KR900001235B1 - 반도체 웨이퍼에 테이프 또는 박판을 접착시키기 위한 장치 및 방법 - Google Patents

반도체 웨이퍼에 테이프 또는 박판을 접착시키기 위한 장치 및 방법 Download PDF

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Publication number
KR900001235B1
KR900001235B1 KR1019860001340A KR860001340A KR900001235B1 KR 900001235 B1 KR900001235 B1 KR 900001235B1 KR 1019860001340 A KR1019860001340 A KR 1019860001340A KR 860001340 A KR860001340 A KR 860001340A KR 900001235 B1 KR900001235 B1 KR 900001235B1
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KR
South Korea
Prior art keywords
wafer
tape
semiconductor wafer
sheet
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019860001340A
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English (en)
Korean (ko)
Other versions
KR860006834A (ko
Inventor
구니미찌 나까오
Original Assignee
후지쓰가부시끼가이샤
야마모도 다꾸마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쓰가부시끼가이샤, 야마모도 다꾸마 filed Critical 후지쓰가부시끼가이샤
Publication of KR860006834A publication Critical patent/KR860006834A/ko
Application granted granted Critical
Publication of KR900001235B1 publication Critical patent/KR900001235B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1019860001340A 1985-02-07 1986-02-26 반도체 웨이퍼에 테이프 또는 박판을 접착시키기 위한 장치 및 방법 Expired KR900001235B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3999685 1985-02-07
JP60-39996 1985-02-27
JP39996 1985-02-27

Publications (2)

Publication Number Publication Date
KR860006834A KR860006834A (ko) 1986-09-15
KR900001235B1 true KR900001235B1 (ko) 1990-03-05

Family

ID=12568535

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860001340A Expired KR900001235B1 (ko) 1985-02-07 1986-02-26 반도체 웨이퍼에 테이프 또는 박판을 접착시키기 위한 장치 및 방법

Country Status (5)

Country Link
US (1) US4714511A (https=)
EP (1) EP0193159B1 (https=)
JP (1) JPS621242A (https=)
KR (1) KR900001235B1 (https=)
DE (1) DE3685136D1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6473739A (en) * 1987-09-16 1989-03-20 Fujitsu Ltd Table for wafer mounting
US5039371A (en) * 1989-03-23 1991-08-13 Lockheed Corporation Apparatus for roll-consolidation of thermoplastic composite laminates
JP2856216B2 (ja) * 1989-06-09 1999-02-10 富士通株式会社 半導体ウエハに粘着テープを接着する方法
DE4228218C2 (de) * 1992-08-25 1998-12-10 Siemens Ag Verfahren und Vorrichtung zur Planarisierung einer Schicht auf einem Halbleitersubstrat
JPH0737768A (ja) * 1992-11-26 1995-02-07 Sumitomo Electric Ind Ltd 半導体ウェハの補強方法及び補強された半導体ウェハ
US5300175A (en) * 1993-01-04 1994-04-05 Motorola, Inc. Method for mounting a wafer to a submount
JP3838797B2 (ja) * 1998-10-27 2006-10-25 松下電器産業株式会社 部品の貼り着け方法とその装置
US7066230B2 (en) * 2002-05-29 2006-06-27 Npp Packaging Graphics Specialists, Inc. Vacuum laminator
JP4387879B2 (ja) * 2004-06-17 2009-12-24 株式会社ディスコ 保護テープ装着方法および保護テープ装着装置
CN1861392B (zh) * 2005-05-10 2011-09-28 鸿富锦精密工业（深圳）有限公司 贴片机
US7348216B2 (en) * 2005-10-04 2008-03-25 International Business Machines Corporation Rework process for removing residual UV adhesive from C4 wafer surfaces
TWI283005B (en) * 2005-12-28 2007-06-21 Au Optronics Corp Low-pressure process apparatus
JP5417131B2 (ja) * 2009-11-20 2014-02-12 日東電工株式会社 粘着テープ貼付け装置および粘着テープ貼付け方法
JP6088866B2 (ja) * 2013-03-14 2017-03-01 リンテック株式会社 シート貼付装置及び貼付方法
SG11201510022SA (en) * 2013-06-19 2016-01-28 Acm Research Shanghai Inc Apparatus and method for taping adhesive film on semiconductor substrate
JP7731231B2 (ja) * 2021-07-14 2025-08-29 株式会社ディスコ 貼着方法及び貼着装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3330714A (en) * 1962-03-08 1967-07-11 Vari Products Co Method of adhering adhesive backed light reflector unit to a mounting surface
DE2712521C2 (de) * 1977-03-22 1987-03-05 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum Aufkitten von Scheiben
US4242162A (en) * 1979-05-08 1980-12-30 Minnesota Mining And Manufacturing Company Tape applying device and method
JPS6060800A (ja) * 1983-09-13 1985-04-08 日東電工株式会社 リングと薄板の貼着装置
JPS59103354A (ja) * 1983-09-21 1984-06-14 Hitachi Ltd 板状物の貼着装置
GB2159763B (en) * 1984-06-06 1987-11-18 Nitto Electric Ind Co Process for sticking adhesive tape on thin article
IT1242533B (it) * 1990-06-07 1994-05-16 Ima Spa Dispositivo per il trasferimento di tavolette, in particolare blister,da una linea di trasporto delle stesse tavolette ad un magazzino, e viceversa.

Also Published As

Publication number Publication date
JPS621242A (ja) 1987-01-07
JPH0234175B2 (https=) 1990-08-01
EP0193159A2 (en) 1986-09-03
DE3685136D1 (de) 1992-06-11
US4714511A (en) 1987-12-22
KR860006834A (ko) 1986-09-15
EP0193159B1 (en) 1992-05-06
EP0193159A3 (en) 1989-01-25

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