KR880700619A - 전기적 상호 접속수단 및 접속방법 - Google Patents

전기적 상호 접속수단 및 접속방법

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Publication number
KR880700619A
KR880700619A KR1019860700324A KR860700324A KR880700619A KR 880700619 A KR880700619 A KR 880700619A KR 1019860700324 A KR1019860700324 A KR 1019860700324A KR 860700324 A KR860700324 A KR 860700324A KR 880700619 A KR880700619 A KR 880700619A
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conductive
insulating
substrate
adhesive
conductors
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KR1019860700324A
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KR910005533B1 (ko
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알렌 데리 로날드
챨리 죤스 워렌
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제이 엘. 사이칙
에이 엠 피 인코포레이티드
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Abstract

내용 없음

Description

전기적 상호 접속수단 및 접속방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명에 따라 형성된 케이블의 두개의 영역 및 상기 두개의 영역간의 중첩접합부에 대한 투시도. 제 2 도는 제 1 도의 라인 2-2를 따라 취한 케이블의 횡단면도.

Claims (10)

  1. 한표면상의 다수의 도체(12)와 상기 도체를 피복시키는 절연 접착물(22)를 갖는 제 1 절연기판(14)으로 이루어지며, 상기 접착물이 압력하에서 유동성으로 되므로써 제 1 기판 도체가 다른 도체와 중첩도전관계로 위치되고 압력이 인가되어 제 1 기판(14)상의 도체가 제 2 기판(16)상의 다른 도체에 접속되는 전기적 접속수단(100)에 있어서, 상기 도체가 제 1, 제 2 도전유니트를 갖는 절연중합체매체(18)로 이루어진 도전잉크(10)이며, 제 1 그룹의 도전유니트는 매체상에 존재하는 미세하게 분할된 입자로 이루어지며, 각 도체의 길이를 따라 연속적인 도전통로를 형성하며, 제 2 그룹의 도전유니트는 더 큰 크기로 하며, 도전통로를 통해 무작위하게 분산되며, 매체표면상으로 돌출되며, 유동가능한 접착물(22)이 도체의 표면에 걸쳐 확장되고, 유동가능한 접착물(22)이 두 개의 기판(14)(16)간에 위치되는 것처럼 제 1 기판도체(24)를 제 2 기판 도체에 중첩도전관계로 위치시키고, 위치설정된 도체 및 주위 영역에 압력을 인가함에 따라, 접착물이 위치설정된 영역으로 부터 흐르게 되어 돌출유니트가 노출되고, 그에 의해 대응도체가 전기적으로 상호접속되므로써 제 1 기판의 남아있는 표면이 제 2 기판의 표면에 접착되는 것을 특징으로 하는 전기적 상호접속 수단.
  2. 제 1 항에 있어서, 상기 접착물이 가열과 압력하에서 유동가능한 열가소성 접착물인 것을 특징으로 하는 전기적 상호접속 수단.
  3. 제 1 항 또는 제 2 항에 있어서, 상기 상호접속수단이 전기적 상호접속 케이블로 이루어진 것을 특징으로 하는 전기적 상호접속수단.
  4. 제 1 항, 제 2 항 또는 제 3 항에 있어서, 상기 제 1 기판(14)이 유연부재, 반유연부재, 견고부재로 이루어진 그룹으로부터 선택되는 것을 특징으로 하는 전기적 상호접속 수단.
  5. 제 1 항, 제 2 항 제 3 항 또는 제 4 항에 있어서, 상기 제 2 기판이 리드로 접속된 전기적부품과 리드 없는 전기적부품과 유연한 부재, 반유연부재, 견고한 부재 등으로 이루어진 그룹으로 부터 선택되는 것을 특징으로 하는 전기적 상호접속 수단.
  6. 제 1 절연부재(20)의 적어도 한개의 도전통로(12)와 제 2 절연부재상의 적어도 한개의 도전수단을 접속하는 방법에 있어서, 제 1 절연부재를 선택하는 단계와, 적어도 한개의 도전통로를 상기 제 1 절연부재(14)에 인가시키는 단계와, 여기에서, 상기 도전 통로는 제 1, 제 2 그룹의 도전유니트를 갖는 절연매체를 포함하는 도전잉크형(10)이며, 상기 제 1 그룹은 연속적인 도전통로를 형성하기 위해 상기 절연매체를 통해 균일하게 분산되는 미세하게 분할된 도전입자이며, 상기 제 2 그룹(20)은 상기 절연매체를 통해 무작위하게 분산된 더 큰 크기의 도전 유니트이며, 상기 더 큰 도전유니트중의 몇몇은 상기 절연부재로 부터 외향으로 돌출되며, 보호된 절연접착층(20)을 상기 적어도 한개의 도전통로를 거쳐 상기 제 1 절연부 재상에 인가시키는 단계와, 상기 접착층(22)이 상기 적어도 한개의 도전통로(12)와 상기 적어도 한개의 도전수단간에 위치하는 것처럼 상기 적어도 한개의 도전통로(12)를 상기 적어도 한개의 도전수단과 도전관계로 상기 제 2 절연부 재상에 위치시키는 단계와, 상기 위치된 적어도 한개의 도전통로(12) 및 적어도 한개의 도전수단에 압력을 인가하여 상기 제 2 접착층을 유연하고 유동성이며 더욱 얇게 되도록 하므로써 상기 적어도 한개의 도전통로상의 상기 더 큰 도전유니트가 상기 접착층을 통해 확장되어 상기 적어도 한개의 도전수단과의 전기적 접속을 이루는 단계 등으로 이루어진 것을 특징으로 하는 전기적 상호접속방법.
  7. 제 6 항에 있어서, 상기 접착물(22)이 가열 및 압력하에서 유동성으로 되는 열가소성 접착물인 것을 특징으로 하는 전기적 상호접속방법.
  8. 제 6 항, 제 7 항에 있어서, 상기 제 1 절연부재(14)가 유연부재, 반유연부재, 견고부재로 이루어진 그룹으로 부터 선택되는 것을 특징으로 하는 전기적 상호접속방법.
  9. 제 6 항, 제 7 항 또는 제 8 항에 있어서, 상기 제 2 절연부재가 리드로 결합된 전기적부품, 리드없는 전기적 부품, 유연한 부재, 반유연부재, 견고부재로 이루어진 그룹으로부터 선택되는 것을 특징으로 하는 전기적 상호접속방법.
  10. 제 6항, 제 7 항 또는 제 8 항에 있어서, 상기 제 1 절연부재(14)가 적어도 한개의 표면상에 적어도 한개의 가늘고 긴 도체를 갖는 절연기판으로 이루어진 케이블인것을 특징으로 하는 전기적 상호 접속방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860700324A 1984-10-04 1985-09-13 전기적 상호접속수단 및 접속방법 KR910005533B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US657851 1984-10-04
US06/657,851 US4554033A (en) 1984-10-04 1984-10-04 Method of forming an electrical interconnection means
PCT/US1985/001741 WO1986002231A1 (en) 1984-10-04 1985-09-13 Electrical interconnection means

