DE2712521C2 - - Google Patents
Info
- Publication number
- DE2712521C2 DE2712521C2 DE2712521A DE2712521A DE2712521C2 DE 2712521 C2 DE2712521 C2 DE 2712521C2 DE 2712521 A DE2712521 A DE 2712521A DE 2712521 A DE2712521 A DE 2712521A DE 2712521 C2 DE2712521 C2 DE 2712521C2
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19772712521 DE2712521A1 (de) | 1977-03-22 | 1977-03-22 | Verfahren zum aufkitten von scheiben |
GB4251/78A GB1554694A (en) | 1977-03-22 | 1978-02-02 | Cementing discs or the like to carrier plates |
NL7801348A NL7801348A (nl) | 1977-03-22 | 1978-02-06 | Werkwijze voor het opbrengen door kitten van tot schijven verwerkte materialen. |
IT48497/78A IT1102109B (it) | 1977-03-22 | 1978-03-20 | Procedimento ed apparecchiatura per attaccare con mastice lastre su un supporto in particolare per la levigatura |
FR7808275A FR2384589A1 (fr) | 1977-03-22 | 1978-03-22 | Procede de collage au mastic de disques destines a etre polis |
BE186160A BE865169A (fr) | 1977-03-22 | 1978-03-22 | Procede de collage au mastic de disques destines a etre polis |
JP3283178A JPS53146572A (en) | 1977-03-22 | 1978-03-22 | Method of bonding disks |
US06/073,415 US4283242A (en) | 1977-03-22 | 1979-09-07 | Process for cementing semiconductor discs onto a carrier plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19772712521 DE2712521A1 (de) | 1977-03-22 | 1977-03-22 | Verfahren zum aufkitten von scheiben |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2712521A1 DE2712521A1 (de) | 1978-09-28 |
DE2712521C2 true DE2712521C2 (de) | 1987-03-05 |
Family
ID=6004323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19772712521 Granted DE2712521A1 (de) | 1977-03-22 | 1977-03-22 | Verfahren zum aufkitten von scheiben |
Country Status (8)
Country | Link |
---|---|
US (1) | US4283242A (de) |
JP (1) | JPS53146572A (de) |
BE (1) | BE865169A (de) |
DE (1) | DE2712521A1 (de) |
FR (1) | FR2384589A1 (de) |
GB (1) | GB1554694A (de) |
IT (1) | IT1102109B (de) |
NL (1) | NL7801348A (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2809274A1 (de) * | 1978-03-03 | 1979-09-13 | Wacker Chemitronic | Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren |
US4316757A (en) * | 1980-03-03 | 1982-02-23 | Monsanto Company | Method and apparatus for wax mounting of thin wafers for polishing |
US4379018A (en) * | 1981-12-17 | 1983-04-05 | Planet Products Corporation | Heat transfer apparatus |
US4530138A (en) * | 1982-09-30 | 1985-07-23 | Westinghouse Electric Corp. | Method of making a transducer assembly |
US4466852A (en) * | 1983-10-27 | 1984-08-21 | At&T Technologies, Inc. | Method and apparatus for demounting wafers |
JPS61159718A (ja) * | 1984-12-29 | 1986-07-19 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
EP0193159B1 (de) * | 1985-02-07 | 1992-05-06 | Fujitsu Limited | Verfahren und Vorrichtung zum Anheften eines Streifens oder Films an eine Halbleiterscheibe |
GB8527708D0 (en) * | 1985-11-09 | 1985-12-11 | Old Acre Eng Co Ltd | Laminating press |
US4934920A (en) * | 1987-06-17 | 1990-06-19 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for producing semiconductor device |
JPH084105B2 (ja) * | 1987-06-19 | 1996-01-17 | 株式会社エンヤシステム | ウェハ接着方法 |
US5217563A (en) * | 1988-12-01 | 1993-06-08 | Bayer Aktiengesellschaft | Apparatus for producing a deep-drawn formed plastic piece |
JP2648638B2 (ja) * | 1990-11-30 | 1997-09-03 | 三菱マテリアル株式会社 | ウェーハの接着方法およびその装置 |
US5236646A (en) * | 1991-02-28 | 1993-08-17 | The United States Of America As Represented By The Secretary Of The Navy | Process for preparing thermoplastic composites |
US5116216A (en) * | 1991-02-28 | 1992-05-26 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus for preparing thermoplastic composites |
JP2678161B2 (ja) * | 1991-10-30 | 1997-11-17 | 九州電子金属 株式会社 | 半導体ウエーハの真空貼着装置 |
JPH0737768A (ja) * | 1992-11-26 | 1995-02-07 | Sumitomo Electric Ind Ltd | 半導体ウェハの補強方法及び補強された半導体ウェハ |
US5300175A (en) * | 1993-01-04 | 1994-04-05 | Motorola, Inc. | Method for mounting a wafer to a submount |
US5460773A (en) * | 1993-08-11 | 1995-10-24 | Fritz; Michael L. | Seal for blow down platen |
US6017484A (en) * | 1997-01-21 | 2000-01-25 | Harold P. Hale | Method for manufacture of minimum porosity, wrinkle free composite parts |
US6425812B1 (en) | 1997-04-08 | 2002-07-30 | Lam Research Corporation | Polishing head for chemical mechanical polishing using linear planarization technology |
US6244946B1 (en) | 1997-04-08 | 2001-06-12 | Lam Research Corporation | Polishing head with removable subcarrier |
