ES289336U - Unos medios de interconexion electrica - Google Patents
Unos medios de interconexion electricaInfo
- Publication number
- ES289336U ES289336U ES1985289336U ES289336U ES289336U ES 289336 U ES289336 U ES 289336U ES 1985289336 U ES1985289336 U ES 1985289336U ES 289336 U ES289336 U ES 289336U ES 289336 U ES289336 U ES 289336U
- Authority
- ES
- Spain
- Prior art keywords
- conductors
- substrate
- particles
- agglomerates
- medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Abstract
Un cable de interconexión eléctrica del tipo que comprende un primer sustrato aislante que tiene pluralidad de conductores dispuestos en una superficie del mismo y que tiene un adhesivo aislante en relación de cubrimiento con los conductores, pudiendo ser hecho fluir el adhesivo bajo, presión, por lo que los conductores del primer sustrato pueden conectarse a otros conductores segundo sustrato situando los conductores del primer trato en relación. de conducción con solape con respecto los otros conductores y aplicando presión, caracterizándose el cable de interconexión eléctrica porque: los conductores alargados son de tinta conductora que comprende un medio polímero aislante que tiene una primera y una segunda unidades conductoras en él; el primer grupo de unidades conductoras comprende partículas finamente divididas que están en suspensión en el medio y que forman una trayectoria conductora continua a lo largo de cada conductor; el segundo grupo de unidades conductoras tienen un tamaño mayor y están dispersadas de manera aleatoria por toda la trayectoria conductora y sobresalen por encima de la superficie del medio; y el adhesivo capaz de fluir se extiende sobre la superficie de los conductores, por lo que, al situar y posicionar 101 conductores del primer sustrato en relación de conducción con solape con respecto a los conductores del segundo sustrato de tal manera que el adhesivo capaz de fluir esté dispuesto entre el cable y el según sustrato, y al aplicar presión a los conductores posicionado sí al área circundante, el adhesivo fluya desde las. áreas situadas en posición y y deje al descubierta sobresalientes para interconectar eléctricamente conductores correspondientes, lo que va acompañado por la herencia de la superficie restante del primer sustracción la superficie del segundo sustrato.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/657,851 US4554033A (en) | 1984-10-04 | 1984-10-04 | Method of forming an electrical interconnection means |
Publications (2)
Publication Number | Publication Date |
---|---|
ES289336U true ES289336U (es) | 1986-08-16 |
ES289336Y ES289336Y (es) | 1987-05-01 |
Family
ID=24638911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES1985289336U Expired ES289336Y (es) | 1984-10-04 | 1985-10-01 | Unos medios de interconexion electrica |
Country Status (12)
Country | Link |
---|---|
US (1) | US4554033A (es) |
EP (1) | EP0198844B1 (es) |
JP (1) | JPH06101614B2 (es) |
KR (1) | KR910005533B1 (es) |
CN (1) | CN1004910B (es) |
AU (1) | AU4802185A (es) |
BR (1) | BR8506957A (es) |
CA (1) | CA1220251A (es) |
DE (1) | DE3575841D1 (es) |
ES (1) | ES289336Y (es) |
IE (1) | IE56869B1 (es) |
WO (1) | WO1986002231A1 (es) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4642421A (en) * | 1984-10-04 | 1987-02-10 | Amp Incorporated | Adhesive electrical interconnecting means |
