KR880005564A - 박막자기헤드 - Google Patents

박막자기헤드 Download PDF

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Publication number
KR880005564A
KR880005564A KR870011751A KR870011751A KR880005564A KR 880005564 A KR880005564 A KR 880005564A KR 870011751 A KR870011751 A KR 870011751A KR 870011751 A KR870011751 A KR 870011751A KR 880005564 A KR880005564 A KR 880005564A
Authority
KR
South Korea
Prior art keywords
film
magnetic head
head according
thin film
layer
Prior art date
Application number
KR870011751A
Other languages
English (en)
Other versions
KR920001154B1 (ko
Inventor
요시노리 데꾸라
가즈히로 모마따
도끼유끼 세또
Original Assignee
미따 가쯔시게
가부시끼가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미따 가쯔시게, 가부시끼가이샤 히다찌세이사꾸쇼 filed Critical 미따 가쯔시게
Publication of KR880005564A publication Critical patent/KR880005564A/ko
Application granted granted Critical
Publication of KR920001154B1 publication Critical patent/KR920001154B1/ko

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Magnetic Heads (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

내용 없음

Description

박막자기헤드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1 시 예에 있어서의 박막자기헤드의 주요부를 나타내는 단면도.
제2도는 본 발명의 1 실시 예에 있어서의 박막자기헤드의 사시도.
제3도는 본 발명의 1 실시 예에 있어서의 박막자기헤드의 가요성 프린트 기판의 사시도.

Claims (7)

  1. 전류를 인가하고 입력신호를 입력하거나, 출력신호를 끌어내기 위한 복수의 도체막 단자 및 상기 도체막 단자에 접속되는 복수의 리이드 단자를 가지는 가요성 프린트기판을 구비하고, 상기 도체막 단자의 최소한 표면은 Au막으로 이루어지며, 상기 리이드 단자의 표면은 Au층으로 이루어지고, 상기 Au막과 상기 Au층이 접합되며 또한 상기 리이드 단자의 도체막 단자 접합면과의 반대측의 면이 가요성 필름에 접착고정되고, 상기 가요성 필름이 최소한 상기 Au막과 상기 Au층과의 접합부 위를 피복하고 있는 것을 특징으로 하는 박막자기헤드.
  2. 제1항에 있어서, 상기 Au막의 두께가 0.2∼1.5㎛임을 특징으로 하는 박막자기헤드.
  3. 제1항에 있어서, 상기 Au층의 두께가 1∼10㎛임을 특징으로 하는 박막자기헤드.
  4. 제1항에 있어서, 상기 Au층의 두께가 1∼10㎛임을 특징으로 하는 막박자기헤드.
  5. 제1항에 있어서, 상기 가요성 필름이 고분자 수지막으로 되어 있음을 특징으로 하는 박막자기헤드.
  6. 제5항에 있어서, 상기 고분자 수지막이 폴리아미드 수지 혹은 폴리에스테르 수지로서 되어있음을 특징으로 하는 박막자기헤드.
  7. 제4항에 있어서, 상기 가요성 필름이 두께 12.5∼50㎛의 폴리아미드 수지막 혹은 폴리에스테르 수지막으로 되어있음을 특징으로 하는 박막자기헤드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870011751A 1986-10-24 1987-10-22 박막자기헤드 KR920001154B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61251629A JPS63106910A (ja) 1986-10-24 1986-10-24 薄膜磁気ヘツド
JP251629 1986-10-24

Publications (2)

Publication Number Publication Date
KR880005564A true KR880005564A (ko) 1988-06-29
KR920001154B1 KR920001154B1 (ko) 1992-02-06

Family

ID=17225666

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870011751A KR920001154B1 (ko) 1986-10-24 1987-10-22 박막자기헤드

Country Status (3)

Country Link
US (1) US4796132A (ko)
JP (1) JPS63106910A (ko)
KR (1) KR920001154B1 (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9001146A (nl) * 1990-05-17 1991-12-16 Philips Nv Dunnefilm magneetkop.
JP2931477B2 (ja) * 1991-06-07 1999-08-09 シャープ株式会社 薄膜磁気ヘッド構造体およびその製造方法
JPH06162446A (ja) * 1992-11-24 1994-06-10 Matsushita Electric Ind Co Ltd 薄膜磁気ヘッド
JP2526774B2 (ja) * 1992-12-10 1996-08-21 日本電気株式会社 薄膜磁気ヘッド
JPH07169015A (ja) * 1993-12-10 1995-07-04 Sony Corp 磁気ヘッド
BE1007992A3 (nl) * 1993-12-17 1995-12-05 Philips Electronics Nv Werkwijze voor het vervaardigen van een dunnefilmmagneetkop en magneetkop vervaardigd volgens de werkwijze.
JPH08212516A (ja) * 1995-01-31 1996-08-20 Masaaki Matsui 支持ビームに対する接触型薄膜磁気ヘッド素子の接合方法
US6219202B1 (en) 1995-10-26 2001-04-17 International Business Machines Corporation Slider suspension assembly and method for attaching a slider to a suspension in a data-recording disk file including a flexible integrated cable having an aperture therein for permitting electrical contact
JP2000339648A (ja) * 1999-05-24 2000-12-08 Tdk Corp 磁気ヘッド装置の製造方法
JP4338834B2 (ja) * 1999-08-06 2009-10-07 日本テキサス・インスツルメンツ株式会社 超音波振動を用いた半導体チップの実装方法
JP3587748B2 (ja) * 1999-10-18 2004-11-10 ソニーケミカル株式会社 多層フレキシブル配線板及び多層フレキシブル配線板製造方法
JP3738679B2 (ja) 2000-09-12 2006-01-25 Ｔｄｋ株式会社 ヘッドジンバルアセンブリ
CN1185915C (zh) * 2001-06-13 2005-01-19 佳能株式会社 柔性基板、半导体器件、摄像装置和放射线摄像系统
CN100434840C (zh) 2004-06-11 2008-11-19 大金工业株式会社 空调装置
DE102008040614A1 (de) * 2008-07-22 2010-01-28 Robert Bosch Gmbh Kontaktierungsverfahren für substratbasierte Schaltungen und zugehörige Schaltungsanordnung
JP5486459B2 (ja) * 2010-11-05 2014-05-07 日東電工株式会社 配線回路基板
US20140374151A1 (en) * 2013-06-24 2014-12-25 Jia Lin Yap Wire bonding method for flexible substrates
WO2017154643A1 (ja) * 2016-03-11 2017-09-14 本田技研工業株式会社 電子回路基板および超音波接合方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3908194A (en) * 1974-08-19 1975-09-23 Ibm Integrated magnetoresistive read, inductive write, batch fabricated magnetic head
US4520413A (en) * 1982-04-13 1985-05-28 Minnesota Mining And Manufacturing Company Integrated magnetostrictive-piezoelectric-metal oxide semiconductor magnetic playback head
JPS58182120A (ja) * 1982-04-19 1983-10-25 Matsushita Electric Ind Co Ltd 多チヤンネル薄膜磁気ヘツドの製造方法
JPS5979417A (ja) * 1982-10-28 1984-05-08 Sony Corp 磁気ヘツド装置
JPS59172106A (ja) * 1983-03-18 1984-09-28 Matsushita Electric Ind Co Ltd 多チヤンネル薄膜磁気ヘツドおよびその製造方法
US4622613A (en) * 1983-10-07 1986-11-11 Matsushita Electric Industrials Co., Ltd. Thin film magnetic head

Also Published As

Publication number Publication date
JPS63106910A (ja) 1988-05-12
KR920001154B1 (ko) 1992-02-06
US4796132A (en) 1989-01-03

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