US6336845B1 (en) | 1997-11-12 | 2002-01-08 | Lam Research Corporation | Method and apparatus for polishing semiconductor wafers |
DE19756614A1 (de) * | 1997-12-18 | 1999-07-01 | Wacker Siltronic Halbleitermat | Verfahren zur Montage und Demontage einer Halbleiterscheibe, und Stoffmischung, die zur Durchführung des Verfahrens geeignet ist |
JP3537688B2 (ja) * | 1998-11-24 | 2004-06-14 | 富士通株式会社 | 磁気ヘッドの加工方法 |
US6431959B1 (en) * | 1999-12-20 | 2002-08-13 | Lam Research Corporation | System and method of defect optimization for chemical mechanical planarization of polysilicon |
US6666756B1 (en) | 2000-03-31 | 2003-12-23 | Lam Research Corporation | Wafer carrier head assembly |
DE10048881A1 (de) * | 2000-09-29 | 2002-03-07 | Infineon Technologies Ag | Vorrichtung und Verfahren zum planen Verbinden zweier Wafer für ein Dünnschleifen und ein Trennen eines Produkt-Wafers |
DE10054159A1 (de) * | 2000-11-02 | 2002-05-16 | Wacker Siltronic Halbleitermat | Verfahren zur Montage von Halbleiterscheiben |
US7239902B2 (en) * | 2001-03-16 | 2007-07-03 | Nellor Puritan Bennett Incorporated | Device and method for monitoring body fluid and electrolyte disorders |
DE102005006052A1 (de) * | 2004-12-21 | 2006-07-06 | Osram Opto Semiconductors Gmbh | Linse, Laseranordnung und Verfahren zur Herstellung einer Laseranordnung |
JP5895676B2 (ja) * | 2012-04-09 | 2016-03-30 | 三菱電機株式会社 | 半導体装置の製造方法 |
CN108025587B (zh) * | 2015-09-18 | 2020-11-17 | 本田技研工业株式会社 | 粘贴装置和粘贴方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB316134A (de) * | 1928-07-23 | 1930-10-06 | Paul Pick | |
US3041800A (en) * | 1960-05-04 | 1962-07-03 | Roy O Heisel | Apparatus for shaping crystals |
US3322598A (en) * | 1963-10-02 | 1967-05-30 | Alvin M Marks | Laminator for securing continuous flexible film to a base |
US3405019A (en) * | 1965-07-30 | 1968-10-08 | Mc Donnell Douglas Corp | Vacuum bonding process |
DE1577469A1 (de) * | 1966-05-24 | 1970-05-06 | Siemens Ag | Verfahren zum Herstellen von Halbleiterscheiben gleichmaessiger Dicke durch mechanische Oberflaechenbearbeitung |
US3453783A (en) * | 1966-06-30 | 1969-07-08 | Texas Instruments Inc | Apparatus for holding silicon slices |
US3453166A (en) * | 1966-10-11 | 1969-07-01 | Bell Telephone Labor Inc | Method and apparatus for bonding transducer elements |
US3493451A (en) * | 1966-11-02 | 1970-02-03 | Boeing Co | Vacuum press and method of laminating therewith |
US3475867A (en) * | 1966-12-20 | 1969-11-04 | Monsanto Co | Processing of semiconductor wafers |
DE1652170B2 (de) * | 1967-03-03 | 1975-05-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum gleichzeitigen stirnseitigen Abarbeiten gleichdicker Werkstoffschichten an mehreren unterschiedlich dicken Halbleiterscheiben |
US3492763A (en) * | 1967-09-18 | 1970-02-03 | Monsanto Co | Method and apparatus for mounting semiconductor slices |
US3597081A (en) * | 1967-11-02 | 1971-08-03 | Continental Device Corp | Vacuum masking system and method |
US3554834A (en) * | 1968-07-24 | 1971-01-12 | Corning Glass Works | Decal applying |
US3681171A (en) * | 1968-08-23 | 1972-08-01 | Hitachi Ltd | Apparatus for producing a multilayer printed circuit plate assembly |
JPS495570A (de) * | 1972-05-02 | 1974-01-18 | ||
JPS4937278A (de) * | 1972-08-14 | 1974-04-06 | ||
US3888053A (en) * | 1973-05-29 | 1975-06-10 | Rca Corp | Method of shaping semiconductor workpiece |
US4104099A (en) * | 1977-01-27 | 1978-08-01 | International Telephone And Telegraph Corporation | Method and apparatus for lapping or polishing materials |
-
1977
- 1977-03-22 DE DE19772712521 patent/DE2712521A1/de active Granted
-
1978
- 1978-02-02 GB GB4251/78A patent/GB1554694A/en not_active Expired
- 1978-02-06 NL NL7801348A patent/NL7801348A/xx not_active Application Discontinuation
- 1978-03-20 IT IT48497/78A patent/IT1102109B/it active
- 1978-03-22 JP JP3283178A patent/JPS53146572A/ja active Pending
- 1978-03-22 FR FR7808275A patent/FR2384589A1/fr active Granted
- 1978-03-22 BE BE186160A patent/BE865169A/xx not_active IP Right Cessation
-
1979
- 1979-09-07 US US06/073,415 patent/US4283242A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS53146572A (en) | 1978-12-20 |
FR2384589A1 (fr) | 1978-10-20 |
IT7848497A0 (it) | 1978-03-20 |
FR2384589B1 (de) | 1980-08-29 |
GB1554694A (en) | 1979-10-24 |
DE2712521A1 (de) | 1978-09-28 |
NL7801348A (nl) | 1978-09-26 |
IT1102109B (it) | 1985-10-07 |
BE865169A (fr) | 1978-09-22 |
US4283242A (en) | 1981-08-11 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |