KR880003744A - 비감광성 중간 액체층을 사용하여 기판상에서 광중합성 필름을 적층하는 방법 - Google Patents
비감광성 중간 액체층을 사용하여 기판상에서 광중합성 필름을 적층하는 방법 Download PDFInfo
- Publication number
- KR880003744A KR880003744A KR870010115A KR870010115A KR880003744A KR 880003744 A KR880003744 A KR 880003744A KR 870010115 A KR870010115 A KR 870010115A KR 870010115 A KR870010115 A KR 870010115A KR 880003744 A KR880003744 A KR 880003744A
- Authority
- KR
- South Korea
- Prior art keywords
- liquid
- substrate
- film
- centipoise
- photopolymerizable
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims 20
- 238000000034 method Methods 0.000 title claims 20
- 239000000758 substrate Substances 0.000 title claims 11
- 238000010030 laminating Methods 0.000 title claims 2
- 150000001875 compounds Chemical class 0.000 claims 3
- 239000004971 Cross linker Substances 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000012644 addition polymerization Methods 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 238000003384 imaging method Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0577—Double layer of resist having the same pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/155—Nonresinous additive to promote interlayer adhesion in element
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Materials For Photolithography (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (19)
- 하기단계(a)-(d)로 이루어진, 기판에 관중합성 필름을 적층하기 위한 방법;(a) 표준 대기압상태에서 100℃이상의 비점을 갖고 부가 중합화에 의해 고급중합체를 형성할 수 있는 적어도 하나의 에틸렌형기를 함유하고 근본적으로 적어도 하나의 비가스성인 에틸렌형으로 불포화된 화합물로 구성되며 화학선 방사에 본질적으로 비감광성인 액체를 기판 표면이나 미리 형성된 비액체의 광중합성 필름 표면에 적용시키는 단계;(b) 적용된 액체를 통하여 적층도중에 초과한 양의 액체가 존재하여 적층된 기판 및 필름의 적어도 하나의 가장자리를 따라 나오게 되고 액체를 통하여 필름에 기판의 부착이 이루어지는 기판 및 미리형성된 비액체의 광중합성 필름을 적층하는 단계;(c) 상형성을 위해 광중합성 필름 및 액체를 화학선 방사에 노출시키는 단계;(d) 광중합성 필름 및 액체의 노출되지 않은 영역을 기판으로부터 제거시키는 단계.
- 제1항에 있어서, 기판이 도드라진 릴리이프인 방법.
- 제2항에 있어서, 액체의 점도가 400 센티포이즈 보다 크지 않은 방법.
- 제1항에 있어서, 액체의 점도가 200 센티포이즈 보다 크지 않은 방법.
- 제4항에 있어서, 액체의 점도 범위가 5 내지 50 센티포이즈인 방법.
- 제1항에 있어서, 15분 보다 짧은 유지시간이 단계(c) 및 (d) 사이에 존재하는 방법.
- 제1항에 있어서, 기판이 다수의 호울을 갖는 방법.
- 제1항에 있어서, 초과한 양의 액체가 상기한 (b) 및 (c) 단계에서 제거되는 방법.
- 제8항에 있어서, 다른 액체의 분무가 이 액체를 제거하는 데 사용되는 방법.
- 제8항에 있어서, 다른 액체가 친수성인 방법.
- 제8항에 있어서, 다른 액체가 물로 이루어진 방법.
- 제1항에 있어서, 기판이 본질적으로 평평한 방법.
- 제1항에 있어서, 액체의 본질적으로 열가교결합체가 없는 방법.
- 제1항에 있어서, 액체가 열가교결합체를 함유하는 방법.
- 제1항에 있어서, 광중합성 필름이 납땜 마스크이고 (d) 단계에 이어 기판의 일부분을 노출시키고 노출된 필름을 용융된 납땜과 접촉시키는 방법.
- 제1항에 있어서, 화합물이 적어도 하나의 에틸렌형 말단기를 갖고 있는 방법.
- 제15항에 있어서, 화합물이 적어도 두개의 에틸렌형 말단기를 갖고 있는 방법.
- 제1항에 있어서, 적어도 두 액체층이 (a) 단계에 적용되는 방법.
