Substrate for printed circuit board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49109476A (en) * | 1973-02-21 | 1974-10-17 |
-
1976
- 1976-01-27 JP JP820176A patent/JPS5291195A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49109476A (en) * | 1973-02-21 | 1974-10-17 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58164294A (en) * | 1982-03-25 | 1983-09-29 | 日立化成工業株式会社 | Substrate for printed circuit board |
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