CN1861392B - 贴片机 - Google Patents

贴片机 Download PDF

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Publication number
CN1861392B
CN1861392B CN200510034591.5A CN200510034591A CN1861392B CN 1861392 B CN1861392 B CN 1861392B CN 200510034591 A CN200510034591 A CN 200510034591A CN 1861392 B CN1861392 B CN 1861392B
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China
Prior art keywords
elastomer
workpiece
chip mounter
adhesive plaster
tool frame
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Expired - Fee Related
Application number
CN200510034591.5A
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English (en)
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CN1861392A (zh
Inventor
简士哲
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200510034591.5A priority Critical patent/CN1861392B/zh
Priority to US11/378,085 priority patent/US20060254718A1/en
Publication of CN1861392A publication Critical patent/CN1861392A/zh
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Publication of CN1861392B publication Critical patent/CN1861392B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0047—Preventing air-inclusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers

Abstract

一种贴片机，其包括：一工作台、一治具框、一外框及一弹性组件。该外框固定于工作台上，并置于该治具框外，以避免工件移动。该弹性组件包括一弹性体及一基板，该基板通过胶与该弹性体粘合在一起，所述弹性体位于该治具框的上方。将一工件置于该治具框内，治具框置于位于该工作台上的外框内，并将一胶布铺设于该治具框上，施力使弹性组件向治具框方向下压，其弹性体在下压过程中，弹性体向两侧膨胀，使该弹性体的底部与胶布的接触从一点向四周扩散，而将该胶布平贴于工件上。通过本发明的贴片机，其可将胶布与工件完全贴合，避免气泡的产生。

Description

贴片机
【技术领域】
本发明涉及一种贴片机，特别是涉及一种贴合胶布与晶圆的贴片机。
【背景技术】
目前，在切割晶圆或光学玻璃时，通常使用Dicing Saw(晶圆精密切割机)。在切割之前，将待切割的工件固定在胶布上，切割完成后，使用固化曝光机照射，使工件与胶布脱离，从而得到所需要的工件。
现有的贴片机在将待切割的工件固定在胶布上时，一般使用滚筒装置来实现。请参阅图5，其提供一种贴片机，该贴片机包括一滚筒装置70，该滚筒装置70滑设于一座体71上，且可在该座体71上往复移动，将一胶带72铺设于治具框73及晶圆74上，通过该滚筒装置70的滚动，下压该胶带72，使胶带72平贴于该治具框73及晶圆74上，即可使胶带72与晶圆74固定。但是，使用滚筒技术进行贴片时，容易造成胶布与晶圆之间，因不完全贴合而产生气泡，进而导致晶圆切割时，若切割掉胶布与晶圆贴合时产生气泡部分的晶圆，因为此处晶圆未与胶布贴合，所以会产生晶圆切片飞散的问题。
【发明内容】
针对以上内容，有必要提供一种贴片机，其可将胶布与工件完全贴合，避免气泡的产生。
一种贴片机，其包括：一工作台、一治具框、一外框及一弹性组件。该外框固定于工作台上，并置于该治具框外，以避免工件移动。该弹性组件包括一弹性体及一基板，该基板通过胶与该弹性体粘合在一起，所述弹性体位于该治具框的上方。将一工件置于该治具框内，治具框置于位于该工作台上的外框内，并将一胶布铺设于该治具框上，施力使弹性组件向治具框方向下压，其弹性体在下压过程中，弹性体向两侧膨胀，使该弹性体的底部与胶布的接触从一点向四周扩散，而将该胶布平贴于工件上。
所述贴片机通过一弹性组件，施力使弹性组件下压并使其弹性体接触胶布，随着弹性组件的继续下压，其弹性体与胶布的接触面积越大，则胶布与工件的接触面积越大，且由一点慢慢向四周扩散，并最终使胶布与工件完全贴合，从而避免气泡的产生。
【附图说明】
图1是本发明贴片机较佳实施方式的第一位置示意图；
图2至图4是本发明贴片机较佳实施方式的下压弹性组件时胶布与工件各贴合状态示意图；
图5是贴片机现有技术示意图。
【具体实施方式】
请参阅图1，本发明较佳实施方式贴片机包括一工作台11、一外框12、一治具框13及一弹性组件14。其中，该治具框13可设于该外框12内，该外框12可固定于工作台11上，该弹性组件14可固定于工作台11的上方，且可上下移动。
该外框12为一两端开口的中空矩形体，其可通过一连接装置(图未示)与工作台11连接，并保持相对固定。
该治具框13用于挟持一工件2，其为一两端开口的中空圆柱体，其内孔的形状及大小与工件2的形状及大小相对应，治具框13的高度为L1，外框12的高度为L2，工件2的高度为L3，则L3＜L1≤L2。该工件2可为晶圆或光学玻璃等物体。
该弹性组件14包括一弹性体141及一基板142，该弹性体141与基板142可通过胶等粘性物质粘合在一起，该弹性体141可由一弹性袋及填充于该弹性袋内的液体、气体或其它可变形的介质构成。
装配时，首先，将外框12固定于工作台11上，将工件2挟持于治具框13内。然后，将挟持有工件2的治具框13置于工作台11上，并使其位于外框12内。最后，将弹性组件14调整至工件2的上方，并将一胶布3铺设于该外框12上。该胶布3可为UV胶布。
工作时，通过工具或手施力使弹性组件14向治具框13的方向下压，该弹性组件14的弹性体141接触胶布3，如图2所示。继续下压时，胶布3与工件2慢慢贴合，且由一点慢慢向四周扩散，如图3所示。当弹性组件14越往下压时，其弹性体141与胶布3的接触面积越大，则胶布3与工件2的接触面积越大，最后，胶布3与工件2完全贴合，如图4所示。
可以理解，该外框12的形状不限于矩形体，也可为其它形状；该治具框13的形状不限于圆柱体，也可为其它形状。

Claims (7)

1.一种贴片机，其包括：一工作台；一治具框，其置于该工作台上，并用于放置一工件于其内；其特征在于，该贴片机还包括一外框及一弹性组件，该弹性组件包括一弹性体及一基板，该基板通过胶与该弹性体粘合在一起，所述弹性体位于该治具框的上方，该外框固定于工作台上，并置于该治具框外，以避免工件移动；一胶布铺设于该外框上，通过按压该弹性体使其向治具框方向移动，该弹性体在下压过程中，弹性体向两侧膨胀，使该弹性体的底部与该胶布的接触从一点向四周扩散，而将该胶布压合于上述工件上。
2.如权利要求1所述的贴片机，其特征在于，该外框为一两端开口的中空矩形体，该治具框的高度为L1，外框的高度为L2，工件的高度为L3，其之间的高度关系为L3＜L1≤L2。
3.如权利要求2所述的贴片机，其特征在于，该治具框为一两端开口的中空圆柱体。
4.如权利要求3所述的贴片机，其特征在于，该弹性组件可上下移动的固定于工作台的上方。
5.如权利要求1所述的贴片机，其特征在于，该弹性体由一弹性袋及填充于该弹性袋内的可变形介质构成。
6.如权利要求5所述的贴片机，其特征在于，该可变形介质为液体。
7.如权利要求5所述的贴片机，其特征在于，该可变形介质为气体。
CN200510034591.5A 2005-05-10 2005-05-10 贴片机 Expired - Fee Related CN1861392B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200510034591.5A CN1861392B (zh) 2005-05-10 2005-05-10 贴片机
US11/378,085 US20060254718A1 (en) 2005-05-10 2006-03-16 Affixing machine

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Application Number Priority Date Filing Date Title
CN200510034591.5A CN1861392B (zh) 2005-05-10 2005-05-10 贴片机

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CN1861392A CN1861392A (zh) 2006-11-15
CN1861392B true CN1861392B (zh) 2011-09-28

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JP2007281343A (ja) * 2006-04-11 2007-10-25 Disco Abrasive Syst Ltd ウェーハ支持方法及びウェーハ支持装置
JP5164422B2 (ja) * 2007-04-26 2013-03-21 本田技研工業株式会社 燃料電池用膜電極構造体及びセパレータの積層方法及びその積層装置
CN101648452B (zh) * 2009-07-07 2012-05-23 何玉 一种金属包装盒的制造方法和设备
JP2012030922A (ja) * 2010-07-30 2012-02-16 Fujitsu Ltd 粘着テープ貼付装置および粘着テープ貼付方法
JP5763394B2 (ja) * 2011-04-14 2015-08-12 リンテック株式会社 転写装置および転写方法
CN103129767A (zh) * 2011-11-29 2013-06-05 亚旭电子科技(江苏)有限公司 贴膜装置及贴膜方法
JP2014137962A (ja) * 2013-01-18 2014-07-28 Sumitomo Wiring Syst Ltd 静電容量式操作装置の製造方法、操作パネル及び静電容量式操作装置
JP6390040B2 (ja) * 2014-07-30 2018-09-19 リンテック株式会社 粘着シートの貼付部材、貼付装置、および貼付方法
CN106739400B (zh) * 2016-11-28 2019-10-22 宁波视睿迪光电有限公司 一种光学透明胶贴合方法
US10283388B1 (en) * 2017-11-13 2019-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Detaping machine and detaping method

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EP0193159B1 (en) * 1985-02-07 1992-05-06 Fujitsu Limited Method and apparatus for adhering a tape or sheet to a semiconductor wafer

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CN1861392A (zh) 2006-11-15
US20060254718A1 (en) 2006-11-16

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