Publications (2)

Publication Number Publication Date
KR880700619A true KR880700619A (ko) 1988-03-15
KR910005533B1 KR910005533B1 (ko) 1991-07-31

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Country Link
US (1) US4554033A (ko)
EP (1) EP0198844B1 (ko)
JP (1) JPH06101614B2 (ko)
KR (1) KR910005533B1 (ko)
CN (1) CN1004910B (ko)
AU (1) AU4802185A (ko)
BR (1) BR8506957A (ko)
CA (1) CA1220251A (ko)
DE (1) DE3575841D1 (ko)
ES (1) ES289336Y (ko)
IE (1) IE56869B1 (ko)
WO (1) WO1986002231A1 (ko)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
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US4640981A (en) * 1984-10-04 1987-02-03 Amp Incorporated Electrical interconnection means
US4642421A (en) * 1984-10-04 1987-02-10 Amp Incorporated Adhesive electrical interconnecting means
US4740532A (en) * 1985-04-30 1988-04-26 Amp Incorporated Photocurable dielectric composition of acrylated urethane prepolymer
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US4554033A (en) 1985-11-19
WO1986002231A1 (en) 1986-04-10
ES289336Y (es) 1987-05-01
CN85107932A (zh) 1986-06-10
IE56869B1 (en) 1992-01-01
JPH06101614B2 (ja) 1994-12-12
BR8506957A (pt) 1986-12-23
DE3575841D1 (de) 1990-03-08
AU4802185A (en) 1986-04-17
JPS62500828A (ja) 1987-04-02
IE852265L (en) 1986-04-04
CA1220251A (en) 1987-04-07
CN1004910B (zh) 1989-07-26
EP0198844B1 (en) 1990-01-31
ES289336U (es) 1986-08-16
KR910005533B1 (ko) 1991-07-31
EP0198844A1 (en) 1986-10-29

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