US4640981A (en) * | 1984-10-04 | 1987-02-03 | Amp Incorporated | Electrical interconnection means |
US4740532A (en) * | 1985-04-30 | 1988-04-26 | Amp Incorporated | Photocurable dielectric composition of acrylated urethane prepolymer |
US4644092A (en) * | 1985-07-18 | 1987-02-17 | Amp Incorporated | Shielded flexible cable |
US4774634A (en) * | 1986-01-21 | 1988-09-27 | Key Tronic Corporation | Printed circuit board assembly |
DE3608010A1 (de) * | 1986-03-11 | 1987-09-17 | Philips Patentverwaltung | Verfahren zum herstellen einer elektrisch leitenden klebverbindung |
US4706097A (en) * | 1986-04-03 | 1987-11-10 | Hewlett Packard Company | Near-linear spring connect structure for flexible interconnect circuits |
US4694572A (en) * | 1986-06-13 | 1987-09-22 | Tektronix, Inc. | Printed polymer circuit board method |
US4923739A (en) * | 1987-07-30 | 1990-05-08 | American Telephone And Telegraph Company | Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method |
US4859813A (en) * | 1987-09-04 | 1989-08-22 | Calcomp Inc. | Digitizer tablet having electrical interconnect components on the writing substrate |
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
US5236533A (en) * | 1989-01-23 | 1993-08-17 | Nippon Steel Corporation | Resin-sandwiched metal laminate, process and apparatus for producing the same and process for producing resin film for the resin-sandwiched metal laminate |
US5188698A (en) * | 1989-01-23 | 1993-02-23 | Nippon Steel Corporation | Resin-sandwiched metal laminate, process and apparatus for producing the same and process for the producing resin film for the resin-sandwiched metal laminate |
US5235741A (en) * | 1989-08-18 | 1993-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Electrical connection and method for making the same |
JPH0831350B2 (ja) * | 1989-10-03 | 1996-03-27 | 日本黒鉛工業株式会社 | ファインピッチ用導電異方性ヒートシールコネクタ部材の製造法 |
US5611140A (en) * | 1989-12-18 | 1997-03-18 | Epoxy Technology, Inc. | Method of forming electrically conductive polymer interconnects on electrical substrates |
CA2038012A1 (en) * | 1990-03-14 | 1991-09-15 | Hideki Shimizu | Oxide superconductor lamination and method of manufacturing the same |
US5162613A (en) * | 1991-07-01 | 1992-11-10 | At&T Bell Laboratories | Integrated circuit interconnection technique |
US5354392A (en) * | 1992-01-24 | 1994-10-11 | Matsushita Electric Industrial Co., Ltd. | Method for connecting a wiring arranged on a sheet with another wiring arranged on another sheet by ultrasonic waves |
US5371327A (en) * | 1992-02-19 | 1994-12-06 | Shin-Etsu Polymer Co., Ltd. | Heat-sealable connector sheet |
US5221417A (en) * | 1992-02-20 | 1993-06-22 | At&T Bell Laboratories | Conductive adhesive film techniques |
US5288235A (en) * | 1992-12-14 | 1994-02-22 | Hughes Aircraft Company | Electrical interconnects having a supported bulge configuration |
US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
US5401913A (en) * | 1993-06-08 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
JP2937705B2 (ja) * | 1993-08-31 | 1999-08-23 | アルプス電気株式会社 | プリント配線板の接続方法 |
US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
US5357084A (en) * | 1993-11-15 | 1994-10-18 | The Whitaker Corporation | Device for electrically interconnecting contact arrays |
JPH09148731A (ja) * | 1995-11-17 | 1997-06-06 | Fujitsu Ltd | 配線基板間の接続構造の製造方法 |