- 제1항에 있어서, 액체가 (a) 단계에서 기판 표면 및 필름 표면에 적용되는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/906,442 US4698294A (en) | 1986-09-12 | 1986-09-12 | Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer |
US906442 | 1986-09-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR880003744A true KR880003744A (ko) | 1988-05-30 |
Family
ID=25422456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR870010115A KR880003744A (ko) | 1986-09-12 | 1987-09-11 | 비감광성 중간 액체층을 사용하여 기판상에서 광중합성 필름을 적층하는 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4698294A (ko) |
EP (1) | EP0260590B1 (ko) |
JP (1) | JPS6374051A (ko) |
KR (1) | KR880003744A (ko) |
CN (1) | CN1029426C (ko) |
BR (1) | BR8704705A (ko) |
DE (1) | DE3788479T2 (ko) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5736424A (en) * | 1987-02-27 | 1998-04-07 | Lucent Technologies Inc. | Device fabrication involving planarization |
DE3808952A1 (de) * | 1988-03-17 | 1989-10-05 | Basf Ag | Lichtempfindliche, photopolymerisierbare druckplatte |
JPH0234984A (ja) * | 1988-04-13 | 1990-02-05 | Mitsubishi Electric Corp | プリント回路基板の製造方法 |
US4976817A (en) * | 1988-12-09 | 1990-12-11 | Morton International, Inc. | Wet lamination process and apparatus |
EP0374809A3 (en) * | 1988-12-23 | 1991-11-13 | E.I. Du Pont De Nemours And Company | Bubble free film/liquid solder mask-coated printed circuit boards by fluid pressurizing |
JPH0651360B2 (ja) * | 1989-06-04 | 1994-07-06 | ソマール株式会社 | 薄膜の張付方法及びその装置 |
US5145717A (en) * | 1990-01-31 | 1992-09-08 | E. I. Du Pont De Nemours And Company | Stripping method for removing resist from a printed circuit board |
JPH0484136A (ja) * | 1990-07-27 | 1992-03-17 | Mitsubishi Rayon Co Ltd | パターン形成方法 |
US5240817A (en) * | 1991-12-20 | 1993-08-31 | E. I. Du Pont De Nemours And Company | Lamination of a photopolymerizable solder mask layer to a substate containing holes using an intermediate photopolymerizable liquid layer |
US5288589A (en) * | 1992-12-03 | 1994-02-22 | Mckeever Mark R | Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits |
US5405731A (en) * | 1992-12-22 | 1995-04-11 | E. I. Du Pont De Nemours And Company | Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits |
US5372670A (en) * | 1994-02-02 | 1994-12-13 | International Business Machines Corporation | System for wet application of a dry film to a panel |
US5922506A (en) * | 1994-10-20 | 1999-07-13 | Agfa-Gevaert, N.V. | Imaging element comprising a hydrophobic photopolymerizable composition and method for producing lithographic plates therewith |
EP0708373B1 (en) * | 1994-10-20 | 1999-07-07 | Agfa-Gevaert N.V. | Imaging element comprising a hydrophobic photopolymerizable composition and method for producing lithographic plates therewith |
US6001893A (en) * | 1996-05-17 | 1999-12-14 | Datacard Corporation | Curable topcoat composition and methods for use |
GB2324729B (en) * | 1997-04-30 | 2002-01-02 | Bradford Hospitals Nhs Trust | Lung treatment device |
US6261941B1 (en) * | 1998-02-12 | 2001-07-17 | Georgia Tech Research Corp. | Method for manufacturing a multilayer wiring substrate |
US6002322A (en) * | 1998-05-05 | 1999-12-14 | Littelfuse, Inc. | Chip protector surface-mounted fuse device |
DE10260235B4 (de) * | 2002-12-20 | 2010-10-28 | Infineon Technologies Ag | Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht |
JP4707709B2 (ja) | 2004-03-05 | 2011-06-22 | リッテルフューズ,インコーポレイティド | 薄型の自動車用ヒューズ |
CN101430507A (zh) * | 2007-08-27 | 2009-05-13 | E.I.内穆尔杜邦公司 | 基片上的可光聚合干膜的湿层叠以及与湿层叠有关的组合物 |
US20090087774A1 (en) * | 2007-08-27 | 2009-04-02 | E.I. Du Pont De Nemours And Company | Compositions and methods for wet lamination of photopolymerizable dry films onto substrates |
US8077007B2 (en) | 2008-01-14 | 2011-12-13 | Littlelfuse, Inc. | Blade fuse |
GB201207417D0 (en) | 2012-04-27 | 2012-06-13 | Electra Polymers Ltd | A method for photoimaging a substrate |
