KR900001275B1 - 세라믹형 반도체 패케이지와 그의 제조방법 - Google Patents

세라믹형 반도체 패케이지와 그의 제조방법 Download PDF

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Publication number
KR900001275B1
KR900001275B1 KR1019840007975A KR840007975A KR900001275B1 KR 900001275 B1 KR900001275 B1 KR 900001275B1 KR 1019840007975 A KR1019840007975 A KR 1019840007975A KR 840007975 A KR840007975 A KR 840007975A KR 900001275 B1 KR900001275 B1 KR 900001275B1
Authority
KR
South Korea
Prior art keywords
metal cap
cavity
metal
ceramic
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019840007975A
Other languages
English (en)
Korean (ko)
Other versions
KR850005151A (ko
Inventor
히시시 와다나베
Original Assignee
후지쓰가부시끼가이샤
야마모도 다꾸마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쓰가부시끼가이샤, 야마모도 다꾸마 filed Critical 후지쓰가부시끼가이샤
Publication of KR850005151A publication Critical patent/KR850005151A/ko
Application granted granted Critical
Publication of KR900001275B1 publication Critical patent/KR900001275B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019840007975A 1983-12-21 1984-12-14 세라믹형 반도체 패케이지와 그의 제조방법 Expired KR900001275B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58-241307 1983-12-21
JP58241307A JPS60133741A (ja) 1983-12-21 1983-12-21 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
KR850005151A KR850005151A (ko) 1985-08-21
KR900001275B1 true KR900001275B1 (ko) 1990-03-05

Family

ID=17072331

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840007975A Expired KR900001275B1 (ko) 1983-12-21 1984-12-14 세라믹형 반도체 패케이지와 그의 제조방법

Country Status (5)

Country Link
US (1) US4604495A (https=)
EP (1) EP0154757B1 (https=)
JP (1) JPS60133741A (https=)
KR (1) KR900001275B1 (https=)
DE (1) DE3471828D1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2621173B1 (fr) * 1987-09-29 1989-12-08 Bull Sa Boitier pour circuit integre de haute densite
JPH0793393B2 (ja) * 1988-02-22 1995-10-09 株式会社東芝 半導体装置の金属製シェル
JP2734364B2 (ja) * 1993-12-30 1998-03-30 日本電気株式会社 半導体装置
US5389578A (en) * 1994-01-04 1995-02-14 Texas Instruments Incorporated Optical coupler
AU692250B2 (en) * 1994-04-19 1998-06-04 Commonwealth Scientific And Industrial Research Organisation Complex viscosity and complex modulus measurement device and method
JP2001170721A (ja) * 1999-10-08 2001-06-26 Shinko Electric Ind Co Ltd 凹部を具備する板状体及びその製造方法ならびに凹部形成用プレス金型
US7342298B1 (en) * 2004-03-09 2008-03-11 Xilinx, Inc. Metal lid with improved adhesion to package substrate
US11224909B2 (en) * 2015-07-07 2022-01-18 Nippon Steel Corporation Protrusion molding device, protrusion molding method, and molded article
JP7020806B2 (ja) * 2017-06-21 2022-02-16 トヨタ自動車株式会社 金属部材の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767839A (en) * 1971-06-04 1973-10-23 Wells Plastics Of California I Plastic micro-electronic packages
CA1042116A (en) * 1973-12-03 1978-11-07 John F. Krumme Heat recoverable cap
JPS5724554A (en) * 1980-07-22 1982-02-09 Nec Corp Semiconductor device
JPS5856357A (ja) * 1981-09-30 1983-04-04 Fujitsu Ltd 半導体装置用パツケ−ジ

Also Published As

Publication number Publication date
US4604495A (en) 1986-08-05
KR850005151A (ko) 1985-08-21
EP0154757A1 (en) 1985-09-18
JPS64813B2 (https=) 1989-01-09
JPS60133741A (ja) 1985-07-16
DE3471828D1 (en) 1988-07-07
EP0154757B1 (en) 1988-06-01

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