US5877668A (en) * | 1995-11-30 | 1999-03-02 | Daewoo Electronics Co., Ltd. | Flyback transformer having a flexible coil winding structure and manufacturing process thereof |
JP2831970B2 (ja) * | 1996-04-12 | 1998-12-02 | 山一電機株式会社 | 回路基板における層間接続方法 |
US5741430A (en) * | 1996-04-25 | 1998-04-21 | Lucent Technologies Inc. | Conductive adhesive bonding means |
DE19618100A1 (de) * | 1996-05-06 | 1997-11-13 | Siemens Ag | Verfahren zur Herstellung einer Mehrlagen-Verbundstruktur mit elektrisch leitenden Verbindungen |
JP3928753B2 (ja) | 1996-08-06 | 2007-06-13 | 日立化成工業株式会社 | マルチチップ実装法、および接着剤付チップの製造方法 |
US5920037A (en) * | 1997-05-12 | 1999-07-06 | International Business Machines Corporation | Conductive bonding design for metal backed circuits |
US6019271A (en) * | 1997-07-11 | 2000-02-01 | Ford Motor Company | Method for ultrasonic bonding flexible circuits |
JP3625646B2 (ja) | 1998-03-23 | 2005-03-02 | 東レエンジニアリング株式会社 | フリップチップ実装方法 |
US6189208B1 (en) | 1998-09-11 | 2001-02-20 | Polymer Flip Chip Corp. | Flip chip mounting technique |
US6218446B1 (en) * | 1999-01-11 | 2001-04-17 | Dymax Corporation | Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced |
US7124927B2 (en) * | 1999-02-25 | 2006-10-24 | Reiber Steven F | Flip chip bonding tool and ball placement capillary |
US20080197172A1 (en) * | 1999-02-25 | 2008-08-21 | Reiber Steven F | Bonding Tool |
US20060261132A1 (en) * | 1999-02-25 | 2006-11-23 | Reiber Steven F | Low range bonding tool |
US20070131661A1 (en) * | 1999-02-25 | 2007-06-14 | Reiber Steven F | Solder ball placement system |
US7032802B2 (en) * | 1999-02-25 | 2006-04-25 | Reiber Steven F | Bonding tool with resistance |
US7389905B2 (en) | 1999-02-25 | 2008-06-24 | Reiber Steven F | Flip chip bonding tool tip |
US20060071050A1 (en) * | 1999-02-25 | 2006-04-06 | Reiber Steven F | Multi-head tab bonding tool |
US6410415B1 (en) * | 1999-03-23 | 2002-06-25 | Polymer Flip Chip Corporation | Flip chip mounting technique |
US7244675B2 (en) * | 2000-03-23 | 2007-07-17 | Sony Corporation | Electrical connection materials and electrical connection method |
TW492215B (en) * | 2000-03-23 | 2002-06-21 | Sony Corp | Electric connection material and electric connection method |
US6490786B2 (en) * | 2001-04-17 | 2002-12-10 | Visteon Global Technologies, Inc. | Circuit assembly and a method for making the same |
CA2350853A1 (en) * | 2001-06-15 | 2002-12-15 | Groupe Minutia Inc. | Method of establishing electrical conductivity between oxide-coated electrical conductors |
JP3893100B2 (ja) * | 2002-10-29 | 2007-03-14 | 新光電気工業株式会社 | 配線基板への電子部品搭載方法 |
US20070085085A1 (en) * | 2005-08-08 | 2007-04-19 | Reiber Steven F | Dissipative pick and place tools for light wire and LED displays |
JP2009135388A (ja) * | 2007-10-30 | 2009-06-18 | Hitachi Chem Co Ltd | 回路接続方法 |
US8816807B2 (en) * | 2010-05-21 | 2014-08-26 | Purdue Research Foundation | Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles |
US20150164703A1 (en) * | 2012-06-15 | 2015-06-18 | Ithealth Co., Ltd. | Excreta detecting sensor and detecting device using electrically-conductive fibrous conducting wire |
JP6985624B2 (ja) * | 2020-02-25 | 2021-12-22 | 富士通クライアントコンピューティング株式会社 | 電子部品、および電子部品の製造方法 |
Family Cites Families (18)
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US31411A (en) * | 1861-02-12 | Improvement in sewing-machines | ||
US2808352A (en) * | 1951-03-22 | 1957-10-01 | Burgess Battery Co | Electrically conductive adhesive tape |
US3514326A (en) * | 1967-11-17 | 1970-05-26 | Minnesota Mining & Mfg | Tape |
US3678437A (en) * | 1970-12-30 | 1972-07-18 | Itt | Flat cable wafer |
US3778306A (en) * | 1971-01-04 | 1973-12-11 | Minnesota Mining & Mfg | Tape |
US4113981A (en) * | 1974-08-14 | 1978-09-12 | Kabushiki Kaisha Seikosha | Electrically conductive adhesive connecting arrays of conductors |
US3988647A (en) * | 1974-09-27 | 1976-10-26 | General Electric Company | Method for making a circuit board and article made thereby |
USRE31411E (en) | 1974-09-27 | 1983-10-11 | General Electric Company | Radiation curable inks |
GB1496245A (en) * | 1975-07-07 | 1977-12-30 | Barish B | Stylus-actuated electrical switching devices |
JPS5357481A (en) * | 1976-11-04 | 1978-05-24 | Canon Inc | Connecting process |
DE2831984A1 (de) * | 1977-07-21 | 1979-02-01 | Sharp Kk | Elektrische verbindung zwischen zwei auf getrennte traeger aufgebrachten elektrischen schaltkreisen |
US4243455A (en) * | 1977-07-29 | 1981-01-06 | Nippon Graphite Industries, Ltd. | Method of forming electrode connector for liquid crystal display device |
GB2064873B (en) * | 1979-11-26 | 1984-09-05 | Eventoff Franklin Neal | Pressure sensitive electric switch |
US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
US4401843A (en) * | 1981-03-31 | 1983-08-30 | Rogers Corporation | Miniaturized bus bars and methods of fabrication thereof |
US4425263A (en) * | 1981-06-03 | 1984-01-10 | E. I. Du Pont De Nemours & Co. | Flexible screen-printable conductive composition |
US4446059A (en) * | 1982-04-15 | 1984-05-01 | E. I. Du Pont De Nemours & Co. | Conductor compositions |
FR2531599A1 (fr) * | 1982-08-03 | 1984-02-10 | Xerox Corp | Jonction multiple de fils tres etroitement espaces sur des substrats contigus |
-
1984
- 1984-10-04 US US06/657,851 patent/US4554033A/en not_active Expired - Lifetime
-
1985
- 1985-09-13 KR KR1019860700324A patent/KR910005533B1/ko not_active IP Right Cessation
- 1985-09-13 AU AU48021/85A patent/AU4802185A/en not_active Abandoned
- 1985-09-13 BR BR8506957A patent/BR8506957A/pt unknown
- 1985-09-13 JP JP60504058A patent/JPH06101614B2/ja not_active Expired - Fee Related
- 1985-09-13 DE DE8585904573T patent/DE3575841D1/de not_active Expired - Fee Related
- 1985-09-13 IE IE2265/85A patent/IE56869B1/en not_active IP Right Cessation
- 1985-09-13 WO PCT/US1985/001741 patent/WO1986002231A1/en active IP Right Grant
- 1985-09-13 EP EP85904573A patent/EP0198844B1/en not_active Expired - Lifetime
- 1985-09-26 CA CA000491646A patent/CA1220251A/en not_active Expired
- 1985-09-30 CN CN85107932.6A patent/CN1004910B/zh not_active Expired
- 1985-10-01 ES ES1985289336U patent/ES289336Y/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
ES289336Y (es) | 1987-05-01 |
JPH06101614B2 (ja) | 1994-12-12 |
CN85107932A (zh) | 1986-06-10 |
IE852265L (en) | 1986-04-04 |
CN1004910B (zh) | 1989-07-26 |
US4554033A (en) | 1985-11-19 |
CA1220251A (en) | 1987-04-07 |
BR8506957A (pt) | 1986-12-23 |
EP0198844B1 (en) | 1990-01-31 |
IE56869B1 (en) | 1992-01-01 |
JPS62500828A (ja) | 1987-04-02 |
DE3575841D1 (de) | 1990-03-08 |
WO1986002231A1 (en) | 1986-04-10 |
KR910005533B1 (ko) | 1991-07-31 |
AU4802185A (en) | 1986-04-17 |
EP0198844A1 (en) | 1986-10-29 |
KR880700619A (ko) | 1988-03-15 |
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Effective date: 19980202 |