ES289336Y - Unos medios de interconexion electrica - Google Patents

Unos medios de interconexion electrica

Info

Publication number
ES289336Y
ES289336Y ES1985289336U ES289336U ES289336Y ES 289336 Y ES289336 Y ES 289336Y ES 1985289336 U ES1985289336 U ES 1985289336U ES 289336 U ES289336 U ES 289336U ES 289336 Y ES289336 Y ES 289336Y
Authority
ES
Spain
Prior art keywords
electrical interconnection
interconnection
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES1985289336U
Other languages
English (en)
Other versions
ES289336U (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of ES289336U publication Critical patent/ES289336U/es
Application granted granted Critical
Publication of ES289336Y publication Critical patent/ES289336Y/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
ES1985289336U 1984-10-04 1985-10-01 Unos medios de interconexion electrica Expired ES289336Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/657,851 US4554033A (en) 1984-10-04 1984-10-04 Method of forming an electrical interconnection means

Publications (2)

Publication Number Publication Date
ES289336U ES289336U (es) 1986-08-16
ES289336Y true ES289336Y (es) 1987-05-01

Family

ID=24638911

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1985289336U Expired ES289336Y (es) 1984-10-04 1985-10-01 Unos medios de interconexion electrica

Country Status (12)

Country Link
US (1) US4554033A (es)
EP (1) EP0198844B1 (es)
JP (1) JPH06101614B2 (es)
KR (1) KR910005533B1 (es)
CN (1) CN1004910B (es)
AU (1) AU4802185A (es)
BR (1) BR8506957A (es)
CA (1) CA1220251A (es)
DE (1) DE3575841D1 (es)
ES (1) ES289336Y (es)
IE (1) IE56869B1 (es)
WO (1) WO1986002231A1 (es)

Families Citing this family (57)

