KR900003874B1 - 리드프레임 - Google Patents

리드프레임

Info

Publication number
KR900003874B1
KR900003874B1 KR1019870000194A KR870000194A KR900003874B1 KR 900003874 B1 KR900003874 B1 KR 900003874B1 KR 1019870000194 A KR1019870000194 A KR 1019870000194A KR 870000194 A KR870000194 A KR 870000194A KR 900003874 B1 KR900003874 B1 KR 900003874B1
Authority
KR
South Korea
Prior art keywords
aluminum
boundary edge
cladding layer
casting
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870000194A
Other languages
English (en)
Korean (ko)
Other versions
KR870009465A (ko
Inventor
야스하루 나까무라
Original Assignee
신고오덴기고오교오 가부시끼가이샤
미쓰노브 다개기오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신고오덴기고오교오 가부시끼가이샤, 미쓰노브 다개기오 filed Critical 신고오덴기고오교오 가부시끼가이샤
Publication of KR870009465A publication Critical patent/KR870009465A/ko
Application granted granted Critical
Publication of KR900003874B1 publication Critical patent/KR900003874B1/ko
Expired legal-status Critical Current

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Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019870000194A 1986-03-07 1987-01-13 리드프레임 Expired KR900003874B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61-51057 1986-03-07
JP61051057A JPS62208654A (ja) 1986-03-07 1986-03-07 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
KR870009465A KR870009465A (ko) 1987-10-26
KR900003874B1 true KR900003874B1 (ko) 1990-06-02

Family

ID=12876176

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870000194A Expired KR900003874B1 (ko) 1986-03-07 1987-01-13 리드프레임

Country Status (2)

Country Link
JP (1) JPS62208654A (enrdf_load_stackoverflow)
KR (1) KR900003874B1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437096A (en) * 1994-02-28 1995-08-01 Technical Materials, Inc. Method for making a multilayer metal leadframe
JPH0878604A (ja) * 1994-08-31 1996-03-22 Nec Corp 半導体装置用リードフレーム

Also Published As

Publication number Publication date
KR870009465A (ko) 1987-10-26
JPH0365023B2 (enrdf_load_stackoverflow) 1991-10-09
JPS62208654A (ja) 1987-09-12

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