JPS6129547B2 - - Google Patents
Info
- Publication number
- JPS6129547B2 JPS6129547B2 JP7448380A JP7448380A JPS6129547B2 JP S6129547 B2 JPS6129547 B2 JP S6129547B2 JP 7448380 A JP7448380 A JP 7448380A JP 7448380 A JP7448380 A JP 7448380A JP S6129547 B2 JPS6129547 B2 JP S6129547B2
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- external
- lead
- brazing material
- metallized layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 39
- 238000005219 brazing Methods 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000000919 ceramic Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 10
- 238000005476 soldering Methods 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7448380A JPS571250A (en) | 1980-06-03 | 1980-06-03 | Equipping structure of outside lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7448380A JPS571250A (en) | 1980-06-03 | 1980-06-03 | Equipping structure of outside lead |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS571250A JPS571250A (en) | 1982-01-06 |
| JPS6129547B2 true JPS6129547B2 (enrdf_load_stackoverflow) | 1986-07-07 |
Family
ID=13548562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7448380A Granted JPS571250A (en) | 1980-06-03 | 1980-06-03 | Equipping structure of outside lead |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS571250A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030550U (ja) * | 1983-08-09 | 1985-03-01 | 富士電機株式会社 | 半導体装置 |
| US5025348A (en) * | 1987-11-20 | 1991-06-18 | Casio Computer Co., Ltd. | Bonding structure of an electronic device and a method for manufacturing the same |
| JPH0247058U (enrdf_load_stackoverflow) * | 1988-09-27 | 1990-03-30 | ||
| JP6375584B2 (ja) * | 2014-03-31 | 2018-08-22 | 住友電工デバイス・イノベーション株式会社 | 電子部品搭載用パッケージ |
-
1980
- 1980-06-03 JP JP7448380A patent/JPS571250A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS571250A (en) | 1982-01-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100517680C (zh) | 布线基板、半导体装置及显示模块 | |
| WO1990000813A1 (en) | Semiconductor device | |
| WO1995028740A1 (en) | Electronic package having improved wire bonding capability | |
| JPH0722570A (ja) | 集積回路チップ・パッケージを基板の表面に電気的に且つ機械的に接続する弾力性リード及びこれの製造方法 | |
| JPH1012773A (ja) | 樹脂封止型半導体装置およびその製造方法 | |
| CN1061784C (zh) | 树脂密封型半导体器件 | |
| JP2000228006A (ja) | ボンディングパットおよびバンプを用いた接合体、および磁気ヘッド装置 | |
| JPS6129547B2 (enrdf_load_stackoverflow) | ||
| WO1998042022A1 (fr) | Dispositif a semiconducteur et procede de fabrication associe | |
| JP2002222998A (ja) | 光半導体素子 | |
| JP2003338729A (ja) | 電子部品とその製造方法 | |
| JP2992873B2 (ja) | 半導体装置 | |
| JP3297959B2 (ja) | 半導体装置 | |
| JP3454192B2 (ja) | リードフレームとそれを用いた樹脂封止型半導体装置およびその製造方法 | |
| JP2924858B2 (ja) | リードフレームとその製造方法 | |
| JPH08222655A (ja) | 電子部品の電極構造とその製造方法 | |
| JPH053280A (ja) | 半導体装置 | |
| JP2861926B2 (ja) | 半導体容器 | |
| JPH11176849A (ja) | 半導体装置の製造方法 | |
| JP2819811B2 (ja) | フレキシブル基板 | |
| JP3935054B2 (ja) | 配線基板 | |
| JP2001126901A (ja) | チップ部品 | |
| JP2830221B2 (ja) | ハイブリッド集積回路のマウント構造 | |
| US6002164A (en) | Semiconductor lead frame | |
| KR200157363Y1 (ko) | 연결와이어를 사용하지 않고 칩의 본딩패드와 리드프레임의 리드를 접속한 반도체 장치 |