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US4642421A (en) * 1984-10-04 1987-02-10 Amp Incorporated Adhesive electrical interconnecting means
US4640981A (en) * 1984-10-04 1987-02-03 Amp Incorporated Electrical interconnection means
US4740532A (en) * 1985-04-30 1988-04-26 Amp Incorporated Photocurable dielectric composition of acrylated urethane prepolymer
US4644092A (en) * 1985-07-18 1987-02-17 Amp Incorporated Shielded flexible cable
US4774634A (en) * 1986-01-21 1988-09-27 Key Tronic Corporation Printed circuit board assembly
DE3608010A1 (de) * 1986-03-11 1987-09-17 Philips Patentverwaltung Verfahren zum herstellen einer elektrisch leitenden klebverbindung
US4706097A (en) * 1986-04-03 1987-11-10 Hewlett Packard Company Near-linear spring connect structure for flexible interconnect circuits
US4694572A (en) * 1986-06-13 1987-09-22 Tektronix, Inc. Printed polymer circuit board method
US4923739A (en) * 1987-07-30 1990-05-08 American Telephone And Telegraph Company Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method
US4859813A (en) * 1987-09-04 1989-08-22 Calcomp Inc. Digitizer tablet having electrical interconnect components on the writing substrate
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
US5236533A (en) * 1989-01-23 1993-08-17 Nippon Steel Corporation Resin-sandwiched metal laminate, process and apparatus for producing the same and process for producing resin film for the resin-sandwiched metal laminate
US5188698A (en) * 1989-01-23 1993-02-23 Nippon Steel Corporation Resin-sandwiched metal laminate, process and apparatus for producing the same and process for the producing resin film for the resin-sandwiched metal laminate
US5235741A (en) * 1989-08-18 1993-08-17 Semiconductor Energy Laboratory Co., Ltd. Electrical connection and method for making the same
JPH0831350B2 (ja) * 1989-10-03 1996-03-27 日本黒鉛工業株式会社 ファインピッチ用導電異方性ヒートシールコネクタ部材の製造法
US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
CA2038012A1 (en) * 1990-03-14 1991-09-15 Hideki Shimizu Oxide superconductor lamination and method of manufacturing the same
US5162613A (en) * 1991-07-01 1992-11-10 At&T Bell Laboratories Integrated circuit interconnection technique
US5354392A (en) * 1992-01-24 1994-10-11 Matsushita Electric Industrial Co., Ltd. Method for connecting a wiring arranged on a sheet with another wiring arranged on another sheet by ultrasonic waves
US5371327A (en) * 1992-02-19 1994-12-06 Shin-Etsu Polymer Co., Ltd. Heat-sealable connector sheet
US5221417A (en) * 1992-02-20 1993-06-22 At&T Bell Laboratories Conductive adhesive film techniques
US5288235A (en) * 1992-12-14 1994-02-22 Hughes Aircraft Company Electrical interconnects having a supported bulge configuration
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
JP2937705B2 (ja) * 1993-08-31 1999-08-23 アルプス電気株式会社 プリント配線板の接続方法
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
US5357084A (en) * 1993-11-15 1994-10-18 The Whitaker Corporation Device for electrically interconnecting contact arrays
JPH09148731A (ja) * 1995-11-17 1997-06-06 Fujitsu Ltd 配線基板間の接続構造の製造方法
US5877668A (en) * 1995-11-30 1999-03-02 Daewoo Electronics Co., Ltd. Flyback transformer having a flexible coil winding structure and manufacturing process thereof
JP2831970B2 (ja) * 1996-04-12 1998-12-02 山一電機株式会社 回路基板における層間接続方法
US5741430A (en) * 1996-04-25 1998-04-21 Lucent Technologies Inc. Conductive adhesive bonding means
DE19618100A1 (de) * 1996-05-06 1997-11-13 Siemens Ag Verfahren zur Herstellung einer Mehrlagen-Verbundstruktur mit elektrisch leitenden Verbindungen
JP3928753B2 (ja) 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
US5920037A (en) * 1997-05-12 1999-07-06 International Business Machines Corporation Conductive bonding design for metal backed circuits
US6019271A (en) * 1997-07-11 2000-02-01 Ford Motor Company Method for ultrasonic bonding flexible circuits
JP3625646B2 (ja) 1998-03-23 2005-03-02 東レエンジニアリング株式会社 フリップチップ実装方法
US6189208B1 (en) 1998-09-11 2001-02-20 Polymer Flip Chip Corp. Flip chip mounting technique
US6218446B1 (en) * 1999-01-11 2001-04-17 Dymax Corporation Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced
US7124927B2 (en) * 1999-02-25 2006-10-24 Reiber Steven F Flip chip bonding tool and ball placement capillary
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
US7032802B2 (en) * 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US7389905B2 (en) 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
US6410415B1 (en) * 1999-03-23 2002-06-25 Polymer Flip Chip Corporation Flip chip mounting technique
US7244675B2 (en) * 2000-03-23 2007-07-17 Sony Corporation Electrical connection materials and electrical connection method
TW492215B (en) * 2000-03-23 2002-06-21 Sony Corp Electric connection material and electric connection method
US6490786B2 (en) * 2001-04-17 2002-12-10 Visteon Global Technologies, Inc. Circuit assembly and a method for making the same
CA2350853A1 (en) * 2001-06-15 2002-12-15 Groupe Minutia Inc. Method of establishing electrical conductivity between oxide-coated electrical conductors
JP3893100B2 (ja) * 2002-10-29 2007-03-14 新光電気工業株式会社 配線基板への電子部品搭載方法
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
JP2009135388A (ja) * 2007-10-30 2009-06-18 Hitachi Chem Co Ltd 回路接続方法
US8816807B2 (en) * 2010-05-21 2014-08-26 Purdue Research Foundation Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles
US20150164703A1 (en) * 2012-06-15 2015-06-18 Ithealth Co., Ltd. Excreta detecting sensor and detecting device using electrically-conductive fibrous conducting wire
JP6985624B2 (ja) * 2020-02-25 2021-12-22 富士通クライアントコンピューティング株式会社 電子部品、および電子部品の製造方法

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US4425263A (en) * 1981-06-03 1984-01-10 E. I. Du Pont De Nemours & Co. Flexible screen-printable conductive composition
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Also Published As

Publication number Publication date
JPH06101614B2 (ja) 1994-12-12
CN85107932A (zh) 1986-06-10
IE852265L (en) 1986-04-04
CN1004910B (zh) 1989-07-26
US4554033A (en) 1985-11-19
CA1220251A (en) 1987-04-07
BR8506957A (pt) 1986-12-23
EP0198844B1 (en) 1990-01-31
IE56869B1 (en) 1992-01-01
JPS62500828A (ja) 1987-04-02
DE3575841D1 (de) 1990-03-08
WO1986002231A1 (en) 1986-04-10
KR910005533B1 (ko) 1991-07-31
AU4802185A (en) 1986-04-17
EP0198844A1 (en) 1986-10-29
KR880700619A (ko) 1988-03-15
ES289336U (es) 1986-08-16

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Effective date: 19980202