JP6397245B2 (ja) * | 2014-07-23 | 2018-09-26 | 旭化成株式会社 | レジストパターンの製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL101499C (ko) * | 1951-08-20 | |||
FR1345015A (fr) * | 1961-10-16 | 1963-12-06 | Du Pont | éléments photopolymérisables et procédé de préparation |
US3629036A (en) * | 1969-02-14 | 1971-12-21 | Shipley Co | The method coating of photoresist on circuit boards |
JPS4935448B1 (ko) * | 1969-05-08 | 1974-09-21 | ||
JPS532362B2 (ko) * | 1974-04-17 | 1978-01-27 | ||
JPS6016997B2 (ja) * | 1976-10-27 | 1985-04-30 | 日本ペイント株式会社 | 感光性フレキソ版とゴムバツキング材の接着方法 |
US4069076A (en) * | 1976-11-29 | 1978-01-17 | E. I. Du Pont De Nemours And Company | Liquid lamination process |
US4506004A (en) * | 1982-04-01 | 1985-03-19 | Sullivan Donald F | Printed wiring board |
US4293635A (en) * | 1980-05-27 | 1981-10-06 | E. I. Du Pont De Nemours And Company | Photopolymerizable composition with polymeric binder |
BR8103187A (pt) * | 1980-05-27 | 1982-02-09 | Du Pont | Processo para laminar uma camada fotossensivel de absorcao |
BR8103184A (pt) * | 1980-05-27 | 1982-02-09 | Du Pont | Processo para laminacao de uma camada foto-sensivel suportada para a forma de uma superficie de substrato limpa |
US4522903A (en) * | 1982-06-11 | 1985-06-11 | E. I. Du Pont De Nemours And Company | Sequential automatic registration and imagewise exposure of a sheet substrate |
-
1986
- 1986-09-12 US US06/906,442 patent/US4698294A/en not_active Expired - Lifetime
-
1987
- 1987-09-09 EP EP87113177A patent/EP0260590B1/en not_active Expired - Lifetime
- 1987-09-09 DE DE3788479T patent/DE3788479T2/de not_active Expired - Lifetime
- 1987-09-10 BR BR8704705A patent/BR8704705A/pt unknown
- 1987-09-11 JP JP62226748A patent/JPS6374051A/ja active Pending
- 1987-09-11 KR KR870010115A patent/KR880003744A/ko not_active Application Discontinuation
- 1987-09-12 CN CN87106837A patent/CN1029426C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0260590A2 (en) | 1988-03-23 |
DE3788479D1 (de) | 1994-01-27 |
DE3788479T2 (de) | 1994-06-23 |
CN87106837A (zh) | 1988-06-01 |
BR8704705A (pt) | 1988-04-26 |
CN1029426C (zh) | 1995-08-02 |
US4698294A (en) | 1987-10-06 |
JPS6374051A (ja) | 1988-04-04 |
EP0260590B1 (en) | 1993-12-15 |
EP0260590A3 (en) | 1989-11-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR880003744A (ko) | 비감광성 중간 액체층을 사용하여 기판상에서 광중합성 필름을 적층하는 방법 | |
DE2752900C2 (de) | Verfahren zum Aufbringen eines trockenen Photoresistfilms auf ein Substrat | |
JPS57172736A (en) | Multilayer photoresist processing | |
KR890016892A (ko) | 프린트회로기판의 제조방법 | |
KR940015693A (ko) | 인쇄 회로용 수처리성, 다층, 광영상성 내구성 코팅 | |
IL42978A (en) | The manufacture of printed multi-layer circuits | |
ATE37240T1 (de) | Herstellung von beugungsgittern. | |
KR880004347A (ko) | 감광성 중간 액체층을 사용하여 기판상에서 광중 합성 필름을 적층하는 방법 | |
US4288282A (en) | Method for producing a metallic pattern upon a substrate | |
ATE131340T1 (de) | Laminierung einer photopolymerisierbaren lötstopmasken-schicht auf ein löcher enthaltendes substrat unter verwendung einer zwischenschicht aus einer photopolymerisierbaren flüssigkeit. | |
CA2502254A1 (en) | Photosensitive resin printing plate precursor, method for producing the same, and method for producing letterpress printing plate using the same | |
KR840006728A (ko) | 집적회로 제조방법 | |
KR880004350A (ko) | 에폭시드 수지에 근거한 열저항 형성층의 제조방법 | |
US4353952A (en) | Transparent digitizer platen | |
KR870000177A (ko) | 열저항 구조층의 제조방법 | |
KR880004351A (ko) | 열저항형성층의 제조방법 | |
KR880001185A (ko) | 인쇄회로 기판에 명칭을 제공하는 방법. | |
KR910012803A (ko) | 유체 가압에 의해 기포가 없는 필름/액체 솔더 마스크-도포된 인쇄 회로판 | |
GB1275471A (en) | Improvements relating to photo-resists | |
ATE18471T1 (de) | Laminierverfahren. | |
JPS5541721A (en) | Carrier tape for semiconductor device | |
GB2019023A (en) | Letterpress Printing Plate With a Fibrous Substrate | |
JPS61256686A (ja) | 導電性回路基板およびその製造方法 | |
JPS62117342A (ja) | 多層配線構造の形成方法 | |
JPS57136646A (en) | Positive type photoresist developing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |